DE69711652D1 - Entzundern von Metallen durch einen Laser mit sehr kurzer Pulsbreite und hoher Durchschnittsleistung - Google Patents

Entzundern von Metallen durch einen Laser mit sehr kurzer Pulsbreite und hoher Durchschnittsleistung

Info

Publication number
DE69711652D1
DE69711652D1 DE69711652T DE69711652T DE69711652D1 DE 69711652 D1 DE69711652 D1 DE 69711652D1 DE 69711652 T DE69711652 T DE 69711652T DE 69711652 T DE69711652 T DE 69711652T DE 69711652 D1 DE69711652 D1 DE 69711652D1
Authority
DE
Germany
Prior art keywords
radiation
laser
strip
pulse width
average power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69711652T
Other languages
English (en)
Other versions
DE69711652T2 (de
Inventor
Gary L Neiheisel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Armco Inc
Original Assignee
Armco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ZA9711591A external-priority patent/ZA9711591B/xx
Application filed by Armco Inc filed Critical Armco Inc
Publication of DE69711652D1 publication Critical patent/DE69711652D1/de
Application granted granted Critical
Publication of DE69711652T2 publication Critical patent/DE69711652T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0736Shaping the laser spot into an oval shape, e.g. elliptic shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0738Shaping the laser spot into a linear shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/02Iron or ferrous alloys
    • B23K2103/04Steel or steel alloys
DE69711652T 1996-08-12 1997-12-29 Entzundern von Metallen durch einen Laser mit sehr kurzer Pulsbreite und hoher Durchschnittsleistung Expired - Fee Related DE69711652T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US08/695,930 US5736709A (en) 1996-08-12 1996-08-12 Descaling metal with a laser having a very short pulse width and high average power
CA002225507A CA2225507A1 (en) 1996-08-12 1997-12-22 Descaling metal with a laser having a very short pulse width and high average power
AU49249/97A AU4924997A (en) 1996-08-12 1997-12-23 Descaling metal with a laser having a very short pulse width and high average power
ZA9711591A ZA9711591B (en) 1996-08-12 1997-12-23 Descaling metal with a laser having a very short pulse width and high average power.
EP97122937A EP0927595B1 (de) 1996-08-12 1997-12-29 Entzundern von Metallen durch einen Laser mit sehr kurzer Pulsbreite und hoher Durchschnittsleistung
BR9800348-8A BR9800348A (pt) 1996-08-12 1998-01-16 Remoção de crosta de com laser tendo amplititude de pulso muito curta e uma potência média alta
CN98106412A CN1224644A (zh) 1996-08-12 1998-01-27 用脉冲宽度很短和平均功率高的激光使金属去除氧化皮
JP10068782A JPH11262449A (ja) 1996-08-12 1998-03-18 業務用炊飯装置

Publications (2)

Publication Number Publication Date
DE69711652D1 true DE69711652D1 (de) 2002-05-08
DE69711652T2 DE69711652T2 (de) 2002-11-21

Family

ID=31892410

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69711652T Expired - Fee Related DE69711652T2 (de) 1996-08-12 1997-12-29 Entzundern von Metallen durch einen Laser mit sehr kurzer Pulsbreite und hoher Durchschnittsleistung

Country Status (10)

Country Link
US (2) US5736709A (de)
EP (1) EP0927595B1 (de)
JP (1) JPH11262449A (de)
CN (1) CN1224644A (de)
AT (1) ATE215417T1 (de)
AU (1) AU4924997A (de)
BR (1) BR9800348A (de)
CA (1) CA2225507A1 (de)
DE (1) DE69711652T2 (de)
ES (1) ES2172740T3 (de)

Families Citing this family (189)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189414B1 (en) * 1995-12-19 2001-02-20 Yoshizawa Industry Inc. Counter plate and cutting die for die cutting machine
US5720894A (en) * 1996-01-11 1998-02-24 The Regents Of The University Of California Ultrashort pulse high repetition rate laser system for biological tissue processing
US6555449B1 (en) * 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
US6303901B1 (en) * 1997-05-20 2001-10-16 The Regents Of The University Of California Method to reduce damage to backing plate
US6300594B1 (en) 1998-02-19 2001-10-09 Ricoh Microelectronics Company, Ltd. Method and apparatus for machining an electrically conductive film
ES2143962B1 (es) * 1998-07-14 2000-12-01 Consejo Superior Investigacion Procedimiento de limpieza de superficies metalicas con laser.
US6555781B2 (en) * 1999-05-10 2003-04-29 Nanyang Technological University Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
BE1012686A3 (fr) * 1999-05-26 2001-02-06 Wallonia Space Logistics En Ab Procede et dispositif de decapage du bois.
US6326861B1 (en) * 1999-07-16 2001-12-04 Feltech Corporation Method for generating a train of fast electrical pulses and application to the acceleration of particles
US6472295B1 (en) 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
US7112545B1 (en) 1999-09-10 2006-09-26 The Board Of Trustees Of The University Of Arkansas Passivation of material using ultra-fast pulsed laser
WO2001018852A1 (en) * 1999-09-10 2001-03-15 The Board Of Trustees Of The University Of Arkansas Passivation of material using ultra-fast pulsed laser
JP4514861B2 (ja) * 1999-11-29 2010-07-28 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法および半導体装置の作製方法
US6861364B1 (en) 1999-11-30 2005-03-01 Canon Kabushiki Kaisha Laser etching method and apparatus therefor
US6627846B1 (en) * 1999-12-16 2003-09-30 Oramir Semiconductor Equipment Ltd. Laser-driven cleaning using reactive gases
US7723642B2 (en) * 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US20050198794A1 (en) * 2000-02-14 2005-09-15 Sadler Love & Associates, Inc. Apparatus for the descaling of metal
US6854169B2 (en) 2000-02-14 2005-02-15 Sadler Love & Associates, Inc. Method for the descaling of metal
US7500298B2 (en) * 2000-02-14 2009-03-10 Sadler Love & Associates, Inc. Blast head for loosening or removing scale on a metal surface
US6830993B1 (en) 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
US6560248B1 (en) 2000-06-08 2003-05-06 Mania Barco Nv System, method and article of manufacture for improved laser direct imaging a printed circuit board utilizing a mode locked laser and scophony operation
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
AU2002212974A1 (en) * 2000-09-22 2002-04-02 Vermont Photonics Apparatuses and methods for generating coherent electromagnetic laser radiation
CN1404627A (zh) 2000-10-10 2003-03-19 纽约市哥伦比亚大学托管会 处理薄金属层的方法与设备
AU2002255875A1 (en) * 2001-03-23 2002-10-08 Vermont Photonics Applying far infrared radiation to biological matter
US7009140B2 (en) * 2001-04-18 2006-03-07 Cymer, Inc. Laser thin film poly-silicon annealing optical system
DE10125206B4 (de) * 2001-05-14 2005-03-10 Forschungsverbund Berlin Ev Verfahren zur direkten Mikrostrukturierung von Materialien
GB0127410D0 (en) 2001-11-15 2002-01-09 Renishaw Plc Laser substrate treatment
GB0201101D0 (en) * 2002-01-18 2002-03-06 Renishaw Plc Laser marking
WO2003066245A1 (en) * 2002-02-01 2003-08-14 Metastable Instruments, Inc. Method and apparatus for cleaning with electromagnetic radiation
EP2400539B1 (de) 2002-03-12 2017-07-26 Hamamatsu Photonics K.K. Verfahren zum abtrennen eines substrates
FR2837733B1 (fr) * 2002-03-28 2005-01-14 Centre Nat Etd Spatiales Procede et dispositif d'ablation d'une couche de couverture recouvrant une surface a mettre a nu
JP3559827B2 (ja) * 2002-05-24 2004-09-02 独立行政法人理化学研究所 透明材料内部の処理方法およびその装置
AU2003258289A1 (en) * 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York A single-shot semiconductor processing system and method having various irradiation patterns
JP4873858B2 (ja) 2002-08-19 2012-02-08 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク エッジ領域を最小にするために基板のフィルム領域のレーザ結晶化処理方法及び装置並びにそのようなフィルム領域の構造
GB0222342D0 (en) * 2002-09-26 2002-11-06 British Nuclear Fuels Plc Surface treatment of concrete
US20050035096A1 (en) * 2002-10-17 2005-02-17 Kilburn Chris A. Method and apparatus for cleaning generator, turbine and boiler components
US6759627B2 (en) * 2002-10-17 2004-07-06 Chris A. Kilburn Method and apparatus for cleaning generator and turbine components
WO2004075263A2 (en) * 2003-02-19 2004-09-02 The Trustees Of Columbia University In The City Of New York System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
US20040231682A1 (en) * 2003-05-20 2004-11-25 Richard Stoltz Scanned small spot ablation with a high-rep-rate
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
TWI359441B (en) * 2003-09-16 2012-03-01 Univ Columbia Processes and systems for laser crystallization pr
WO2005029549A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for facilitating bi-directional growth
WO2005029547A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Enhancing the width of polycrystalline grains with mask
WO2005029546A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
US20050115939A1 (en) * 2003-12-01 2005-06-02 Laser Fare, Inc. Method and apparatus for drilling a large number of precision holes with a laser
EP1598121A3 (de) * 2004-05-18 2007-02-14 Airbus Deutschland GmbH Lasergestütztes Entschichtungsverfahren
DE102004027229B4 (de) * 2004-06-03 2007-01-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Schweißen von Werkstücken aus Aluminium oder einer Aluminiumlegierung
JP2006061966A (ja) * 2004-08-30 2006-03-09 Japan Atom Energy Res Inst fs(フェムト秒)域極短パルスkW級高平均出力レーザーを用いて鋼鉄及びステンレス鋼を含む合金鋼鉄の冷間加工に伴う応力腐食割れを防止する方法
US20060189091A1 (en) * 2004-11-11 2006-08-24 Bo Gu Method and system for laser hard marking
US7526003B2 (en) * 2004-12-08 2009-04-28 Polaronyx, Inc. Nonlinear polarization pulse shaping mode locked fiber laser at one micron
US7211763B2 (en) * 2004-12-22 2007-05-01 General Electric Company Photon energy material processing using liquid core waveguide and a computer program for controlling the same
US7477666B2 (en) * 2005-04-06 2009-01-13 Polar Onyx, Inc. All fiber based short pulse amplification at one micron
FR2887161B1 (fr) * 2005-06-20 2007-09-07 Commissariat Energie Atomique Procede et dispositif d'ablation laser d'une couche superficielle d'une paroi, telle q'un revetement de peinture dans une installation nucleaire
CH698238B1 (de) * 2005-07-07 2009-06-30 Main Man Inspiration Ag Vorrichtung zur kontinuierlichen Oberflächenreinigung einer drehbeweglichen Giessrolle einer Bandgiessmaschine.
WO2007006850A2 (en) * 2005-07-13 2007-01-18 Picodeon Ltd Oy Radiation arrangement
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
JP2009503593A (ja) * 2005-08-02 2009-01-29 カール ツァイス レーザー オプティクス ゲーエムベーハー 線焦点を作成する光学システム、この光学システムを用いる走査システム、および基板のレーザ加工方法
DE202005015719U1 (de) * 2005-10-07 2005-12-08 Trumpf Laser Gmbh + Co. Kg F/theta-Objektiv und Scannervorrichtung damit
US20070116889A1 (en) * 2005-11-18 2007-05-24 Federal Mogul World Wide, Inc. Laser treatment of metal
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
KR101398379B1 (ko) * 2006-02-23 2014-05-22 피코데온 리미티드 오와이 반도체 및 반도체를 생산하는 설비 및 방법
FI20060181L (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa pintoja ja materiaalia laserablaation avulla
FI20061165L (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Kylmätyöstö
EP1991388A2 (de) * 2006-02-23 2008-11-19 Picodeon Ltd OY Mit ablationstechnologie verbundene oberflächenbehandlungstechnik und oberflächenbehandlungsvorrichtung
FI20060177L (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
RU2467851C2 (ru) * 2006-02-23 2012-11-27 Пикодеон Лтд Ой Солнечный элемент и способ и система для его изготовления
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
JP4249206B2 (ja) * 2006-05-19 2009-04-02 石川ガスケット株式会社 ステンレス材料の表面処理方法及びメタルガスケットの製造方法
US20080146935A1 (en) * 2006-10-13 2008-06-19 Sen-Yung Liu Auxiliary Positioning Device For Ultrasonic Apparatus
DE102007020748A1 (de) 2007-05-03 2008-11-13 Clean-Lasersysteme Gmbh Vorrichtung und Verfahren zum Bearbeiten einer Oberfläche eines Werkstücks mittels Laserstrahlung
DE102007036262A1 (de) * 2007-08-02 2009-02-05 Robert Bosch Gmbh Radarsensor für Kraftfahrzeuge
TWI418037B (zh) * 2007-09-25 2013-12-01 Univ Columbia 藉由改變形狀、大小或雷射光束在製造於橫向結晶化薄膜上之薄膜電晶體元件中產生高一致性的方法
JP5443377B2 (ja) 2007-11-21 2014-03-19 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク エピタキシャルに配向された厚膜を調製するための調製システムおよび方法
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
DE102008006241A1 (de) * 2008-01-25 2009-07-30 Thyssenkrupp Steel Ag Verfahren und Vorrichtung zum Abtragen einer metallischen Beschichtung
TW200934603A (en) * 2008-02-01 2009-08-16 Contrel Technology Co Ltd Jetting type laser processing machine
US20090205675A1 (en) * 2008-02-18 2009-08-20 Diptabhas Sarkar Methods and Systems for Using a Laser to Clean Hydrocarbon Transfer Conduits
WO2009124180A2 (en) * 2008-04-02 2009-10-08 The Trustees Of Columbia University In The City Of New York In situ plating and soldering of materials covered with a surface film
FR2929549B1 (fr) 2008-04-08 2012-04-20 Monnier Marc Le Procede de fabrication d'une structure alveolaire,structure alveolaire et installation correspondantes
US8505414B2 (en) * 2008-06-23 2013-08-13 Stanley Black & Decker, Inc. Method of manufacturing a blade
CN101332541B (zh) * 2008-08-06 2011-09-07 中国航空工业第一集团公司北京航空制造工程研究所 一种金属表面的短脉冲激光清洗方法
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
DE102009013516A1 (de) * 2009-03-19 2010-09-23 Isa-Engineering Gmbh & Co. Kg Vorrichtung und Verfahren zum Bearbeiten einer mit temperaturempfindlichen Schadstoffen belasteten Oberfläche
DE102009050858A1 (de) * 2009-10-27 2011-04-28 Ima Klessmann Gmbh Holzbearbeitungssysteme Vorrichtung und Verfahren zur Bekantung von Werkstücken
DE102009050859A1 (de) * 2009-10-27 2011-04-28 Ima Klessmann Gmbh Holzbearbeitungssysteme Vorrichtung und Verfahren zur Bekantung von Werkstücken
US9061375B2 (en) * 2009-12-23 2015-06-23 General Electric Company Methods for treating superalloy articles, and related repair processes
WO2011079068A1 (en) * 2009-12-23 2011-06-30 Edison Welding Institute, Inc. Polygonal laser scanner for coating removal
CN101775570B (zh) * 2010-02-09 2013-10-23 江苏大学 一种激光氧化着色制备大面积高性能彩色不锈钢的方法
US20130099422A1 (en) * 2010-06-23 2013-04-25 Seidel, Inc. Process for Selectively Removing a Coating Layer
FI20100276A (fi) * 2010-07-20 2012-01-21 Outokumpu Oy Menetelmä hapettuman poistamiseksi metallikappaleen pinnalta
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
US8769833B2 (en) 2010-09-10 2014-07-08 Stanley Black & Decker, Inc. Utility knife blade
WO2012037468A1 (en) 2010-09-16 2012-03-22 Raydiance, Inc. Singulation of layered materials using selectively variable laser output
DE102010049428A1 (de) * 2010-10-23 2012-04-26 Volkswagen Ag Laserschneiden eines Elektrobandmaterials
FR2969021B1 (fr) * 2010-12-16 2014-04-11 Commissariat Energie Atomique Dispositif de decoupe de structure comprenant des nano-objets filaires et procede associe
KR101242953B1 (ko) * 2010-12-27 2013-03-12 주식회사 포스코 도금 방법 및 아연 도금 장치
JP5587219B2 (ja) * 2011-01-28 2014-09-10 サンコール株式会社 ステンレス鋼への導電材料の接合方法
JP5912264B2 (ja) * 2011-02-28 2016-04-27 日本発條株式会社 レーザー加工方法及び装置
TWM417976U (en) * 2011-07-13 2011-12-11 Chun-Hao Li Laser machining table
WO2013061587A1 (ja) * 2011-10-25 2013-05-02 Minehara Eisuke レーザー除染装置
US20140321494A1 (en) * 2012-01-12 2014-10-30 The Uab Research Foundation Middle-infrared volumetric bragg grating based on alkali halide or alkili-earth flouride color center crystals
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2777877A1 (de) * 2013-03-14 2014-09-17 Siemens VAI Metals Technologies GmbH Fertigbearbeitungslinie eines Metallprodukts
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
KR101325871B1 (ko) * 2013-05-13 2013-11-05 현대하이스코 주식회사 핫 스탬핑 부품 용접성 개선방법
CN105745579B (zh) * 2013-09-25 2019-02-22 Asml荷兰有限公司 束传输设备和方法
JP6211908B2 (ja) 2013-12-02 2017-10-11 トヨタ自動車株式会社 ホットスタンプ成形品の製造方法
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP6121924B2 (ja) * 2014-02-20 2017-04-26 株式会社東芝 レーザ加工装置及びレーザ加工方法
CN106413925A (zh) * 2014-06-19 2017-02-15 麦格纳国际公司 用于激光辅助动力清洗的方法和设备
RU2661977C1 (ru) * 2014-07-03 2018-07-23 Ниппон Стил Энд Сумитомо Метал Корпорейшн Устройство лазерной обработки
RU2673271C2 (ru) * 2014-07-03 2018-11-23 Ниппон Стил Энд Сумитомо Метал Корпорейшн Установка лазерной обработки
WO2016007572A1 (en) 2014-07-08 2016-01-14 Corning Incorporated Methods and apparatuses for laser processing materials
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
EP3536440A1 (de) 2014-07-14 2019-09-11 Corning Incorporated Glasartikel mit einem defektweg
WO2016010954A2 (en) * 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
EP2991126B1 (de) * 2014-08-25 2016-10-05 Theva Dünnschichttechnik GmbH Verfahren und Vorrichtung zum Herstellen eines Hochtemperatur-Supraleiters
DE102014218595A1 (de) * 2014-09-16 2016-03-17 Volkswagen Aktiengesellschaft Verfahren zum zumindest teilweisen Entfernen einer Mischoxid- bzw. Oxidschicht von einer Oberfläche eines intermetallischen Aluminid und/oder Aluminiumlegierung umfassenden Körpers
CN104342714B (zh) * 2014-10-22 2016-08-24 河北大学 一种去除不锈钢表面氧化皮的方法
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
KR20170105562A (ko) 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
EP3848334A1 (de) 2015-03-24 2021-07-14 Corning Incorporated Erdalkali-boroaluminosilikatglasartikel mit lasergeschnittener kante
JP2018516215A (ja) 2015-03-27 2018-06-21 コーニング インコーポレイテッド 気体透過性窓、および、その製造方法
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
US10672603B2 (en) * 2015-10-23 2020-06-02 Infineon Technologies Ag System and method for removing dielectric material
CN105537774A (zh) * 2016-02-27 2016-05-04 北京工业大学 一种基于飞秒激光刻蚀的氧化膜去除方法
CN105689799B (zh) * 2016-04-15 2018-02-16 东莞市俊知自动机械有限公司 锯片制造方法
EP3957611A1 (de) 2016-05-06 2022-02-23 Corning Incorporated Transparente substrate mit verbesserten seiteoberfläschen
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
CN106112269A (zh) * 2016-06-17 2016-11-16 吴起正 一种激光清除多晶硅还原炉钟罩氧化皮的方法及装置
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN106216784A (zh) * 2016-07-21 2016-12-14 哈尔滨工业大学 一种电化学或电火花/电化学复合加工中未加工表面的保护方法
EP3490945B1 (de) 2016-07-29 2020-10-14 Corning Incorporated Verfahren zur laserbearbeitung
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
EP3848333A1 (de) 2016-10-24 2021-07-14 Corning Incorporated Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
JP6893983B2 (ja) * 2016-11-23 2021-06-23 アペラム 動作中の金属製品のレーザースケール除去方法、及びそれを実施するための装置
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
NL2018518B1 (en) 2017-03-15 2018-09-24 P Laser N V Pulsed laser device for cleaning or treating a surface
CN107081529A (zh) * 2017-05-05 2017-08-22 上海航天设备制造总厂 一种用于铝构件表层阳极氧化膜的激光去除方法
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11294035B2 (en) * 2017-07-11 2022-04-05 Nuro, Inc. LiDAR system with cylindrical lenses
CN107225330A (zh) * 2017-07-19 2017-10-03 云南电网有限责任公司电力科学研究院 一种高压带电设备激光除锈装置
KR20200049800A (ko) * 2017-08-25 2020-05-08 코닝 인코포레이티드 어포컬 빔 조정 조립체를 사용하여 투명 가공물을 레이저 가공하는 장치 및 방법
CN107813053A (zh) * 2017-09-26 2018-03-20 上海航天精密机械研究所 铝合金阳极氧化膜层的清除方法
CN108015060B (zh) * 2018-01-02 2021-05-14 海安能达电气有限公司 一种具有保护眼睛和防飞溅的激光除锈机
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US10759004B2 (en) 2018-06-18 2020-09-01 Raytheon Technologies Corporation Laser removal of casting scale
AT520637B1 (de) * 2018-07-31 2019-06-15 Andritz Ag Maschf Verfahren zur verbesserung der beschichtbarkeit eines metallbandes
US10787892B2 (en) 2018-09-19 2020-09-29 Jefferson Science Associates, Llc In situ SRF cavity processing using optical ionization of gases
US11090765B2 (en) 2018-09-25 2021-08-17 Saudi Arabian Oil Company Laser tool for removing scaling
CN109226105B (zh) * 2018-10-31 2024-03-19 江苏大学 一种高效激光清洗管道内壁的装置
DE102018220317A1 (de) * 2018-11-27 2020-05-28 Sms Group Gmbh Verfahren und Walzanlage zum Warmwalzen eines Metallbandes
DE102018220318A1 (de) * 2018-11-27 2020-05-28 Sms Group Gmbh Verfahren und Vorrichtung zur Inspektion von einem metallischen Gießprodukt
DE102018133020A1 (de) * 2018-12-20 2020-06-25 Precitec Gmbh & Co. Kg Vorrichtung für ein Laserbearbeitungssystem und Laserbearbeitungssystem mit einer derartigen Vorrichtung
US11440062B2 (en) * 2019-11-07 2022-09-13 General Electric Company System and method for cleaning a tube
CN111389941B (zh) * 2020-03-04 2022-02-18 北京航空航天大学合肥创新研究院 一种热轧不锈钢表面氧化层的激光清洗方法
CN111992891A (zh) * 2020-08-05 2020-11-27 武汉锐科光纤激光技术股份有限公司 热轧高碳钢表面氧化皮激光清洗装置及方法
CN114425659A (zh) * 2020-10-29 2022-05-03 大族激光科技产业集团股份有限公司 一种激光剥离方法及激光加工设备
CN112548345A (zh) * 2020-11-27 2021-03-26 一重集团大连工程技术有限公司 去除热带钢表面氧化铁皮的方法
DE102021200226A1 (de) 2021-01-12 2022-07-14 Thyssenkrupp Steel Europe Ag Verfahren zur Herstellung einer texturierten Dressierwalze
IT202100002156A1 (it) 2021-02-02 2022-08-02 Brentech Srl Macchina semiautomatica per la lavorazione a laser di elementi da lavorare, nonche’ metodo implementato da elaboratore e programma software per il controllo di tale macchina
KR102254339B1 (ko) * 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
DE102021119195A1 (de) * 2021-07-23 2023-01-26 Trumpf Laser Gmbh Verfahren und Vorrichtung zur Werkstückbearbeitung mit einem, durch eine Scanneroptik geführten, verbreiterten Laserstrahl
CA3226234A1 (fr) 2021-07-28 2023-02-02 Ismael Romaric Alexis Guillotte Procede et installation de decapage d'une couche d'oxyde d'un produit metallique
CN113787060B (zh) * 2021-09-07 2022-11-11 高峰 钢板表面处理装置及钢板表面处理方法
US11897011B2 (en) 2022-01-31 2024-02-13 Saudi Arabian Oil Company Hybrid descaling tool and methods

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU71852A1 (de) * 1975-02-14 1977-01-05
US4135077A (en) * 1976-09-16 1979-01-16 Wills Kendall S Laser bread browning apparatus
IT1165636B (it) * 1979-03-05 1987-04-22 Fiat Auto Spa Metodo ed apparecchio per il controllo dei gas di copertura utilizzati nelle lavorazioni a mezzo di laser di potenza su pezzi metallici
DE2943107C2 (de) * 1979-10-25 1984-07-26 Robert 6600 Saarbrücken Langen Verfahren zum Entrosten
US4309609A (en) * 1980-01-07 1982-01-05 Sampson Norman N Heat scaling of traveling articles
JPS5756109A (en) * 1980-09-19 1982-04-03 Sumitomo Metal Ind Ltd Descaing method for hot strip
JPS58224087A (ja) * 1982-06-21 1983-12-26 Taiyo Sanso Kk 真空断熱容器の真空封じ方法並びに真空封じ装置
JPS5953688A (ja) * 1982-09-22 1984-03-28 Sintokogio Ltd 金属表面の酸化スケ−ル除去方法
CA1265209A (en) * 1984-02-17 1990-01-30 Robert Langen Process to remove contaminants, particularly rust/from metallic surfaces
JPS6284888A (ja) * 1985-10-08 1987-04-18 Toshiba Corp レ−ザによる切断溶接方法およびその装置
US4826299A (en) * 1987-01-30 1989-05-02 Canadian Patents And Development Limited Linear deiverging lens
CH674954A5 (de) * 1988-02-02 1990-08-15 Graf & Co Ag
FR2641718B1 (fr) * 1989-01-17 1992-03-20 Ardt Procede de nettoyage de la surface de matieres solides et dispositif de mise en oeuvre de ce procede, utilisant un laser impulsionnel de puissance, a impulsions courtes, dont on focalise le faisceau sur la surface a nettoyer
JP2627187B2 (ja) * 1989-01-27 1997-07-02 新東工業株式会社 鉄鋼品のスケール又は錆除去方法
JPH0723926B2 (ja) * 1990-02-14 1995-03-15 工業技術院長 任意形状均一放射加熱方法
JPH04182020A (ja) * 1990-11-14 1992-06-29 Mitsubishi Heavy Ind Ltd ステンレス鋼板の脱スケール方法
JP2615362B2 (ja) * 1994-02-10 1997-05-28 理化学研究所 レーザによる表面付着物の除去方法及び装置
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power

Also Published As

Publication number Publication date
ATE215417T1 (de) 2002-04-15
JPH11262449A (ja) 1999-09-28
CA2225507A1 (en) 1999-06-22
US5948172A (en) 1999-09-07
CN1224644A (zh) 1999-08-04
EP0927595B1 (de) 2002-04-03
US5736709A (en) 1998-04-07
BR9800348A (pt) 1999-11-16
AU4924997A (en) 1999-07-15
DE69711652T2 (de) 2002-11-21
EP0927595A1 (de) 1999-07-07
ES2172740T3 (es) 2002-10-01

Similar Documents

Publication Publication Date Title
DE69711652T2 (de) Entzundern von Metallen durch einen Laser mit sehr kurzer Pulsbreite und hoher Durchschnittsleistung
EP1261451B1 (de) Verfahren zum bearbeiten von werkstücken mittels mehrerer laserstrahlen
Perrie et al. Femtosecond laser micro-structuring of aluminium under helium
Neuenschwander et al. Burst mode with ps-and fs-pulses: Influence on the removal rate, surface quality, and heat accumulation
CN101678502B (zh) 把结构结合到透明工件表面的方法
EP1071536B1 (de) Vorrichtung und verfahren zur oberflächenstrukturierung von verlegten fussbodenbelägen
JPH06504484A (ja) 動的レーザ標印
JP2012516391A5 (de)
JPH09501877A (ja) 材料体のマーキング方法
KR960032596A (ko) 레이저 어닐링 방법
DE102013002222B4 (de) Verfahren zur Modifikation der Oberfläche eines Metalls
Sugioka et al. Advanced materials processing based on interaction of laser beam and a medium
Rosenbluh et al. Microfabrication of structures by laser light in metal-doped glasses
KR20240032057A (ko) 금속 제품의 산화물 층을 박리하기 위한 방법 및 장치
JPS5651528A (en) Method of improving iron loss value of magnetic steel sheet and its device
TW369450B (en) Method of removing oxide from a surface of metal, and method of and apparatus for removing oxide from a surface of metal strip
Lim et al. Femtosecond laser-induced dual periodic structures on Ni
Juodkazis et al. Studies of femtosecond pulse filamentation in glasses
JPS5923823A (ja) 電磁鋼板の磁気特性改善装置
Tamaki et al. Structural Modification in Borosilicate Glass by Use of Femtosecond Fiber Laser at 1.56 µm
Mao et al. Behavior of laser-induced emission intensity versus laser power density during breakdown of optical materials
Nanai et al. Fractal based surface characterization of laser treated polymer foils
MXPA98000554A (en) Deflecting metal with a laser device that has a very short drive duration and average power a
RU1092855C (ru) Установка дл лазерной обработки материалов
JPH03252335A (ja) ガラスへのマーキング方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee