US6189414B1
(en)
*
|
1995-12-19 |
2001-02-20 |
Yoshizawa Industry Inc. |
Counter plate and cutting die for die cutting machine
|
US5720894A
(en)
*
|
1996-01-11 |
1998-02-24 |
The Regents Of The University Of California |
Ultrashort pulse high repetition rate laser system for biological tissue processing
|
US6555449B1
(en)
|
1996-05-28 |
2003-04-29 |
Trustees Of Columbia University In The City Of New York |
Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
|
US5736709A
(en)
*
|
1996-08-12 |
1998-04-07 |
Armco Inc. |
Descaling metal with a laser having a very short pulse width and high average power
|
US6303901B1
(en)
*
|
1997-05-20 |
2001-10-16 |
The Regents Of The University Of California |
Method to reduce damage to backing plate
|
US6300594B1
(en)
|
1998-02-19 |
2001-10-09 |
Ricoh Microelectronics Company, Ltd. |
Method and apparatus for machining an electrically conductive film
|
ES2143962B1
(es)
*
|
1998-07-14 |
2000-12-01 |
Consejo Superior Investigacion |
Procedimiento de limpieza de superficies metalicas con laser.
|
US6555781B2
(en)
*
|
1999-05-10 |
2003-04-29 |
Nanyang Technological University |
Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
|
BE1012686A3
(fr)
*
|
1999-05-26 |
2001-02-06 |
Wallonia Space Logistics En Ab |
Procede et dispositif de decapage du bois.
|
US6326861B1
(en)
*
|
1999-07-16 |
2001-12-04 |
Feltech Corporation |
Method for generating a train of fast electrical pulses and application to the acceleration of particles
|
US6472295B1
(en)
|
1999-08-27 |
2002-10-29 |
Jmar Research, Inc. |
Method and apparatus for laser ablation of a target material
|
US7112545B1
(en)
|
1999-09-10 |
2006-09-26 |
The Board Of Trustees Of The University Of Arkansas |
Passivation of material using ultra-fast pulsed laser
|
AU7366800A
(en)
*
|
1999-09-10 |
2001-04-10 |
Board Of Trustees Of The University Of Arkansas, The |
Passivation of material using ultra-fast pulsed laser
|
JP4514861B2
(ja)
*
|
1999-11-29 |
2010-07-28 |
株式会社半導体エネルギー研究所 |
レーザ照射装置およびレーザ照射方法および半導体装置の作製方法
|
SG86451A1
(en)
|
1999-11-30 |
2002-02-19 |
Canon Kk |
Laser etching method and apparatus therefor
|
US6627846B1
(en)
*
|
1999-12-16 |
2003-09-30 |
Oramir Semiconductor Equipment Ltd. |
Laser-driven cleaning using reactive gases
|
US7723642B2
(en)
*
|
1999-12-28 |
2010-05-25 |
Gsi Group Corporation |
Laser-based system for memory link processing with picosecond lasers
|
US7500298B2
(en)
*
|
2000-02-14 |
2009-03-10 |
Sadler Love & Associates, Inc. |
Blast head for loosening or removing scale on a metal surface
|
US6854169B2
(en)
|
2000-02-14 |
2005-02-15 |
Sadler Love & Associates, Inc. |
Method for the descaling of metal
|
US20050198794A1
(en)
*
|
2000-02-14 |
2005-09-15 |
Sadler Love & Associates, Inc. |
Apparatus for the descaling of metal
|
US6830993B1
(en)
|
2000-03-21 |
2004-12-14 |
The Trustees Of Columbia University In The City Of New York |
Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
|
US6560248B1
(en)
|
2000-06-08 |
2003-05-06 |
Mania Barco Nv |
System, method and article of manufacture for improved laser direct imaging a printed circuit board utilizing a mode locked laser and scophony operation
|
JP4659300B2
(ja)
|
2000-09-13 |
2011-03-30 |
浜松ホトニクス株式会社 |
レーザ加工方法及び半導体チップの製造方法
|
EP1342299A2
(de)
*
|
2000-09-22 |
2003-09-10 |
Vermont Photonics |
Vorrichtungen und verfahren zur erzeugung kohärenter elektromagnetischer laserstrahlung
|
MXPA02005590A
(es)
|
2000-10-10 |
2002-09-30 |
Univ Columbia |
Metodo y aparato para procesar capas de metal delgadas.
