DE69631573D1 - Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung - Google Patents
Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen VerwendungInfo
- Publication number
- DE69631573D1 DE69631573D1 DE69631573T DE69631573T DE69631573D1 DE 69631573 D1 DE69631573 D1 DE 69631573D1 DE 69631573 T DE69631573 T DE 69631573T DE 69631573 T DE69631573 T DE 69631573T DE 69631573 D1 DE69631573 D1 DE 69631573D1
- Authority
- DE
- Germany
- Prior art keywords
- prepreg
- manufacturing
- circuit board
- printed circuit
- board substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/02—Cellular or porous
- B32B2305/026—Porous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2400/00—Characterised by the use of unspecified polymers
- C08J2400/22—Thermoplastic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2400/00—Characterised by the use of unspecified polymers
- C08J2400/24—Thermosetting resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/902—High modulus filament or fiber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/91—Product with molecular orientation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/249928—Fiber embedded in a ceramic, glass, or carbon matrix
- Y10T428/249929—Fibers are aligned substantially parallel
- Y10T428/24993—Fiber is precoated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
- Y10T428/249942—Fibers are aligned substantially parallel
- Y10T428/249944—Fiber is precoated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2904—Staple length fiber
- Y10T428/2907—Staple length fiber with coating or impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2938—Coating on discrete and individual rods, strands or filaments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
- Y10T428/2967—Synthetic resin or polymer
- Y10T428/2969—Polyamide, polyimide or polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2008—Fabric composed of a fiber or strand which is of specific structural definition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
- Y10T442/2893—Coated or impregnated polyamide fiber fabric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
- Y10T442/2893—Coated or impregnated polyamide fiber fabric
- Y10T442/2902—Aromatic polyamide fiber fabric
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26704095 | 1995-10-16 | ||
JP26704095 | 1995-10-16 | ||
JP7873996 | 1996-04-01 | ||
JP7873996 | 1996-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69631573D1 true DE69631573D1 (de) | 2004-03-25 |
DE69631573T2 DE69631573T2 (de) | 2004-12-16 |
Family
ID=26419803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996631573 Expired - Lifetime DE69631573T2 (de) | 1995-10-16 | 1996-10-11 | Prepreg, Verfahren zu seiner Herstellung und gedrucktes Leiterplattensubstrat, das dasselbe verwendet |
Country Status (6)
Country | Link |
---|---|
US (2) | US5851646A (de) |
EP (1) | EP0768334B1 (de) |
KR (1) | KR100470262B1 (de) |
CA (1) | CA2187857A1 (de) |
DE (1) | DE69631573T2 (de) |
TW (1) | TW430678B (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0807703B1 (de) * | 1996-05-15 | 2002-10-02 | Matsushita Electric Industrial Co., Ltd | Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials |
US6205657B1 (en) | 1996-11-08 | 2001-03-27 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method for producing the same |
TW515812B (en) * | 1997-04-08 | 2003-01-01 | Sumitomo Chemical Co | Composite film made from low dielectric constant resin and para-oriented aromatic polyamide |
NL1007001C2 (nl) * | 1997-09-11 | 1999-03-12 | Dsm Nv | Velvormig prepreg. |
SE510487C2 (sv) * | 1997-09-17 | 1999-05-31 | Ericsson Telefon Ab L M | Flerlagerskretskort |
US6229096B1 (en) * | 1997-10-07 | 2001-05-08 | Mitsubishi Gas Chemical Company, Inc. | Nonwoven reinforcement for printed wiring base board and process for producing the same |
WO1999030542A1 (fr) * | 1997-12-11 | 1999-06-17 | Ibiden Co., Ltd. | Procede de fabrication d'une carte a circuit imprime multicouche |
JP2000294922A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | 多層プリント配線板用の絶縁樹脂組成物 |
US6245696B1 (en) | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
US6224965B1 (en) | 1999-06-25 | 2001-05-01 | Honeywell International Inc. | Microfiber dielectrics which facilitate laser via drilling |
US6352782B2 (en) * | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
US7235192B2 (en) | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
US6905637B2 (en) * | 2001-01-18 | 2005-06-14 | General Electric Company | Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6627704B2 (en) * | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6812276B2 (en) * | 1999-12-01 | 2004-11-02 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6878782B2 (en) * | 1999-12-01 | 2005-04-12 | General Electric | Thermoset composition, method, and article |
US6521703B2 (en) | 2000-01-18 | 2003-02-18 | General Electric Company | Curable resin composition, method for the preparation thereof, and articles derived thereform |
US6384176B1 (en) | 2000-07-10 | 2002-05-07 | General Electric Co. | Composition and process for the manufacture of functionalized polyphenylene ether resins |
JP2002094200A (ja) * | 2000-09-18 | 2002-03-29 | Matsushita Electric Ind Co Ltd | 回路基板用電気絶縁材と回路基板およびその製造方法 |
JP2002160316A (ja) * | 2000-11-27 | 2002-06-04 | Daikin Ind Ltd | 電気絶縁板、プリプレグ積層体及びこれらの製造方法 |
US6596406B2 (en) * | 2000-12-28 | 2003-07-22 | Nitto Denko Corporation | Wiring board prepreg and manufacturing method thereof |
US6593391B2 (en) | 2001-03-27 | 2003-07-15 | General Electric Company | Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation |
US6878781B2 (en) * | 2001-03-27 | 2005-04-12 | General Electric | Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom |
JP2002293979A (ja) | 2001-03-30 | 2002-10-09 | Sumitomo Chem Co Ltd | 多孔質パラ配向芳香族ポリアミドフィルム、そのプリプレグならびにプリプレグを使用するプリント回路用基材 |
JP2002319761A (ja) * | 2001-04-23 | 2002-10-31 | Nitto Denko Corp | 配線基板の製造方法 |
JP2002329974A (ja) * | 2001-05-01 | 2002-11-15 | Nitto Denko Corp | 配線基板及びその製造方法 |
JP2002337268A (ja) * | 2001-05-21 | 2002-11-27 | Nitto Denko Corp | 金属箔積層板及びその製造方法 |
JP2003078244A (ja) | 2001-06-18 | 2003-03-14 | Nitto Denko Corp | 多層配線基板及びその製造方法 |
JP2003008201A (ja) * | 2001-06-18 | 2003-01-10 | Nitto Denko Corp | 金属箔積層体の製造方法及び配線基板の製造方法 |
JP2003017862A (ja) * | 2001-07-02 | 2003-01-17 | Nitto Denko Corp | 多層配線基板の製造方法 |
US20030082974A1 (en) * | 2001-08-30 | 2003-05-01 | Samuels Michael R. | Solid sheet material especially useful for circuit boards |
WO2003074268A1 (en) | 2002-03-05 | 2003-09-12 | Hitachi Chemical Co., Ltd. | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof |
US20030215588A1 (en) * | 2002-04-09 | 2003-11-20 | Yeager Gary William | Thermoset composition, method, and article |
US6905941B2 (en) * | 2003-06-02 | 2005-06-14 | International Business Machines Corporation | Structure and method to fabricate ultra-thin Si channel devices |
US7226980B2 (en) * | 2003-08-07 | 2007-06-05 | General Electric Company | Thermoset composition, method for the preparation thereof, and articles prepared therefrom |
WO2005085335A1 (ja) | 2004-03-04 | 2005-09-15 | Hitachi Chemical Co., Ltd. | プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板 |
TW200615142A (en) * | 2004-06-30 | 2006-05-16 | Sumitomo Chemical Co | Films |
US20070149001A1 (en) * | 2005-12-22 | 2007-06-28 | Uka Harshad K | Flexible circuit |
KR100823998B1 (ko) * | 2007-05-28 | 2008-04-23 | 전자부품연구원 | 동박적층판, 인쇄회로기판 및 동박적층판의 제조방법 |
KR101728547B1 (ko) | 2010-07-05 | 2017-05-02 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 열경화성 수지 제조용 조성물 및 그의 경화물, 상기 경화물을 포함하는 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판 |
KR101452594B1 (ko) * | 2012-12-26 | 2014-10-21 | 주식회사 두산 | 수지 조성물 및 이를 포함하는 금속박 적층체 |
KR20200038814A (ko) * | 2018-10-04 | 2020-04-14 | 주식회사 엘지화학 | 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트 |
CN111303788A (zh) * | 2020-02-25 | 2020-06-19 | 深圳赛兰仕科创有限公司 | 高频复合材料及其制备方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB206049A (en) * | 1922-09-19 | 1923-11-01 | Walter Fenton | Improvements in or relating to lamps for projecting a concentrated beam of light |
GB1169613A (en) * | 1967-02-21 | 1969-11-05 | Ciba Ltd | Epoxide Resin Compositions |
DE2941785C2 (de) * | 1979-10-16 | 1991-07-04 | Technochemie Gmbh, Verfahrenstechnik, 6901 Dossenheim | Schichtstoffe und Verfahren zu ihrer Herstellung |
JPS5842699B2 (ja) * | 1981-05-25 | 1983-09-21 | 株式会社東芝 | 立軸回転電機の案内軸受装置 |
JPS61129629A (ja) * | 1984-11-29 | 1986-06-17 | Canon Inc | 複合プラスチック遮光羽根 |
JPH01141925A (ja) * | 1987-11-30 | 1989-06-02 | Honshu Paper Co Ltd | パラ配向アラミド繊維シートを基材とする改良複合材料 |
US4952689A (en) * | 1988-10-20 | 1990-08-28 | Taisho Pharmaceutical Co., Ltd. | 3-(substituted propylidene)-2-azetidinone derivates for blood platelet aggregation |
EP0441047B1 (de) * | 1990-01-19 | 1996-06-05 | Minnesota Mining And Manufacturing Company | Wärmehärtbare Zusammensetzung |
JP2897312B2 (ja) * | 1990-02-15 | 1999-05-31 | 東レ株式会社 | 耐熱性フィルム |
JP2956129B2 (ja) * | 1990-05-22 | 1999-10-04 | 東レ株式会社 | 微孔性フィルム |
JP2979610B2 (ja) * | 1990-09-07 | 1999-11-15 | 東レ株式会社 | フィルムの製造方法 |
WO1993000389A1 (en) * | 1991-06-26 | 1993-01-07 | E.I. Du Pont De Nemours And Company | Ballistic composite |
JP3059251B2 (ja) * | 1991-07-26 | 2000-07-04 | 三菱化学株式会社 | アミノリン酸型キレート樹脂の製造方法 |
JPH05327148A (ja) * | 1992-05-23 | 1993-12-10 | Toshiba Chem Corp | プリント回路用積層板 |
JPH06252555A (ja) * | 1993-02-26 | 1994-09-09 | Toshiba Corp | 多層配線基板 |
US5314742A (en) * | 1993-03-31 | 1994-05-24 | E. I. Du Pont De Nemours And Company | Resin impregnated laminate for wiring board applications |
JPH0753742A (ja) * | 1993-08-06 | 1995-02-28 | Toray Ind Inc | プリプレグ |
JP2587596B2 (ja) * | 1993-09-21 | 1997-03-05 | 松下電器産業株式会社 | 回路基板接続材とそれを用いた多層回路基板の製造方法 |
JP3505754B2 (ja) * | 1993-12-02 | 2004-03-15 | 東レ株式会社 | プリプレグおよびその製造方法 |
-
1996
- 1996-10-11 EP EP19960116329 patent/EP0768334B1/de not_active Expired - Lifetime
- 1996-10-11 DE DE1996631573 patent/DE69631573T2/de not_active Expired - Lifetime
- 1996-10-14 TW TW85112496A patent/TW430678B/zh not_active IP Right Cessation
- 1996-10-15 US US08/732,577 patent/US5851646A/en not_active Expired - Lifetime
- 1996-10-15 CA CA 2187857 patent/CA2187857A1/en not_active Abandoned
- 1996-10-16 KR KR1019960046131A patent/KR100470262B1/ko not_active IP Right Cessation
-
1998
- 1998-06-23 US US09/102,542 patent/US6033765A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2187857A1 (en) | 1997-04-17 |
EP0768334A2 (de) | 1997-04-16 |
KR970021155A (ko) | 1997-05-28 |
TW430678B (en) | 2001-04-21 |
EP0768334B1 (de) | 2004-02-18 |
US6033765A (en) | 2000-03-07 |
DE69631573T2 (de) | 2004-12-16 |
US5851646A (en) | 1998-12-22 |
EP0768334A3 (de) | 1997-06-04 |
KR100470262B1 (ko) | 2005-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69631573D1 (de) | Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung | |
DE69331511D1 (de) | Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung | |
DE69734947D1 (de) | Verfahren zur Herstellung von mehrschichtigen Leiterplatten | |
DE69419219T2 (de) | Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten | |
DE69636010D1 (de) | Gedruckte schaltungsplatte und verfahren zu deren herstellung | |
DE69934050D1 (de) | Gedruckte Leiterplatte und Verfahren zu deren Herstellung | |
DE69418698T2 (de) | Verfahren zur Herstellung von Leiterplatten | |
DE69931212D1 (de) | Leiterplatte und Verfahren zu deren Herstellung | |
DE69603931D1 (de) | Methode zur herstellung von mehrlagigen elektronischen komponenten | |
DE69939913D1 (de) | Gedruckte Schaltungsplatte und Verfahren zur Herstellung | |
DE68909853D1 (de) | Verfahren und Film zur Herstellung von gedruckten Schaltungsplatten. | |
DE69839882D1 (de) | Mehrschichtige gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69931272D1 (de) | Gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69937153D1 (de) | Gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69215338T2 (de) | Mehrschichtige Leiterplatte, Zwischenverbindungsteil und Verfahren zur Herstellung | |
DE69431828D1 (de) | Verfahren zur Herstellung von gedruckten Schaltungskarten | |
DE69634284D1 (de) | Verfahren zur Herstellung von mehrschichtigen Leiterplatten | |
DE69833193D1 (de) | Verfahren zur herstellung mehrerer elektronischer bauteile | |
DE69627971D1 (de) | Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung | |
DE69818485D1 (de) | Verfahren zur herstellung von elektronischen bauteilen | |
DE69924440D1 (de) | Prepreg, mehrschichtige gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung | |
DE69824133D1 (de) | Verfahren zur Herstellung von mehrschichtigen Leiterplatten | |
DE69935566D1 (de) | Gedruckte Leiterplatte und Verfahren zu ihrer Herstellung | |
DE69708814D1 (de) | Dielektrisches Material mit niedrigem Temperaturkoeffizient und mit hoher unbelasteten Qualität, Verfahren zur Herstellung und einzel/mehrschichtige gedruckte Leiterplatte mit diesem Material | |
DE60030908D1 (de) | Maskenfilm, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung einer Leiterplatte unter Verwendung desselben |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP |