DE69634586D1 - Vorrichtung zur Kühlung einer Wärmequelle - Google Patents

Vorrichtung zur Kühlung einer Wärmequelle

Info

Publication number
DE69634586D1
DE69634586D1 DE69634586T DE69634586T DE69634586D1 DE 69634586 D1 DE69634586 D1 DE 69634586D1 DE 69634586 T DE69634586 T DE 69634586T DE 69634586 T DE69634586 T DE 69634586T DE 69634586 D1 DE69634586 D1 DE 69634586D1
Authority
DE
Germany
Prior art keywords
cooling
heat source
heat
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69634586T
Other languages
English (en)
Other versions
DE69634586T2 (de
Inventor
David W Perdue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradata US Inc
Original Assignee
NCR International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR International Inc filed Critical NCR International Inc
Application granted granted Critical
Publication of DE69634586D1 publication Critical patent/DE69634586D1/de
Publication of DE69634586T2 publication Critical patent/DE69634586T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69634586T 1995-08-31 1996-08-07 Vorrichtung zur Kühlung einer Wärmequelle Expired - Lifetime DE69634586T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US524020 1995-08-31
US08/524,020 US5563768A (en) 1995-08-31 1995-08-31 Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid

Publications (2)

Publication Number Publication Date
DE69634586D1 true DE69634586D1 (de) 2005-05-19
DE69634586T2 DE69634586T2 (de) 2006-03-02

Family

ID=24087420

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69634586T Expired - Lifetime DE69634586T2 (de) 1995-08-31 1996-08-07 Vorrichtung zur Kühlung einer Wärmequelle

Country Status (4)

Country Link
US (1) US5563768A (de)
EP (1) EP0760527B1 (de)
JP (1) JPH09128100A (de)
DE (1) DE69634586T2 (de)

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US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
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US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
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US9192079B2 (en) * 2008-09-26 2015-11-17 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
US20100085713A1 (en) * 2008-10-03 2010-04-08 Balandin Alexander A Lateral graphene heat spreaders for electronic and optoelectronic devices and circuits
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US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US20110085296A1 (en) * 2009-10-14 2011-04-14 Brandon Rubenstein Cooling System For A Computer Blade
US8339784B2 (en) * 2010-01-06 2012-12-25 Methode Electronics, Inc. Thermal management for electronic device housing
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
EP2681847B1 (de) * 2012-05-11 2015-09-09 Huawei Technologies Co., Ltd. Kühlsystem und verfahren zur kühlung einer funkeinheit
JP2014135396A (ja) * 2013-01-10 2014-07-24 Fujitsu Ltd 冷却ヘッド及び電子機器
US9713289B2 (en) * 2013-01-28 2017-07-18 Ch2M Hill Engineers, Inc. Modular pod
USD754664S1 (en) 2013-03-15 2016-04-26 Ch2M Hill Engineers, Inc. Modular pod
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US20150036292A1 (en) * 2013-08-01 2015-02-05 Lear Corporation Electrical Device for Use in an Automotive Vehicle and Method for Cooling Same
US9871358B2 (en) * 2015-01-30 2018-01-16 Abb Schweiz Ag Electrical switchgear system
WO2017094933A1 (ko) * 2015-12-03 2017-06-08 잘만테크 주식회사 냉각효율 증대를 위한 전자기기 케이스
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
TWI658776B (zh) * 2017-11-27 2019-05-01 宏碁股份有限公司 電子裝置的散熱系統
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JP7139684B2 (ja) * 2018-05-18 2022-09-21 富士通株式会社 冷却装置、及び電子機器
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
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US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
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Also Published As

Publication number Publication date
DE69634586T2 (de) 2006-03-02
EP0760527A3 (de) 1998-06-10
EP0760527A2 (de) 1997-03-05
JPH09128100A (ja) 1997-05-16
EP0760527B1 (de) 2005-04-13
US5563768A (en) 1996-10-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TERADATA US, INC., MIAMISBURG, OHIO, US