|
IL152920A0
(en)
*
|
2001-03-23 |
2003-06-24 |
Vermont Photonics |
Applying far infrared radiation to biological matter
|
US7009140B2
(en)
*
|
2001-04-18 |
2006-03-07 |
Cymer, Inc. |
Laser thin film poly-silicon annealing optical system
|
DE10125206B4
(de)
*
|
2001-05-14 |
2005-03-10 |
Forschungsverbund Berlin Ev |
Verfahren zur direkten Mikrostrukturierung von Materialien
|
GB0127410D0
(en)
*
|
2001-11-15 |
2002-01-09 |
Renishaw Plc |
Laser substrate treatment
|
GB0201101D0
(en)
|
2002-01-18 |
2002-03-06 |
Renishaw Plc |
Laser marking
|
AU2003244399A1
(en)
*
|
2002-02-01 |
2003-09-02 |
Samuel W. Bross |
Method and apparatus for cleaning with electromagnetic radiation
|
ATE534142T1
(de)
|
2002-03-12 |
2011-12-15 |
Hamamatsu Photonics Kk |
Verfahren zum auftrennen eines substrats
|
FR2837733B1
(fr)
*
|
2002-03-28 |
2005-01-14 |
Centre Nat Etd Spatiales |
Procede et dispositif d'ablation d'une couche de couverture recouvrant une surface a mettre a nu
|
JP3559827B2
(ja)
*
|
2002-05-24 |
2004-09-02 |
独立行政法人理化学研究所 |
透明材料内部の処理方法およびその装置
|
CN100459041C
(zh)
|
2002-08-19 |
2009-02-04 |
纽约市哥伦比亚大学托管会 |
激光结晶处理薄膜样品以最小化边缘区域的方法和系统
|
TWI331803B
(en)
*
|
2002-08-19 |
2010-10-11 |
Univ Columbia |
A single-shot semiconductor processing system and method having various irradiation patterns
|
GB0222342D0
(en)
*
|
2002-09-26 |
2002-11-06 |
British Nuclear Fuels Plc |
Surface treatment of concrete
|
US20050035096A1
(en)
*
|
2002-10-17 |
2005-02-17 |
Kilburn Chris A. |
Method and apparatus for cleaning generator, turbine and boiler components
|
US6759627B2
(en)
*
|
2002-10-17 |
2004-07-06 |
Chris A. Kilburn |
Method and apparatus for cleaning generator and turbine components
|
WO2004075263A2
(en)
*
|
2003-02-19 |
2004-09-02 |
The Trustees Of Columbia University In The City Of New York |
System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
|
US7361171B2
(en)
|
2003-05-20 |
2008-04-22 |
Raydiance, Inc. |
Man-portable optical ablation system
|
US20040231682A1
(en)
*
|
2003-05-20 |
2004-11-25 |
Richard Stoltz |
Scanned small spot ablation with a high-rep-rate
|
US9022037B2
(en)
|
2003-08-11 |
2015-05-05 |
Raydiance, Inc. |
Laser ablation method and apparatus having a feedback loop and control unit
|
US8173929B1
(en)
|
2003-08-11 |
2012-05-08 |
Raydiance, Inc. |
Methods and systems for trimming circuits
|
US8921733B2
(en)
|
2003-08-11 |
2014-12-30 |
Raydiance, Inc. |
Methods and systems for trimming circuits
|
WO2005029549A2
(en)
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
Method and system for facilitating bi-directional growth
|
WO2005029546A2
(en)
*
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
|
WO2005029551A2
(en)
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
|
WO2005029547A2
(en)
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
Enhancing the width of polycrystalline grains with mask
|
US20050115939A1
(en)
*
|
2003-12-01 |
2005-06-02 |
Laser Fare, Inc. |
Method and apparatus for drilling a large number of precision holes with a laser
|
EP1598121A3
(de)
*
|
2004-05-18 |
2007-02-14 |
Airbus Deutschland GmbH |
Lasergestütztes Entschichtungsverfahren
|
DE102004027229B4
(de)
*
|
2004-06-03 |
2007-01-04 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Verfahren zum Schweißen von Werkstücken aus Aluminium oder einer Aluminiumlegierung
|
JP2006061966A
(ja)
*
|
2004-08-30 |
2006-03-09 |
Japan Atom Energy Res Inst |
fs(フェムト秒)域極短パルスkW級高平均出力レーザーを用いて鋼鉄及びステンレス鋼を含む合金鋼鉄の冷間加工に伴う応力腐食割れを防止する方法
|
US20060189091A1
(en)
*
|
2004-11-11 |
2006-08-24 |
Bo Gu |
Method and system for laser hard marking
|
US7526003B2
(en)
*
|
2004-12-08 |
2009-04-28 |
Polaronyx, Inc. |
Nonlinear polarization pulse shaping mode locked fiber laser at one micron
|
US7211763B2
(en)
*
|
2004-12-22 |
2007-05-01 |
General Electric Company |
Photon energy material processing using liquid core waveguide and a computer program for controlling the same
|
US7477666B2
(en)
*
|
2005-04-06 |
2009-01-13 |
Polar Onyx, Inc. |
All fiber based short pulse amplification at one micron
|
FR2887161B1
(fr)
*
|
2005-06-20 |
2007-09-07 |
Commissariat Energie Atomique |
Procede et dispositif d'ablation laser d'une couche superficielle d'une paroi, telle q'un revetement de peinture dans une installation nucleaire
|
CH698238B1
(de)
*
|
2005-07-07 |
2009-06-30 |
Main Man Inspiration Ag |
Vorrichtung zur kontinuierlichen Oberflächenreinigung einer drehbeweglichen Giessrolle einer Bandgiessmaschine.
|
EP1910013A2
(de)
*
|
2005-07-13 |
2008-04-16 |
Picodeon Ltd OY |
Strahlungsanordnung
|
US8135050B1
(en)
|
2005-07-19 |
2012-03-13 |
Raydiance, Inc. |
Automated polarization correction
|
WO2007014662A1
(en)
*
|
2005-08-02 |
2007-02-08 |
Carl Zeiss Laser Optics Gmbh |
Optical system for creating a line focus scanning system using such optical system and method for laser processing of a substrate
|
DE202005015719U1
(de)
*
|
2005-10-07 |
2005-12-08 |
Trumpf Laser Gmbh + Co. Kg |
F/theta-Objektiv und Scannervorrichtung damit
|
US20070116889A1
(en)
*
|
2005-11-18 |
2007-05-24 |
Federal Mogul World Wide, Inc. |
Laser treatment of metal
|
US8189971B1
(en)
|
2006-01-23 |
2012-05-29 |
Raydiance, Inc. |
Dispersion compensation in a chirped pulse amplification system
|
US7444049B1
(en)
|
2006-01-23 |
2008-10-28 |
Raydiance, Inc. |
Pulse stretcher and compressor including a multi-pass Bragg grating
|
US8232687B2
(en)
|
2006-04-26 |
2012-07-31 |
Raydiance, Inc. |
Intelligent laser interlock system
|
FI20060181L
(fi)
*
|
2006-02-23 |
2007-08-24 |
Picodeon Ltd Oy |
Menetelmä tuottaa pintoja ja materiaalia laserablaation avulla
|
FI20061165L
(fi)
*
|
2006-02-23 |
2007-08-24 |
Picodeon Ltd Oy |
Kylmätyöstö
|
WO2007096483A2
(en)
*
|
2006-02-23 |
2007-08-30 |
Picodeon Ltd Oy |
Coating on a stone or ceramic substrate and a coated stone or ceramic product
|
RU2467851C2
(ru)
*
|
2006-02-23 |
2012-11-27 |
Пикодеон Лтд Ой |
Солнечный элемент и способ и система для его изготовления
|
US20090176034A1
(en)
*
|
2006-02-23 |
2009-07-09 |
Picodeon Ltd. Oy |
Surface Treatment Technique and Surface Treatment Apparatus Associated With Ablation Technology
|
FI20060177L
(fi)
*
|
2006-02-23 |
2007-08-24 |
Picodeon Ltd Oy |
Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
|
US7822347B1
(en)
|
2006-03-28 |
2010-10-26 |
Raydiance, Inc. |
Active tuning of temporal dispersion in an ultrashort pulse laser system
|
JP4249206B2
(ja)
*
|
2006-05-19 |
2009-04-02 |
石川ガスケット株式会社 |
ステンレス材料の表面処理方法及びメタルガスケットの製造方法
|
US20080146935A1
(en)
*
|
2006-10-13 |
2008-06-19 |
Sen-Yung Liu |
Auxiliary Positioning Device For Ultrasonic Apparatus
|
DE102007020748A1
(de)
*
|
2007-05-03 |
2008-11-13 |
Clean-Lasersysteme Gmbh |
Vorrichtung und Verfahren zum Bearbeiten einer Oberfläche eines Werkstücks mittels Laserstrahlung
|
DE102007036262A1
(de)
*
|
2007-08-02 |
2009-02-05 |
Robert Bosch Gmbh |
Radarsensor für Kraftfahrzeuge
|
JP5385289B2
(ja)
*
|
2007-09-25 |
2014-01-08 |
ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク |
横方向に結晶化した薄膜上に作製される薄膜トランジスタデバイスにおいて高い均一性を生成する方法
|
CN103354204A
(zh)
|
2007-11-21 |
2013-10-16 |
纽约市哥伦比亚大学理事会 |
用于制备外延纹理厚膜的系统和方法
|
WO2009067688A1
(en)
|
2007-11-21 |
2009-05-28 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for preparing epitaxially textured polycrystalline films
|
DE102008006241A1
(de)
*
|
2008-01-25 |
2009-07-30 |
Thyssenkrupp Steel Ag |
Verfahren und Vorrichtung zum Abtragen einer metallischen Beschichtung
|
TW200934603A
(en)
*
|
2008-02-01 |
2009-08-16 |
Contrel Technology Co Ltd |
Jetting type laser processing machine
|
US20090205675A1
(en)
*
|
2008-02-18 |
2009-08-20 |
Diptabhas Sarkar |
Methods and Systems for Using a Laser to Clean Hydrocarbon Transfer Conduits
|
WO2009124180A2
(en)
*
|
2008-04-02 |
2009-10-08 |
The Trustees Of Columbia University In The City Of New York |
In situ plating and soldering of materials covered with a surface film
|
FR2929549B1
(fr)
*
|
2008-04-08 |
2012-04-20 |
Monnier Marc Le |
Procede de fabrication d'une structure alveolaire,structure alveolaire et installation correspondantes
|
US8505414B2
(en)
*
|
2008-06-23 |
2013-08-13 |
Stanley Black & Decker, Inc. |
Method of manufacturing a blade
|
CN101332541B
(zh)
*
|
2008-08-06 |
2011-09-07 |
中国航空工业第一集团公司北京航空制造工程研究所 |
一种金属表面的短脉冲激光清洗方法
|
US8125704B2
(en)
|
2008-08-18 |
2012-02-28 |
Raydiance, Inc. |
Systems and methods for controlling a pulsed laser by combining laser signals
|
DE102009013516A1
(de)
*
|
2009-03-19 |
2010-09-23 |
Isa-Engineering Gmbh & Co. Kg |
Vorrichtung und Verfahren zum Bearbeiten einer mit temperaturempfindlichen Schadstoffen belasteten Oberfläche
|
DE102009050859A1
(de)
*
|
2009-10-27 |
2011-04-28 |
Ima Klessmann Gmbh Holzbearbeitungssysteme |
Vorrichtung und Verfahren zur Bekantung von Werkstücken
|
DE102009050858A1
(de)
*
|
2009-10-27 |
2011-04-28 |
Ima Klessmann Gmbh Holzbearbeitungssysteme |
Vorrichtung und Verfahren zur Bekantung von Werkstücken
|
HUE045671T2
(hu)
*
|
2009-12-23 |
2020-01-28 |
Xyrec Ip B V |
Sokszöges lézerpásztázó bevonat-eltávolításra
|
US9061375B2
(en)
*
|
2009-12-23 |
2015-06-23 |
General Electric Company |
Methods for treating superalloy articles, and related repair processes
|
CN101775570B
(zh)
*
|
2010-02-09 |
2013-10-23 |
江苏大学 |
一种激光氧化着色制备大面积高性能彩色不锈钢的方法
|
WO2011163302A1
(en)
*
|
2010-06-23 |
2011-12-29 |
Seidel, Inc |
Process for selectively removing a coating layer
|
FI20100276A
(fi)
*
|
2010-07-20 |
2012-01-21 |
Outokumpu Oy |
Menetelmä hapettuman poistamiseksi metallikappaleen pinnalta
|
WO2012021748A1
(en)
|
2010-08-12 |
2012-02-16 |
Raydiance, Inc. |
Polymer tubing laser micromachining
|
US8769833B2
(en)
|
2010-09-10 |
2014-07-08 |
Stanley Black & Decker, Inc. |
Utility knife blade
|
KR20140018183A
(ko)
|
2010-09-16 |
2014-02-12 |
레이디안스, 아이엔씨. |
적층 재료의 레이저 기반 처리
|
DE102010049428A1
(de)
*
|
2010-10-23 |
2012-04-26 |
Volkswagen Ag |
Laserschneiden eines Elektrobandmaterials
|
FR2969021B1
(fr)
*
|
2010-12-16 |
2014-04-11 |
Commissariat Energie Atomique |
Dispositif de decoupe de structure comprenant des nano-objets filaires et procede associe
|
KR101242953B1
(ko)
*
|
2010-12-27 |
2013-03-12 |
주식회사 포스코 |
도금 방법 및 아연 도금 장치
|
JP5587219B2
(ja)
*
|
2011-01-28 |
2014-09-10 |
サンコール株式会社 |
ステンレス鋼への導電材料の接合方法
|
JP5912264B2
(ja)
*
|
2011-02-28 |
2016-04-27 |
日本発條株式会社 |
レーザー加工方法及び装置
|
TWM417976U
(en)
*
|
2011-07-13 |
2011-12-11 |
Chun-Hao Li |
Laser machining table
|
JP5610356B2
(ja)
*
|
2011-10-25 |
2014-10-22 |
公益財団法人若狭湾エネルギー研究センター |
レーザー除染装置
|
US20140321494A1
(en)
*
|
2012-01-12 |
2014-10-30 |
The Uab Research Foundation |
Middle-infrared volumetric bragg grating based on alkali halide or alkili-earth flouride color center crystals
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
EP2777877A1
(de)
*
|
2013-03-14 |
2014-09-17 |
Siemens VAI Metals Technologies GmbH |
Fertigbearbeitungslinie eines Metallprodukts
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
KR101325871B1
(ko)
*
|
2013-05-13 |
2013-11-05 |
현대하이스코 주식회사 |
핫 스탬핑 부품 용접성 개선방법
|
KR102275466B1
(ko)
*
|
2013-09-25 |
2021-07-13 |
에이에스엠엘 네델란즈 비.브이. |
빔 전달 장치 및 방법
|
JP6211908B2
(ja)
*
|
2013-12-02 |
2017-10-11 |
トヨタ自動車株式会社 |
ホットスタンプ成形品の製造方法
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
US9687936B2
(en)
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
JP6121924B2
(ja)
*
|
2014-02-20 |
2017-04-26 |
株式会社東芝 |
レーザ加工装置及びレーザ加工方法
|
CN106413925A
(zh)
*
|
2014-06-19 |
2017-02-15 |
麦格纳国际公司 |
用于激光辅助动力清洗的方法和设备
|
KR101881708B1
(ko)
*
|
2014-07-03 |
2018-07-24 |
신닛테츠스미킨 카부시키카이샤 |
레이저 가공 장치
|
CN106471141B
(zh)
*
|
2014-07-03 |
2019-02-01 |
新日铁住金株式会社 |
激光加工装置
|
CN106687419A
(zh)
|
2014-07-08 |
2017-05-17 |
康宁股份有限公司 |
用于激光处理材料的方法和设备
|
EP3169477B1
(de)
*
|
2014-07-14 |
2020-01-29 |
Corning Incorporated |
System und verfahren zur verarbeitung transparenter materialien mithilfe von in länge und durchmesser anpassbaren laserstrahlbrennlinien
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
EP3536440A1
(de)
|
2014-07-14 |
2019-09-11 |
Corning Incorporated |
Glasartikel mit einem defektweg
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
CN208586209U
(zh)
|
2014-07-14 |
2019-03-08 |
康宁股份有限公司 |
一种用于在工件中形成限定轮廓的多个缺陷的系统
|
EP2991126B1
(de)
*
|
2014-08-25 |
2016-10-05 |
Theva Dünnschichttechnik GmbH |
Verfahren und Vorrichtung zum Herstellen eines Hochtemperatur-Supraleiters
|
DE102014218595A1
(de)
*
|
2014-09-16 |
2016-03-17 |
Volkswagen Aktiengesellschaft |
Verfahren zum zumindest teilweisen Entfernen einer Mischoxid- bzw. Oxidschicht von einer Oberfläche eines intermetallischen Aluminid und/oder Aluminiumlegierung umfassenden Körpers
|
CN104342714B
(zh)
*
|
2014-10-22 |
2016-08-24 |
河北大学 |
一种去除不锈钢表面氧化皮的方法
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
CN107406293A
(zh)
|
2015-01-12 |
2017-11-28 |
康宁股份有限公司 |
使用多光子吸收方法来对经热回火的基板进行激光切割
|
KR102546692B1
(ko)
|
2015-03-24 |
2023-06-22 |
코닝 인코포레이티드 |
디스플레이 유리 조성물의 레이저 절단 및 가공
|
JP2018516215A
(ja)
|
2015-03-27 |
2018-06-21 |
コーニング インコーポレイテッド |
気体透過性窓、および、その製造方法
|
WO2017011296A1
(en)
|
2015-07-10 |
2017-01-19 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
US10672603B2
(en)
*
|
2015-10-23 |
2020-06-02 |
Infineon Technologies Ag |
System and method for removing dielectric material
|
CN105537774A
(zh)
*
|
2016-02-27 |
2016-05-04 |
北京工业大学 |
一种基于飞秒激光刻蚀的氧化膜去除方法
|
CN105689799B
(zh)
*
|
2016-04-15 |
2018-02-16 |
东莞市俊知自动机械有限公司 |
锯片制造方法
|
CN109311725B
(zh)
|
2016-05-06 |
2022-04-26 |
康宁股份有限公司 |
从透明基材激光切割及移除轮廓形状
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
CN106112269A
(zh)
*
|
2016-06-17 |
2016-11-16 |
吴起正 |
一种激光清除多晶硅还原炉钟罩氧化皮的方法及装置
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
CN106216784A
(zh)
*
|
2016-07-21 |
2016-12-14 |
哈尔滨工业大学 |
一种电化学或电火花/电化学复合加工中未加工表面的保护方法
|
WO2018022476A1
(en)
|
2016-07-29 |
2018-02-01 |
Corning Incorporated |
Apparatuses and methods for laser processing
|
KR102423775B1
(ko)
|
2016-08-30 |
2022-07-22 |
코닝 인코포레이티드 |
투명 재료의 레이저 가공
|
KR102078294B1
(ko)
|
2016-09-30 |
2020-02-17 |
코닝 인코포레이티드 |
비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
|
EP3848333A1
(de)
|
2016-10-24 |
2021-07-14 |
Corning Incorporated |
Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
PL3544760T3
(pl)
*
|
2016-11-23 |
2021-06-14 |
Aperam |
Sposób trawienia laserowego przewijanego produktu metalicznego i instalacja do jego wykonania
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
NL2018518B1
(en)
|
2017-03-15 |
2018-09-24 |
P Laser N V |
Pulsed laser device for cleaning or treating a surface
|
CN107081529A
(zh)
*
|
2017-05-05 |
2017-08-22 |
上海航天设备制造总厂 |
一种用于铝构件表层阳极氧化膜的激光去除方法
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
US11294035B2
(en)
*
|
2017-07-11 |
2022-04-05 |
Nuro, Inc. |
LiDAR system with cylindrical lenses
|
CN107225330A
(zh)
*
|
2017-07-19 |
2017-10-03 |
云南电网有限责任公司电力科学研究院 |
一种高压带电设备激光除锈装置
|
CN111065485B
(zh)
*
|
2017-08-25 |
2022-06-21 |
康宁股份有限公司 |
使用无焦光束调整组件激光加工透明工件的设备和方法
|
CN107813053A
(zh)
*
|
2017-09-26 |
2018-03-20 |
上海航天精密机械研究所 |
铝合金阳极氧化膜层的清除方法
|
CN108015060B
(zh)
*
|
2018-01-02 |
2021-05-14 |
海安能达电气有限公司 |
一种具有保护眼睛和防飞溅的激光除锈机
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
US10759004B2
(en)
|
2018-06-18 |
2020-09-01 |
Raytheon Technologies Corporation |
Laser removal of casting scale
|
AT520637B1
(de)
*
|
2018-07-31 |
2019-06-15 |
Andritz Ag Maschf |
Verfahren zur verbesserung der beschichtbarkeit eines metallbandes
|
US10787892B2
(en)
|
2018-09-19 |
2020-09-29 |
Jefferson Science Associates, Llc |
In situ SRF cavity processing using optical ionization of gases
|
US11090765B2
(en)
|
2018-09-25 |
2021-08-17 |
Saudi Arabian Oil Company |
Laser tool for removing scaling
|
CN109226105B
(zh)
*
|
2018-10-31 |
2024-03-19 |
江苏大学 |
一种高效激光清洗管道内壁的装置
|
DE102018220318A1
(de)
*
|
2018-11-27 |
2020-05-28 |
Sms Group Gmbh |
Verfahren und Vorrichtung zur Inspektion von einem metallischen Gießprodukt
|
DE102018133020A1
(de)
|
2018-12-20 |
2020-06-25 |
Precitec Gmbh & Co. Kg |
Vorrichtung für ein Laserbearbeitungssystem und Laserbearbeitungssystem mit einer derartigen Vorrichtung
|
US11440062B2
(en)
*
|
2019-11-07 |
2022-09-13 |
General Electric Company |
System and method for cleaning a tube
|
CN111389941B
(zh)
*
|
2020-03-04 |
2022-02-18 |
北京航空航天大学合肥创新研究院 |
一种热轧不锈钢表面氧化层的激光清洗方法
|
CN111992891A
(zh)
*
|
2020-08-05 |
2020-11-27 |
武汉锐科光纤激光技术股份有限公司 |
热轧高碳钢表面氧化皮激光清洗装置及方法
|
CN114425659A
(zh)
*
|
2020-10-29 |
2022-05-03 |
大族激光科技产业集团股份有限公司 |
一种激光剥离方法及激光加工设备
|
CN112548345A
(zh)
*
|
2020-11-27 |
2021-03-26 |
一重集团大连工程技术有限公司 |
去除热带钢表面氧化铁皮的方法
|
IT202100002156A1
(it)
|
2021-02-02 |
2022-08-02 |
Brentech Srl |
Macchina semiautomatica per la lavorazione a laser di elementi da lavorare, nonche’ metodo implementato da elaboratore e programma software per il controllo di tale macchina
|
KR102254339B1
(ko)
*
|
2021-02-03 |
2021-05-21 |
주식회사 21세기 |
펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
|
DE102021119195A1
(de)
*
|
2021-07-23 |
2023-01-26 |
Trumpf Laser Gmbh |
Verfahren und Vorrichtung zur Werkstückbearbeitung mit einem, durch eine Scanneroptik geführten, verbreiterten Laserstrahl
|
CA3226234A1
(fr)
|
2021-07-28 |
2023-02-02 |
Ismael Romaric Alexis Guillotte |
Procede et installation de decapage d'une couche d'oxyde d'un produit metallique
|
CN113787060B
(zh)
*
|
2021-09-07 |
2022-11-11 |
高峰 |
钢板表面处理装置及钢板表面处理方法
|
US11897011B2
(en)
|
2022-01-31 |
2024-02-13 |
Saudi Arabian Oil Company |
Hybrid descaling tool and methods
|