DE69637994D1 - Ablationsverfahren durch laser-darstellung - Google Patents

Ablationsverfahren durch laser-darstellung

Info

Publication number
DE69637994D1
DE69637994D1 DE69637994T DE69637994T DE69637994D1 DE 69637994 D1 DE69637994 D1 DE 69637994D1 DE 69637994 T DE69637994 T DE 69637994T DE 69637994 T DE69637994 T DE 69637994T DE 69637994 D1 DE69637994 D1 DE 69637994D1
Authority
DE
Germany
Prior art keywords
ablation procedure
presentation
laser
laser presentation
ablation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69637994T
Other languages
English (en)
Inventor
Patrick R Fleming
Andrew J Ouderkirk
Eric J Borchers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE69637994D1 publication Critical patent/DE69637994D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
DE69637994T 1995-04-26 1996-03-29 Ablationsverfahren durch laser-darstellung Expired - Lifetime DE69637994D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42930295A 1995-04-26 1995-04-26
PCT/US1996/004322 WO1996033839A1 (en) 1995-04-26 1996-03-29 Method and apparatus for step and repeat exposures

Publications (1)

Publication Number Publication Date
DE69637994D1 true DE69637994D1 (de) 2009-09-24

Family

ID=23702662

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69637994T Expired - Lifetime DE69637994D1 (de) 1995-04-26 1996-03-29 Ablationsverfahren durch laser-darstellung

Country Status (8)

Country Link
US (1) US6285001B1 (de)
EP (1) EP0822881B1 (de)
JP (1) JP4180654B2 (de)
KR (1) KR19990007929A (de)
AU (1) AU5325596A (de)
CA (1) CA2217018C (de)
DE (1) DE69637994D1 (de)
WO (1) WO1996033839A1 (de)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555449B1 (en) * 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
US7128737B1 (en) 1997-10-22 2006-10-31 Carl Zeiss Meditec Ag Object figuring device
CA2329011A1 (en) 1998-04-29 1999-11-04 3M Innovative Properties Company Receptor sheet for inkjet printing having an embossed surface
JP2000294523A (ja) * 1999-04-01 2000-10-20 Sony Corp 半導体製造装置および半導体装置の製造方法
DE60038400T2 (de) * 1999-04-02 2009-04-23 Murata Mfg. Co., Ltd., Nagaokakyo-shi Laserverfahren zur Bearbeitung von Löchern nur in einer keramischen Grünfolie mit einem Trägerfilm
US6540367B1 (en) 1999-04-07 2003-04-01 3M Innovative Properties Company Structured surface articles containing geometric structures with compound faces and methods for making same
DE19915715A1 (de) * 1999-04-08 2000-10-19 Ticona Gmbh Mikrostrukturierte Bauteile
CN1170693C (zh) 1999-06-01 2004-10-13 3M创新有限公司 喷墨接受介质及其制法、成象喷墨接受介质、图象的制法
AU5452500A (en) 1999-06-01 2000-12-18 3M Innovative Properties Company Random microembossed receptor media
US8728610B2 (en) 2000-02-25 2014-05-20 3M Innovative Properties Company Compound mold and structured surface articles containing geometric structures with compound faces and method of making same
TW575786B (en) * 2000-03-14 2004-02-11 Takashi Nishi Exposure controlling photomask and production method thereof
US6830993B1 (en) * 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
US6462859B1 (en) 2000-10-04 2002-10-08 3M Innovative Properties Company Electromagnetically responsive particle assembly and methods and articles for manufacture and use
CN1404627A (zh) * 2000-10-10 2003-03-19 纽约市哥伦比亚大学托管会 处理薄金属层的方法与设备
TW546684B (en) * 2000-11-27 2003-08-11 Univ Columbia Process and mask projection system for laser crystallization processing of semiconductor film regions on a substrate
NL1016735C2 (nl) 2000-11-29 2002-05-31 Ocu Technologies B V Werkwijze voor het vormen van een nozzle in een orgaan voor een inkjet printkop, een nozzle-orgaan, een inkjet printkop voorzien van dit nozzle-orgaan en een inkjet printer voorzien van een dergelijke printkop.
US20020164446A1 (en) 2001-01-17 2002-11-07 Zhiming Zhou Pressure sensitive adhesives with a fibrous reinforcing material
US6762124B2 (en) 2001-02-14 2004-07-13 Avery Dennison Corporation Method for patterning a multilayered conductor/substrate structure
JP2005525689A (ja) * 2001-08-27 2005-08-25 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク ミクロ構造の非整列による多結晶薄膜トランジスタの均一性の改善
US6881203B2 (en) 2001-09-05 2005-04-19 3M Innovative Properties Company Microneedle arrays and methods of manufacturing the same
US6908453B2 (en) 2002-01-15 2005-06-21 3M Innovative Properties Company Microneedle devices and methods of manufacture
US20030151118A1 (en) * 2002-02-14 2003-08-14 3M Innovative Properties Company Aperture masks for circuit fabrication
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US6897164B2 (en) * 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US6583936B1 (en) 2002-03-11 2003-06-24 Eastman Kodak Company Patterned roller for the micro-replication of complex lenses
WO2003084688A2 (en) * 2002-04-01 2003-10-16 The Trustees Of Columbia University In The City Of New York Method and system for providing a thin film
CA2492867C (en) 2002-07-19 2011-07-05 3M Innovative Properties Company Microneedle devices and microneedle delivery apparatus
JP4879486B2 (ja) * 2002-08-19 2012-02-22 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上のフィルム領域をレーザ結晶化処理してほぼ均一にするプロセス及びシステム、及びこのフィルム領域の構造
JP4873858B2 (ja) 2002-08-19 2012-02-08 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク エッジ領域を最小にするために基板のフィルム領域のレーザ結晶化処理方法及び装置並びにそのようなフィルム領域の構造
AU2003258289A1 (en) 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York A single-shot semiconductor processing system and method having various irradiation patterns
JP5030382B2 (ja) * 2002-08-19 2012-09-19 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上のフィルム領域を処理して、こうした領域内及びその端部領域をほぼ均一にするレーザ結晶化プロセス及びシステム
US7030010B2 (en) * 2002-08-29 2006-04-18 Micron Technology, Inc. Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures
WO2004075263A2 (en) * 2003-02-19 2004-09-02 The Trustees Of Columbia University In The City Of New York System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
US20060110580A1 (en) * 2003-04-28 2006-05-25 Aylward Peter T Article comprising conductive conduit channels
US8062734B2 (en) * 2003-04-28 2011-11-22 Eastman Kodak Company Article comprising conductive conduit channels
US7138170B2 (en) * 2003-04-28 2006-11-21 Eastman Kodak Company Terminated conductive patterned sheet utilizing conductive conduits
US7001658B2 (en) * 2003-04-28 2006-02-21 Eastman Kodak Company Heat selective electrically conductive polymer sheet
US7371452B2 (en) * 2003-04-28 2008-05-13 Eastman Kodak Company Conductive patterned sheet utilizing multi-layered conductive conduit channels
WO2005029546A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
WO2005029549A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for facilitating bi-directional growth
US7164152B2 (en) * 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
US7318866B2 (en) * 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
WO2005029548A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York System and process for providing multiple beam sequential lateral solidification
WO2005029550A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for producing crystalline thin films with a uniform crystalline orientation
WO2005029547A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Enhancing the width of polycrystalline grains with mask
TWI359441B (en) 2003-09-16 2012-03-01 Univ Columbia Processes and systems for laser crystallization pr
US7364952B2 (en) 2003-09-16 2008-04-29 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
WO2005034193A2 (en) 2003-09-19 2005-04-14 The Trustees Of Columbia University In The City Ofnew York Single scan irradiation for crystallization of thin films
US20050213914A1 (en) * 2004-03-23 2005-09-29 Motorola, Inc. High efficiency light guide
US7092163B2 (en) * 2004-07-22 2006-08-15 General Electric Company Light collimating and diffusing film and system for making the film
US7645337B2 (en) 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
US20060282399A1 (en) * 2005-05-09 2006-12-14 Richard Ackermann Digital sound recording personalized at a time and place remote from initial delivery to a retail customer
US8278590B2 (en) * 2005-05-27 2012-10-02 Resonetics, LLC Apparatus for minimizing a heat affected zone during laser micro-machining
GB0518105D0 (en) * 2005-09-06 2005-10-12 Plastic Logic Ltd Step-and-repeat laser ablation of electronic devices
GB0511132D0 (en) * 2005-06-01 2005-07-06 Plastic Logic Ltd Layer-selective laser ablation patterning
JP2007054992A (ja) * 2005-08-23 2007-03-08 Sii Printek Inc インクジェットヘッド用ノズルプレートの製造方法、インクジェットヘッド用ノズルプレートの製造装置、インクジェットヘッド用ノズルプレート、インクジェットヘッド、およびインクジェット記録装置
US7577396B2 (en) * 2005-09-21 2009-08-18 Oki Data Corporation Printing apparatus
KR101287314B1 (ko) 2005-12-05 2013-07-17 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 막 처리 시스템과 방법, 및 박막
US20070231541A1 (en) * 2006-03-31 2007-10-04 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
US20070235902A1 (en) * 2006-03-31 2007-10-11 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
GB2438600B (en) * 2006-05-19 2008-07-09 Exitech Ltd Method for patterning thin films on moving substrates
GB2438601B (en) * 2006-05-24 2008-04-09 Exitech Ltd Method and unit for micro-structuring a moving substrate
US7807938B2 (en) * 2006-06-22 2010-10-05 Sabic Innovative Plastics Ip B.V. Mastering tools and systems and methods for forming a plurality of cells on the mastering tools
US8262381B2 (en) * 2006-06-22 2012-09-11 Sabic Innovative Plastics Ip B.V. Mastering tools and systems and methods for forming a cell on the mastering tools
US20080027199A1 (en) 2006-07-28 2008-01-31 3M Innovative Properties Company Shape memory polymer articles with a microstructured surface
US7951319B2 (en) * 2006-07-28 2011-05-31 3M Innovative Properties Company Methods for changing the shape of a surface of a shape memory polymer article
US7800825B2 (en) 2006-12-04 2010-09-21 3M Innovative Properties Company User interface including composite images that float
KR101386173B1 (ko) * 2007-04-26 2014-04-29 삼성디스플레이 주식회사 렌즈 형성용 원판 제조 방법 및 렌즈 형성용 원판을 이용한박막 트랜지스터 기판 제조 방법
US20090114618A1 (en) * 2007-06-21 2009-05-07 3M Innovative Properties Company Method of making hierarchical articles
US20080315459A1 (en) * 2007-06-21 2008-12-25 3M Innovative Properties Company Articles and methods for replication of microstructures and nanofeatures
US20090041986A1 (en) * 2007-06-21 2009-02-12 3M Innovative Properties Company Method of making hierarchical articles
CN102830494B (zh) 2007-07-11 2015-04-01 3M创新有限公司 具有浮动合成图像的片材
TW200942935A (en) 2007-09-21 2009-10-16 Univ Columbia Collections of laterally crystallized semiconductor islands for use in thin film transistors and systems and methods for making same
TWI418037B (zh) 2007-09-25 2013-12-01 Univ Columbia 藉由改變形狀、大小或雷射光束在製造於橫向結晶化薄膜上之薄膜電晶體元件中產生高一致性的方法
US8498464B2 (en) * 2007-09-27 2013-07-30 Siemens Medical Solutions Usa, Inc. Intrinsic co-registration for modular multimodality medical imaging systems
US7985941B2 (en) * 2007-11-16 2011-07-26 3M Innovative Properties Company Seamless laser ablated roll tooling
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
JP5443377B2 (ja) 2007-11-21 2014-03-19 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク エピタキシャルに配向された厚膜を調製するための調製システムおよび方法
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
CN101878438B (zh) 2007-11-27 2013-09-25 3M创新有限公司 形成具有悬浮合成图像的片材以及母模具的方法
US8569155B2 (en) 2008-02-29 2013-10-29 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
GB0804955D0 (en) * 2008-03-18 2008-04-16 Rumsby Philip T Method and apparatus for laser processing the surface of a drum
EP2119527A1 (de) * 2008-05-16 2009-11-18 Kba-Giori S.A. Verfahren und System zur Herstellung von Triefdruckplatten für die Herstellung von Wertzeichenpapieren
WO2010056990A1 (en) 2008-11-14 2010-05-20 The Trustees Of Columbia University In The City Of New York Systems and methods for the crystallization of thin films
US20100128351A1 (en) * 2008-11-21 2010-05-27 3M Innovative Properties Company Curved sided cone structures for controlling gain and viewing angle in an optical film
US20100129617A1 (en) * 2008-11-21 2010-05-27 Corrigan Thomas R Laser ablation tooling via sparse patterned masks
US20100252961A1 (en) * 2009-04-06 2010-10-07 3M Innovative Properties Company Optical film replication on low thermal diffusivity tooling with conformal coating
US9291752B2 (en) 2013-08-19 2016-03-22 3M Innovative Properties Company Retroreflecting optical construction
JP2012524381A (ja) 2009-04-15 2012-10-11 スリーエム イノベイティブ プロパティズ カンパニー ボイドを含有する光学フィルムを備える光ガイド及びディスプレイシステム用ブラックライト
BRPI1006654A2 (pt) 2009-04-15 2016-02-10 3M Innovative Properties Co construções ópticas retrorrefletoras e filmes ópticos
TWI605276B (zh) 2009-04-15 2017-11-11 ３Ｍ新設資產公司 光學結構及包含該光學結構之顯示系統
KR101766494B1 (ko) 2009-04-15 2017-08-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 결합을 방지하기 위한 광학 필름
US20110070398A1 (en) * 2009-09-18 2011-03-24 3M Innovative Properties Company Laser ablation tooling via distributed patterned masks
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US8440581B2 (en) 2009-11-24 2013-05-14 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse sequential lateral solidification
EP2504104A1 (de) 2009-11-23 2012-10-03 3M Innovative Properties Company Träger mit flexiblem mikroassayelement und anwendungsverfahren dafür
EP2504103A2 (de) 2009-11-23 2012-10-03 3M Innovative Properties Company Mikrowellenarrayartikel und verfahren zu ihrer verwendung
US8917447B2 (en) * 2010-01-13 2014-12-23 3M Innovative Properties Company Microreplicated film for attachment to autostereoscopic display components
CN102712140B (zh) 2010-01-13 2015-06-03 3M创新有限公司 具有微结构化低折射率纳米空隙层的光学膜及其方法
KR101954457B1 (ko) 2010-04-15 2019-03-05 쓰리엠 이노베이티브 프로퍼티즈 캄파니 광학적 활성 영역 및 광학적 불활성 영역을 포함하는 재귀반사성 물품
WO2011129833A1 (en) 2010-04-15 2011-10-20 3M Innovative Properties Company Retroreflective articles including optically active areas and optically inactive areas
MX341955B (es) 2010-04-15 2016-09-08 3M Innovative Properties Co Articulos retrorreflectantes que incluyen areas opticamente activas y areas opticamente inactivas.
US8538224B2 (en) 2010-04-22 2013-09-17 3M Innovative Properties Company OLED light extraction films having internal nanostructures and external microstructures
US8469551B2 (en) 2010-10-20 2013-06-25 3M Innovative Properties Company Light extraction films for increasing pixelated OLED output with reduced blur
US8547015B2 (en) 2010-10-20 2013-10-01 3M Innovative Properties Company Light extraction films for organic light emitting devices (OLEDs)
US8299708B2 (en) 2010-10-25 2012-10-30 Hewlett-Packard Development Company, L.P. Pixel structures
US20120195550A1 (en) * 2011-01-31 2012-08-02 Global Lighting Technology Inc. Method of making optical microstructure pattern on light guide plate, light guide plate thereof and imprinting mold
CN103597379B (zh) 2011-05-25 2016-10-05 3M创新有限公司 光控膜
EP3126092B1 (de) 2014-04-03 2022-08-17 3M Innovative Properties Company Polierkissen und systeme und verfahren zur herstellung und verwendung davon
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
WO2016079275A1 (de) 2014-11-19 2016-05-26 Trumpf Laser- Und Systemtechnik Gmbh System zur asymmetrischen optischen strahlformung
TWI769988B (zh) 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
WO2017200964A1 (en) 2016-05-19 2017-11-23 3M Innovative Properties Company Compressible multilayer articles and method of making thereof
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
WO2018150370A2 (en) 2017-02-20 2018-08-23 3M Innovative Properties Company Microstructured elastomeric film and method for making thereof
CN113950634A (zh) 2019-06-12 2022-01-18 3M创新有限公司 具有非对称光输出的高透射率光控膜

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064989B1 (en) 1957-06-27 1996-10-29 Jerome H Lemelson Surface shaping and finishing apparatus and method
CH572798A5 (en) * 1974-01-14 1976-02-27 Lasag Sa Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor
DE3145278C2 (de) * 1981-11-14 1985-02-14 Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel Verfahren zum berührungslosen Abtragen von Material von der Oberfläche eines Glasgegenstandes und Vorrichtung zur Durchführung des Verfahrens
US4508749A (en) 1983-12-27 1985-04-02 International Business Machines Corporation Patterning of polyimide films with ultraviolet light
US4822975A (en) * 1984-01-30 1989-04-18 Canon Kabushiki Kaisha Method and apparatus for scanning exposure
US5171965A (en) * 1984-02-01 1992-12-15 Canon Kabushiki Kaisha Exposure method and apparatus
US5262718A (en) 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
US4856513A (en) 1987-03-09 1989-08-15 Summit Technology, Inc. Laser reprofiling systems and methods
US4752668A (en) 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
US4842784A (en) 1986-07-30 1989-06-27 Miyama Kogyo Kabushiki Kaisha Method of manufacturing a climbing step with embedded reflection plate
US4786358A (en) 1986-08-08 1988-11-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming a pattern of a film on a substrate with a laser beam
JPS6384789A (ja) 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
US5179262A (en) 1986-10-14 1993-01-12 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US4842782A (en) 1986-10-14 1989-06-27 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5053171A (en) 1986-10-14 1991-10-01 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
KR900700292A (ko) 1988-02-05 1990-08-13 원본미기재 적층 중합체 시트
JPH01245993A (ja) 1988-03-27 1989-10-02 Semiconductor Energy Lab Co Ltd 薄膜加工装置
CA1325832C (en) * 1988-06-09 1994-01-04 Paul R. Yoder, Jr. Methods and apparatus for laser sculpture of the cornea
DE68919792T2 (de) 1988-09-30 1995-08-03 Raychem Ltd Verbindungsartikel für Hybrid-Mikrochip.
US4909818A (en) 1988-11-16 1990-03-20 Jones William F System and process for making diffractive contact
US4894115A (en) * 1989-02-14 1990-01-16 General Electric Company Laser beam scanning method for forming via holes in polymer materials
GB8916133D0 (en) * 1989-07-14 1989-08-31 Raychem Ltd Laser machining
CA2021110A1 (en) * 1989-09-05 1991-03-06 Colloptics, Inc. Laser shaping with an area patterning mask
US5018164A (en) 1989-09-12 1991-05-21 Hughes Aircraft Company Excimer laser ablation method and apparatus for microcircuit fabrication
US5066357A (en) * 1990-01-11 1991-11-19 Hewlett-Packard Company Method for making flexible circuit card with laser-contoured vias and machined capacitors
US5223693A (en) 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus
US5240553A (en) 1990-05-18 1993-08-31 Bausch & Lomb Incorporated One and two dimensional target domain profiling of target optical surfaces using excimer laser photoablation
US5170191A (en) 1990-05-18 1992-12-08 Bausch & Lomb Incorporated Target domain profiling of target optical surfaces using excimer laser photoablation
US5061342A (en) 1990-05-18 1991-10-29 Bausch & Lomb Incorporated Target domain profiling of target optical surfaces using excimer laser photoablation
NL9002036A (nl) * 1990-09-17 1992-04-16 Philips Nv Inrichting en werkwijze voor het met elektromagnetisch straling aanbrengen van merktekens op een voorwerp, en een voorwerp voorzien van merktekens.
US5362940A (en) * 1990-11-09 1994-11-08 Litel Instruments Use of Fresnel zone plates for material processing
US5160823A (en) * 1991-01-03 1992-11-03 Hutchinson Technology, Inc. Moving mask laser imaging
JPH0577425A (ja) 1991-02-21 1993-03-30 Hewlett Packard Co <Hp> ノズルプレートおよびその製造方法
FR2679477B1 (fr) 1991-07-26 1995-11-17 Aerospatiale Procede de decoupe par faisceau laser d'un materiau recouvrant un substrat et dispositifs pour sa mise en óoeuvre.
IE912667A1 (en) * 1991-07-29 1993-02-10 Trinity College Dublin Laser Profiling of Lens Edge
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
US5208818A (en) * 1991-12-12 1993-05-04 Creo Products Inc. Laser system for recording data patterns on a planar substrate
FR2692067A1 (fr) * 1992-06-05 1993-12-10 Laser Int Sa Procédé de réalisation de pièces par transformation de matière grâce à l'action de la lumière et dispositif de mise en Óoeuvre de ce procédé.
US5514850A (en) * 1992-06-30 1996-05-07 Sharp Kabushiki Kaisha Defect compensation method for smoothing a surface of a transparent plate with an ArF excimer laser beam
US5257706A (en) 1992-09-29 1993-11-02 Bausch & Lomb Incorporated Method of cleaning laser ablation debris
JP3211525B2 (ja) 1993-04-22 2001-09-25 オムロン株式会社 薄材メッシュ、その製造方法及びその製造装置
US5461212A (en) * 1993-06-04 1995-10-24 Summit Technology, Inc. Astigmatic laser ablation of surfaces
CN1125411A (zh) * 1993-06-11 1996-06-26 博士伦公司 使激光蚀刻表面上所形成的衍射槽纹最小化的方法
US6263096B1 (en) 1999-06-23 2001-07-17 The Board Of Trustees Of The University Of Illinois Multilevel domain decomposition method for fast reprojection of images

Also Published As

Publication number Publication date
EP0822881B1 (de) 2009-08-12
US6285001B1 (en) 2001-09-04
EP0822881A1 (de) 1998-02-11
JP4180654B2 (ja) 2008-11-12
WO1996033839A1 (en) 1996-10-31
JPH11504264A (ja) 1999-04-20
CA2217018C (en) 2006-10-17
AU5325596A (en) 1996-11-18
CA2217018A1 (en) 1996-10-31
KR19990007929A (ko) 1999-01-25

Similar Documents

Publication Publication Date Title
DE69637994D1 (de) Ablationsverfahren durch laser-darstellung
NO981032L (no) Multifoton-lasermikroskopi
DE69609431T2 (de) Geodätisches Laserinstrument
DE69603015T2 (de) Laser
DE69605245D1 (de) Laser
DE19680508T1 (de) Konfokal-bis-konzentrischer diodengepumpter Laser
DE69510238D1 (de) Monolithische laser
NO308550B1 (no) Bjelke
DK0691044T3 (da) Laser
DE69419231T2 (de) Laserschneidevorrichtung
DE69717182T2 (de) Excimerlasergenerator
DE69404047D1 (de) Lasereinheit
DE69600694T2 (de) Laserverstaerker
DE59505168D1 (de) Lasermodul
DE19681272T1 (de) Zweistrahl-Laserabtragung
DE69404135T2 (de) Laser
DE69529939T2 (de) Laservorrichtung
DE69408845D1 (de) Laservorrichtung
NO976041D0 (no) Laser-drivkrets
DE69614169T2 (de) Laserdrucker
DE69609672D1 (de) Laser-System
DE69631170D1 (de) Lasersystem
DE69629007D1 (de) Lasergenerator
DE59401622D1 (de) Laser
DE69621206D1 (de) Laser-Aufzeichnungsverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition