DE69631566D1 - Vorrichtung und Verfahren zur Waschbehandlung - Google Patents
Vorrichtung und Verfahren zur WaschbehandlungInfo
- Publication number
- DE69631566D1 DE69631566D1 DE69631566T DE69631566T DE69631566D1 DE 69631566 D1 DE69631566 D1 DE 69631566D1 DE 69631566 T DE69631566 T DE 69631566T DE 69631566 T DE69631566 T DE 69631566T DE 69631566 D1 DE69631566 D1 DE 69631566D1
- Authority
- DE
- Germany
- Prior art keywords
- washing treatment
- washing
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18353795 | 1995-06-27 | ||
JP18353795A JP3250090B2 (ja) | 1995-06-27 | 1995-06-27 | 洗浄処理装置及び洗浄処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69631566D1 true DE69631566D1 (de) | 2004-03-25 |
DE69631566T2 DE69631566T2 (de) | 2004-07-29 |
Family
ID=16137567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69631566T Expired - Fee Related DE69631566T2 (de) | 1995-06-27 | 1996-06-26 | Vorrichtung und Verfahren zur Waschbehandlung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5868865A (de) |
EP (1) | EP0753884B1 (de) |
JP (1) | JP3250090B2 (de) |
KR (1) | KR100309029B1 (de) |
DE (1) | DE69631566T2 (de) |
TW (1) | TW300177B (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10321580A (ja) * | 1997-05-15 | 1998-12-04 | Tokyo Electron Ltd | 基板の洗浄ユニット及び洗浄システム |
AT407586B (de) | 1997-05-23 | 2001-04-25 | Sez Semiconduct Equip Zubehoer | Anordnung zum behandeln scheibenförmiger gegenstände, insbesondere von siliziumwafern |
AT407806B (de) * | 1997-05-23 | 2001-06-25 | Sez Semiconduct Equip Zubehoer | Anordnung zum behandeln wafer-förmiger gegenstände, insbesondere von siliziumwafern |
US5974681A (en) * | 1997-09-10 | 1999-11-02 | Speedfam-Ipec Corp. | Apparatus for spin drying a workpiece |
JP3788855B2 (ja) * | 1997-09-11 | 2006-06-21 | 大日本スクリーン製造株式会社 | 基板処理ユニットおよびそれを用いた基板処理装置 |
FR2772290B1 (fr) * | 1997-12-12 | 2000-03-17 | Sgs Thomson Microelectronics | Procede de nettoyage d'un polymere brome sur une plaquette de silicium |
FR2772291B1 (fr) * | 1997-12-12 | 2000-03-17 | Sgs Thomson Microelectronics | Procede de nettoyage d'un polymere contenant de l'aluminium sur une plaquette de silicium |
TW409191B (en) * | 1997-12-26 | 2000-10-21 | Hitachi Electr Eng | Method of treating the substrate liquid |
JP4213790B2 (ja) * | 1998-08-26 | 2009-01-21 | コバレントマテリアル株式会社 | 耐プラズマ部材およびそれを用いたプラズマ処理装置 |
US6350316B1 (en) * | 1998-11-04 | 2002-02-26 | Tokyo Electron Limited | Apparatus for forming coating film |
JP3352418B2 (ja) * | 1999-01-28 | 2002-12-03 | キヤノン株式会社 | 減圧処理方法及び減圧処理装置 |
JP2000334397A (ja) | 1999-05-31 | 2000-12-05 | Kokusai Electric Co Ltd | 板状試料の流体処理装置及び板状試料の流体処理方法 |
US6405399B1 (en) * | 1999-06-25 | 2002-06-18 | Lam Research Corporation | Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing |
KR20010027028A (ko) * | 1999-09-10 | 2001-04-06 | 이계안 | 공작물의 세정용 로보트 시스템 |
US6318389B1 (en) | 1999-10-29 | 2001-11-20 | Memc Electronic Materials, Inc. | Apparatus for cleaning semiconductor wafers |
JP3688976B2 (ja) * | 2000-05-24 | 2005-08-31 | 東京エレクトロン株式会社 | 処理液吐出装置 |
DE10030431A1 (de) * | 2000-06-21 | 2002-01-10 | Karl Suess Kg Praez Sgeraete F | Verfahren und Vorrichtung zum Reinigen und/oder Bonden von Substraten |
US6951221B2 (en) * | 2000-09-22 | 2005-10-04 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
JP3955724B2 (ja) * | 2000-10-12 | 2007-08-08 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
US20020096196A1 (en) * | 2001-01-23 | 2002-07-25 | Takayuki Toshima | Substrate processing apparatus and substrate processing method |
JP3511514B2 (ja) * | 2001-05-31 | 2004-03-29 | エム・エフエスアイ株式会社 | 基板浄化処理装置、ディスペンサー、基板保持機構、基板の浄化処理用チャンバー、及びこれらを用いた基板の浄化処理方法 |
JP2003031536A (ja) | 2001-07-12 | 2003-01-31 | Nec Corp | ウエハの洗浄方法 |
AT500984B1 (de) | 2002-06-25 | 2007-05-15 | Sez Ag | Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen |
JP2004055722A (ja) * | 2002-07-18 | 2004-02-19 | Renesas Technology Corp | 洗浄装置、基板の洗浄方法および半導体装置の製造方法 |
KR20020092864A (ko) * | 2002-11-01 | 2002-12-12 | 주식회사 엠오에이 | 피세정체의 표면 세정장치 |
US6938629B2 (en) * | 2002-11-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Rinsing lid for wet bench |
US20040115957A1 (en) * | 2002-12-17 | 2004-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for enhancing wet stripping of photoresist |
EP1761998A4 (de) * | 2004-02-27 | 2011-05-11 | Georgia Tech Res Inst | Harmonische cmut-vorrichtungen und herstellungsverfahren |
US7730898B2 (en) | 2005-03-01 | 2010-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer lifter |
KR20070044126A (ko) * | 2005-10-24 | 2007-04-27 | 주식회사 케이씨텍 | 웨이퍼 정렬장치 및 방법 |
US20080060676A1 (en) * | 2006-09-11 | 2008-03-13 | Dana Scranton | Workpiece processing with preheat |
KR100839913B1 (ko) * | 2007-01-12 | 2008-06-19 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
US8268087B2 (en) | 2007-12-27 | 2012-09-18 | Tokyo Electron Limited | Liquid processing apparatus, liquid processing method, and storage medium |
KR101042538B1 (ko) * | 2009-06-08 | 2011-06-17 | 세메스 주식회사 | 기판 처리 장치 |
KR101668139B1 (ko) | 2011-07-12 | 2016-10-20 | 도쿄엘렉트론가부시키가이샤 | 액처리 장치 및 액처리 방법 |
JP5588418B2 (ja) * | 2011-10-24 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
US20130233356A1 (en) * | 2012-03-12 | 2013-09-12 | Lam Research Ag | Process and apparatus for treating surfaces of wafer-shaped articles |
JP6577385B2 (ja) * | 2016-02-12 | 2019-09-18 | 株式会社荏原製作所 | 基板保持モジュール、基板処理装置、および基板処理方法 |
JP6736386B2 (ja) | 2016-07-01 | 2020-08-05 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法および記録媒体 |
KR20200094760A (ko) | 2017-12-01 | 2020-08-07 | 도쿄엘렉트론가부시키가이샤 | 기판 액 처리 장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57166032A (en) * | 1981-04-03 | 1982-10-13 | Toshiba Corp | Spray type developing device for positive resist |
US4827867A (en) * | 1985-11-28 | 1989-05-09 | Daikin Industries, Ltd. | Resist developing apparatus |
JPH084063B2 (ja) * | 1986-12-17 | 1996-01-17 | 富士通株式会社 | 半導体基板の保存方法 |
JPH03136232A (ja) * | 1989-08-31 | 1991-06-11 | Dainippon Screen Mfg Co Ltd | 基板の表面処理装置 |
JPH0432230A (ja) * | 1990-05-29 | 1992-02-04 | Tokyo Electron Ltd | ドライ洗浄装置 |
JP2732392B2 (ja) * | 1992-03-17 | 1998-03-30 | 信越半導体株式会社 | 半導体ウェーハの処理方法 |
US5395482A (en) * | 1992-11-13 | 1995-03-07 | Fuji Photo Film Co., Ltd. | Ultra high purity vapor phase treatment |
JP3277404B2 (ja) * | 1993-03-31 | 2002-04-22 | ソニー株式会社 | 基板洗浄方法及び基板洗浄装置 |
-
1995
- 1995-06-27 JP JP18353795A patent/JP3250090B2/ja not_active Expired - Lifetime
-
1996
- 1996-06-25 TW TW085107641A patent/TW300177B/zh not_active IP Right Cessation
- 1996-06-26 US US08/672,037 patent/US5868865A/en not_active Expired - Lifetime
- 1996-06-26 EP EP96110307A patent/EP0753884B1/de not_active Expired - Lifetime
- 1996-06-26 DE DE69631566T patent/DE69631566T2/de not_active Expired - Fee Related
- 1996-06-27 KR KR1019960024416A patent/KR100309029B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW300177B (de) | 1997-03-11 |
EP0753884B1 (de) | 2004-02-18 |
JPH0917761A (ja) | 1997-01-17 |
KR100309029B1 (ko) | 2001-12-17 |
JP3250090B2 (ja) | 2002-01-28 |
EP0753884A2 (de) | 1997-01-15 |
DE69631566T2 (de) | 2004-07-29 |
EP0753884A3 (de) | 1997-07-09 |
KR970003595A (ko) | 1997-01-28 |
US5868865A (en) | 1999-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |