DE69714106T2 - Resistzusammenzetzungen zum Metallabscheiden - Google Patents
Resistzusammenzetzungen zum MetallabscheidenInfo
- Publication number
- DE69714106T2 DE69714106T2 DE69714106T DE69714106T DE69714106T2 DE 69714106 T2 DE69714106 T2 DE 69714106T2 DE 69714106 T DE69714106 T DE 69714106T DE 69714106 T DE69714106 T DE 69714106T DE 69714106 T2 DE69714106 T2 DE 69714106T2
- Authority
- DE
- Germany
- Prior art keywords
- metal deposition
- resist compositions
- resist
- compositions
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8580296A JPH09244241A (ja) | 1996-03-13 | 1996-03-13 | めっきレジスト組成物及びプリント配線板 |
JP23985596A JPH1062987A (ja) | 1996-08-21 | 1996-08-21 | めっきレジスト組成物およびプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69714106D1 DE69714106D1 (de) | 2002-08-29 |
DE69714106T2 true DE69714106T2 (de) | 2003-01-23 |
Family
ID=26426810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69714106T Expired - Lifetime DE69714106T2 (de) | 1996-03-13 | 1997-03-10 | Resistzusammenzetzungen zum Metallabscheiden |
Country Status (5)
Country | Link |
---|---|
US (1) | US6010823A (de) |
EP (1) | EP0795788B1 (de) |
DE (1) | DE69714106T2 (de) |
MY (1) | MY126796A (de) |
SG (1) | SG96170A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6583198B2 (en) | 1997-11-28 | 2003-06-24 | Hitachi Chemical Company, Ltd. | Photo curable resin composition and photosensitive element |
WO2001095030A2 (en) * | 2000-06-09 | 2001-12-13 | Dsm N.V. | Resin composition and three-dimensional object |
US6713535B2 (en) * | 2002-02-28 | 2004-03-30 | Turbine Controls, Inc. | Low-friction chromate-free coating of epoxy resins and sulfonyldianiline |
US20060068207A1 (en) * | 2004-09-28 | 2006-03-30 | Brewer Science Inc., A Missouri Corporation | Curable high refractive index resins for optoelectronic applications |
KR20100094475A (ko) * | 2007-10-26 | 2010-08-26 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 격납된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5790072A (en) * | 1980-11-25 | 1982-06-04 | Hitachi Ltd | Resist ink composition for chemical plating |
JPS6159447A (ja) * | 1984-08-31 | 1986-03-26 | Sony Corp | 感光性樹脂組成物 |
JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
JPS62165904A (ja) * | 1986-01-17 | 1987-07-22 | 日本化成株式会社 | フイルムコンデンサ被覆用樹脂組成物 |
JPS63286841A (ja) * | 1987-05-19 | 1988-11-24 | Hitachi Chem Co Ltd | 感光性樹脂組成物溶液 |
JPH0268A (ja) * | 1987-11-13 | 1990-01-05 | Toshiba Corp | ソルダ−レジスト組成物 |
JPH01266534A (ja) * | 1988-04-18 | 1989-10-24 | Sekisui Chem Co Ltd | 光及び熱硬化性組成物 |
JPH0823694B2 (ja) * | 1988-08-04 | 1996-03-06 | 富士写真フイルム株式会社 | 液状感光性樹脂組成物 |
JP2770252B2 (ja) * | 1991-12-11 | 1998-06-25 | 日本石油株式会社 | エポキシ樹脂組成物、封止材用エポキシ樹脂組成物、積層板用エポキシ樹脂組成物及びソルダーレジスト用エポキシ樹脂組成物 |
JP3073094B2 (ja) * | 1992-03-28 | 2000-08-07 | サンノプコ株式会社 | 感光性樹脂組成物 |
JP3115449B2 (ja) * | 1993-05-07 | 2000-12-04 | イビデン株式会社 | 配線板用めっきレジスト組成物およびプリント配線板 |
JPH08239640A (ja) * | 1995-02-28 | 1996-09-17 | Ibiden Co Ltd | 無電解めっき用接着剤の調製方法および無電解めっき用接着剤 |
US5677398A (en) * | 1995-04-13 | 1997-10-14 | Mitsui Toatsu Chemicals, Inc. | Epoxy acrylate resins and their uses |
-
1997
- 1997-03-10 EP EP97301577A patent/EP0795788B1/de not_active Expired - Lifetime
- 1997-03-10 DE DE69714106T patent/DE69714106T2/de not_active Expired - Lifetime
- 1997-03-10 US US08/813,985 patent/US6010823A/en not_active Expired - Lifetime
- 1997-03-11 MY MYPI97001008A patent/MY126796A/en unknown
- 1997-03-12 SG SG9700714A patent/SG96170A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0795788A1 (de) | 1997-09-17 |
EP0795788B1 (de) | 2002-07-24 |
US6010823A (en) | 2000-01-04 |
SG96170A1 (en) | 2003-05-23 |
DE69714106D1 (de) | 2002-08-29 |
MY126796A (en) | 2006-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |