DE69633771D1 - Verfahren und gerät zum kontaktieren - Google Patents

Verfahren und gerät zum kontaktieren

Info

Publication number
DE69633771D1
DE69633771D1 DE69633771T DE69633771T DE69633771D1 DE 69633771 D1 DE69633771 D1 DE 69633771D1 DE 69633771 T DE69633771 T DE 69633771T DE 69633771 T DE69633771 T DE 69633771T DE 69633771 D1 DE69633771 D1 DE 69633771D1
Authority
DE
Germany
Prior art keywords
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69633771T
Other languages
English (en)
Other versions
DE69633771T2 (de
Inventor
Tommy Long
Mohamed Sabri
Lynn Saunders
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICROCONNECT CUPERTINO LLC
Original Assignee
MICROCONNECT CUPERTINO LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MICROCONNECT CUPERTINO LLC filed Critical MICROCONNECT CUPERTINO LLC
Application granted granted Critical
Publication of DE69633771D1 publication Critical patent/DE69633771D1/de
Publication of DE69633771T2 publication Critical patent/DE69633771T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
DE69633771T 1995-05-19 1996-05-20 Verfahren und gerät zum kontaktieren Expired - Fee Related DE69633771T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US446020 1989-12-05
US08/446,020 US5621333A (en) 1995-05-19 1995-05-19 Contact device for making connection to an electronic circuit device
PCT/US1996/007359 WO1996036884A1 (en) 1995-05-19 1996-05-20 Method and device for making connection

Publications (2)

Publication Number Publication Date
DE69633771D1 true DE69633771D1 (de) 2004-12-09
DE69633771T2 DE69633771T2 (de) 2005-10-27

Family

ID=23771024

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69633771T Expired - Fee Related DE69633771T2 (de) 1995-05-19 1996-05-20 Verfahren und gerät zum kontaktieren

Country Status (5)

Country Link
US (2) US5621333A (de)
EP (1) EP0781419B1 (de)
JP (1) JPH10505914A (de)
DE (1) DE69633771T2 (de)
WO (1) WO1996036884A1 (de)

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US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
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US20060273815A1 (en) * 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
US20070075717A1 (en) * 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7733106B2 (en) * 2005-09-19 2010-06-08 Formfactor, Inc. Apparatus and method of testing singulated dies
US7541819B2 (en) * 2005-10-28 2009-06-02 Teradyne, Inc. Modularized device interface with grounding insert between two strips
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
US7956633B2 (en) * 2006-03-06 2011-06-07 Formfactor, Inc. Stacked guard structures
CN101400991B (zh) * 2006-03-14 2013-03-20 应用材料公司 减小多个柱状电子束测试系统中的串扰的方法
JP4758826B2 (ja) * 2006-05-30 2011-08-31 株式会社日本マイクロニクス プローブユニット及び検査装置
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US7602199B2 (en) * 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing
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US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
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CN105050333B (zh) * 2015-06-25 2018-07-03 贵州天义技术有限公司 一种电子元件自动插装系统
JP7002572B2 (ja) * 2018-02-06 2022-01-20 株式会社日立ハイテク プローブ
JP7079799B2 (ja) * 2018-02-06 2022-06-02 株式会社日立ハイテク 半導体装置の評価装置
TWI718938B (zh) * 2020-04-20 2021-02-11 中華精測科技股份有限公司 分隔式薄膜探針卡及其彈性模組

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Also Published As

Publication number Publication date
JPH10505914A (ja) 1998-06-09
EP0781419A4 (de) 1998-09-02
US5621333A (en) 1997-04-15
EP0781419B1 (de) 2004-11-03
US6091256A (en) 2000-07-18
DE69633771T2 (de) 2005-10-27
EP0781419A1 (de) 1997-07-02
WO1996036884A1 (en) 1996-11-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee