DE69700945T2 - Verfahren zur herstellung einer gesinterten struktur auf einem substrat - Google Patents
Verfahren zur herstellung einer gesinterten struktur auf einem substratInfo
- Publication number
- DE69700945T2 DE69700945T2 DE69700945T DE69700945T DE69700945T2 DE 69700945 T2 DE69700945 T2 DE 69700945T2 DE 69700945 T DE69700945 T DE 69700945T DE 69700945 T DE69700945 T DE 69700945T DE 69700945 T2 DE69700945 T2 DE 69700945T2
- Authority
- DE
- Germany
- Prior art keywords
- producing
- substrate
- sintered structure
- sintered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/22—Direct deposition of molten metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/02—Moulding by agglomerating
- B29C67/04—Sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/25—Oxides by deposition from the liquid phase
- C03C17/256—Coating containing TiO2
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0036—Laser treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/212—TiO2
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/113—Deposition methods from solutions or suspensions by sol-gel processes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96201003 | 1996-04-17 | ||
PCT/IB1997/000281 WO1997038810A1 (en) | 1996-04-17 | 1997-03-21 | Method of manufacturing a sintered structure on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69700945D1 DE69700945D1 (de) | 2000-01-20 |
DE69700945T2 true DE69700945T2 (de) | 2000-07-20 |
Family
ID=8223874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69700945T Expired - Lifetime DE69700945T2 (de) | 1996-04-17 | 1997-03-21 | Verfahren zur herstellung einer gesinterten struktur auf einem substrat |
Country Status (5)
Country | Link |
---|---|
US (1) | US6531191B1 (de) |
EP (1) | EP0847314B1 (de) |
JP (1) | JP4346684B2 (de) |
DE (1) | DE69700945T2 (de) |
WO (1) | WO1997038810A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006030822A1 (de) * | 2006-06-30 | 2008-01-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen einer metallischen Kontaktstruktur einer Solarzelle |
DE102016219088A1 (de) | 2016-09-30 | 2018-04-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur generativen Herstellung von Bauteilen oder die Ausbildung von Beschichtungen auf Oberflächen von Bauteilen |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997038810A1 (en) * | 1996-04-17 | 1997-10-23 | Philips Electronics N.V. | Method of manufacturing a sintered structure on a substrate |
KR100479000B1 (ko) * | 1996-05-15 | 2005-08-01 | 세이코 엡슨 가부시키가이샤 | 박막디바이스,액정패널및전자기기및박막디바이스의제조방법 |
US7226966B2 (en) | 2001-08-03 | 2007-06-05 | Nanogram Corporation | Structures incorporating polymer-inorganic particle blends |
US20090075083A1 (en) | 1997-07-21 | 2009-03-19 | Nanogram Corporation | Nanoparticle production and corresponding structures |
US8568684B2 (en) * | 2000-10-17 | 2013-10-29 | Nanogram Corporation | Methods for synthesizing submicron doped silicon particles |
US6599631B2 (en) | 2001-01-26 | 2003-07-29 | Nanogram Corporation | Polymer-inorganic particle composites |
US7765022B2 (en) * | 1998-06-30 | 2010-07-27 | The P.O.M. Group | Direct metal deposition apparatus utilizing rapid-response diode laser source |
US6348295B1 (en) | 1999-03-26 | 2002-02-19 | Massachusetts Institute Of Technology | Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging |
GR1003732B (el) | 2000-12-29 | 2001-12-11 | Εταιρεια Στηριξης Ερευνας Τεχνολογιας & Εκπαιδευσης (Εσετε) | Μεθοδος και συστημα αυτοματοποιημενης εγχρωμης ανεξιτηλης διακοσμησης σε κεραμικα και γυαλι. |
DE10128664A1 (de) * | 2001-06-15 | 2003-01-30 | Univ Clausthal Tech | Verfahren und Vorrichtung zur Herstellung von keramischen Formförpern |
US6936181B2 (en) | 2001-10-11 | 2005-08-30 | Kovio, Inc. | Methods for patterning using liquid embossing |
JP4039035B2 (ja) | 2001-10-31 | 2008-01-30 | セイコーエプソン株式会社 | 線パターンの形成方法、線パターン、電気光学装置、電子機器、非接触型カード媒体 |
JP4068883B2 (ja) * | 2002-04-22 | 2008-03-26 | セイコーエプソン株式会社 | 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法 |
US6957608B1 (en) | 2002-08-02 | 2005-10-25 | Kovio, Inc. | Contact print methods |
JP4244382B2 (ja) * | 2003-02-26 | 2009-03-25 | セイコーエプソン株式会社 | 機能性材料定着方法及びデバイス製造方法 |
US20060198916A1 (en) * | 2003-04-04 | 2006-09-07 | Beeck Alexander R | Method for producing ceramic objects |
FI116549B (fi) * | 2003-04-15 | 2005-12-15 | Kimmo Jokelainen | Menetelmä 3D-piirijärjestelyn aikaansaamiseksi ja menetelmällä valmistettu komponentti |
ES2246720B1 (es) * | 2004-08-02 | 2006-11-01 | Universitat De Valencia | Procedimiento de impermeabilizacion de superficies de materiales ceramicos porosos, mediante tratamiento con radiacion laser de dichas superficies previamente impregnadas con una solucion quimica precursora de oxidos formadores de vidrio. |
CN101010806A (zh) * | 2004-08-20 | 2007-08-01 | 皇家飞利浦电子股份有限公司 | 具有钝化层的微电子系统 |
EP1810206B1 (de) * | 2004-10-19 | 2014-07-09 | Rolls-Royce Corporation | Verfahren in zusammenhang mit anisotroper schrumpfung in gesinterten keramikgegenständen |
US7674671B2 (en) | 2004-12-13 | 2010-03-09 | Optomec Design Company | Aerodynamic jetting of aerosolized fluids for fabrication of passive structures |
JP4311364B2 (ja) * | 2005-03-18 | 2009-08-12 | セイコーエプソン株式会社 | 液滴吐出装置 |
JP4609846B2 (ja) * | 2005-03-25 | 2011-01-12 | 古河電気工業株式会社 | 金属焼成体の製造方法及びそれに用いられる金属粒子焼成用材料並びにそれにより得られる配線パターン |
GB0511460D0 (en) * | 2005-06-06 | 2005-07-13 | Univ Liverpool | Process |
DE102005036427A1 (de) * | 2005-08-03 | 2007-02-08 | Schott Ag | Substrat, umfassend zumindest eine voll- oder teilflächige makrostrukturierte Schicht, Verfahren zu deren Herstellung und deren Verwendung |
WO2007038950A1 (en) | 2005-09-28 | 2007-04-12 | Stichting Dutch Polymer Institute | Method for generation of metal surface structures and apparatus therefor |
US20070193675A1 (en) * | 2006-02-22 | 2007-08-23 | Abhijit Gurav | Process of manufacturing a multilayer device and device manufactured thereby |
DE102006015014B4 (de) * | 2006-03-31 | 2008-07-24 | Uibel, Krishna, Dipl.-Ing. | Verfahren zur Herstellung dreidimensionaler keramischer Formkörper |
CN103333526A (zh) | 2007-01-03 | 2013-10-02 | 内诺格雷姆公司 | 基于硅/锗的纳米颗粒油墨、掺杂型颗粒、用于半导体应用的印刷和方法 |
GB0708381D0 (en) * | 2007-04-30 | 2007-06-06 | Nokia Corp | Method for forming a semiconductor structure |
EP1993228B1 (de) * | 2007-05-18 | 2012-05-23 | Huawei Technologies Co., Ltd. | Verfahren zum Senden von Nachrichten, Vorrichtung zum Senden von Nachrichten und Nachrichtenübertragungssystem |
US20090004368A1 (en) * | 2007-06-29 | 2009-01-01 | Weyerhaeuser Co. | Systems and methods for curing a deposited layer on a substrate |
US8447530B2 (en) * | 2008-01-11 | 2013-05-21 | The Boeing Company | High density structural health monitoring system and method |
US8463116B2 (en) | 2008-07-01 | 2013-06-11 | Tap Development Limited Liability Company | Systems for curing deposited material using feedback control |
US8991211B1 (en) | 2009-11-01 | 2015-03-31 | The Exone Company | Three-dimensional printing glass articles |
JP5184584B2 (ja) * | 2010-06-21 | 2013-04-17 | 古河電気工業株式会社 | 金属配線パターンの形成方法、金属配線パターン、金属配線基板、および金属配線パターン形成用の金属粒子と基板 |
US8895962B2 (en) | 2010-06-29 | 2014-11-25 | Nanogram Corporation | Silicon/germanium nanoparticle inks, laser pyrolysis reactors for the synthesis of nanoparticles and associated methods |
CN105713568B (zh) | 2010-11-01 | 2018-07-03 | 3M创新有限公司 | 用于制备成形陶瓷磨粒的激光法、成形陶瓷磨粒以及磨料制品 |
ITRM20110184A1 (it) * | 2011-04-12 | 2012-10-13 | Dyepower | Procedimento di sinterizzazione di formulazioni a base di ossidi metallici. |
JP5891782B2 (ja) * | 2011-12-27 | 2016-03-23 | 株式会社リコー | 薄膜製造装置、薄膜製造方法、液滴吐出ヘッド、及びインクジェット記録装置 |
WO2014189886A1 (en) | 2013-05-24 | 2014-11-27 | Nanogram Corporation | Printable inks with silicon/germanium based nanoparticles with high viscosity alcohol solvents |
CN103407296A (zh) * | 2013-07-29 | 2013-11-27 | 南京鼎科纳米技术研究所有限公司 | 一种激光熔融辅助纳米墨水实现高熔点材料3d打印的方法 |
CN116377301A (zh) | 2013-10-17 | 2023-07-04 | Xjet有限公司 | 用于3d喷墨打印的碳化钨/钴油墨组合物 |
JP6478212B2 (ja) * | 2013-10-24 | 2019-03-06 | 株式会社リコー | 三次元構造物の造形方法及び三次元構造物の造形装置 |
JP6060911B2 (ja) * | 2014-01-21 | 2017-01-18 | トヨタ自動車株式会社 | ステータの製造方法 |
CN104226997A (zh) * | 2014-09-12 | 2014-12-24 | 徐海锋 | 一种3d金属打印方法 |
WO2016130709A1 (en) * | 2015-02-10 | 2016-08-18 | Optomec, Inc. | Fabrication of three-dimensional structures by in-flight curing of aerosols |
US20170348903A1 (en) * | 2015-02-10 | 2017-12-07 | Optomec, Inc. | Fabrication of Three-Dimensional Materials Gradient Structures by In-Flight Curing of Aerosols |
JP6536199B2 (ja) * | 2015-06-16 | 2019-07-03 | セイコーエプソン株式会社 | 3次元形成装置 |
CN107735372B (zh) | 2015-06-23 | 2021-08-27 | Agc 株式会社 | 烧结成形体及其制造方法、具备烧结成形体的物品、烧结成形体用材料以及烧结前成形体及其制造方法 |
DE102015110360A1 (de) | 2015-06-26 | 2016-12-29 | Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) | Verfahren zur laserinduziert additiven Erzeugung eines Grünkörpers mittels Schlickerguss |
JP6994295B2 (ja) | 2015-12-17 | 2022-01-14 | セイコーエプソン株式会社 | 三次元造形物の製造方法および三次元造形物製造装置 |
US20180127297A1 (en) * | 2016-11-10 | 2018-05-10 | Goodrich Corporation | Powder bed additive manufacturing of low expansion glass |
US10798783B2 (en) * | 2017-02-15 | 2020-10-06 | Continuous Composites Inc. | Additively manufactured composite heater |
TWI615448B (zh) * | 2017-05-25 | 2018-02-21 | Donbon Paints Industrial Co Ltd | 雷射燒結成型用金屬膠體之製備方法 |
CN107473570A (zh) * | 2017-08-11 | 2017-12-15 | 西安工业大学 | 溶胶制备光学元件的装置及其制备方法 |
US10632746B2 (en) | 2017-11-13 | 2020-04-28 | Optomec, Inc. | Shuttering of aerosol streams |
JP2020100885A (ja) * | 2018-12-25 | 2020-07-02 | エルジー・ケム・リミテッド | 成形装置及び成形体の製造方法 |
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BE1004844A7 (fr) * | 1991-04-12 | 1993-02-09 | Laude Lucien Diego | Methodes de metallisation de surfaces a l'aide de poudres metalliques. |
US5188902A (en) * | 1991-05-30 | 1993-02-23 | Northern Illinois University | Production of PT/PZT/PLZI thin films, powders, and laser `direct write` patterns |
US5314003A (en) * | 1991-12-24 | 1994-05-24 | Microelectronics And Computer Technology Corporation | Three-dimensional metal fabrication using a laser |
FR2688803B1 (fr) * | 1992-03-23 | 1994-05-06 | European Gas Turbines Sa | Procede de revetement d'une encoche d'une piece en alliage de nickel par laser. |
US5688564A (en) * | 1992-07-23 | 1997-11-18 | Institut Polytechnique De Sevenans | Process for the preparation and coating of a surface |
WO1997038810A1 (en) * | 1996-04-17 | 1997-10-23 | Philips Electronics N.V. | Method of manufacturing a sintered structure on a substrate |
-
1997
- 1997-03-21 WO PCT/IB1997/000281 patent/WO1997038810A1/en active IP Right Grant
- 1997-03-21 DE DE69700945T patent/DE69700945T2/de not_active Expired - Lifetime
- 1997-03-21 JP JP53689697A patent/JP4346684B2/ja not_active Expired - Lifetime
- 1997-03-21 EP EP97906829A patent/EP0847314B1/de not_active Expired - Lifetime
- 1997-04-16 US US08/834,410 patent/US6531191B1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006030822A1 (de) * | 2006-06-30 | 2008-01-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen einer metallischen Kontaktstruktur einer Solarzelle |
DE102016219088A1 (de) | 2016-09-30 | 2018-04-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur generativen Herstellung von Bauteilen oder die Ausbildung von Beschichtungen auf Oberflächen von Bauteilen |
DE102016219088B4 (de) | 2016-09-30 | 2019-10-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur generativen Herstellung von Bauteilen oder die Ausbildung von Beschichtungen auf Oberflächen von Bauteilen |
Also Published As
Publication number | Publication date |
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DE69700945D1 (de) | 2000-01-20 |
JP4346684B2 (ja) | 2009-10-21 |
JPH11508326A (ja) | 1999-07-21 |
WO1997038810A1 (en) | 1997-10-23 |
EP0847314B1 (de) | 1999-12-15 |
EP0847314A1 (de) | 1998-06-17 |
US6531191B1 (en) | 2003-03-11 |
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