DE69623169D1 - Steuersystem für Werkzeuge zur Halbleitersprühbehandlung - Google Patents

Steuersystem für Werkzeuge zur Halbleitersprühbehandlung

Info

Publication number
DE69623169D1
DE69623169D1 DE69623169T DE69623169T DE69623169D1 DE 69623169 D1 DE69623169 D1 DE 69623169D1 DE 69623169 T DE69623169 T DE 69623169T DE 69623169 T DE69623169 T DE 69623169T DE 69623169 D1 DE69623169 D1 DE 69623169D1
Authority
DE
Germany
Prior art keywords
computer
spray
supervisor
computers
host system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69623169T
Other languages
English (en)
Other versions
DE69623169T2 (de
Inventor
Jay J Seaton
Michael Allen
Donald Landis
Patrick Lee
David Linzy
Susan B Luca
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE69623169D1 publication Critical patent/DE69623169D1/de
Application granted granted Critical
Publication of DE69623169T2 publication Critical patent/DE69623169T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31145Ethernet
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31151Lan local area network
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31207Master sends global files to autonomous controllers, feedback of process status
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31288Archive collected data into history file
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31402Keep log book, for activities of a station, equipment
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31443Keep track of nc program, recipe program
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32095Text, menu driven editor for batch programming, phase sequence, parameters
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32404Scada supervisory control and data acquisition
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32412One engineering, workstation can supervise several processes
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/36Nc in input of data, input key till input tape
    • G05B2219/36116Harddisk
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45026Circuit board, pcb
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80Management or planning
DE69623169T 1995-04-28 1996-04-22 Steuersystem für Werkzeuge zur Halbleitersprühbehandlung Expired - Lifetime DE69623169T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/430,329 US5591299A (en) 1995-04-28 1995-04-28 System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools

Publications (2)

Publication Number Publication Date
DE69623169D1 true DE69623169D1 (de) 2002-10-02
DE69623169T2 DE69623169T2 (de) 2003-04-30

Family

ID=23707063

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69623169T Expired - Lifetime DE69623169T2 (de) 1995-04-28 1996-04-22 Steuersystem für Werkzeuge zur Halbleitersprühbehandlung

Country Status (5)

Country Link
US (1) US5591299A (de)
EP (1) EP0740241B1 (de)
JP (1) JPH09115876A (de)
AT (1) ATE223078T1 (de)
DE (1) DE69623169T2 (de)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI249760B (en) * 1996-07-31 2006-02-21 Canon Kk Remote maintenance system
JPH10106917A (ja) * 1996-10-02 1998-04-24 Toshiba Corp 半導体装置製造用生産システム
US5780363A (en) * 1997-04-04 1998-07-14 International Business Machines Coporation Etching composition and use thereof
US5904863A (en) * 1997-04-30 1999-05-18 Coates Asi, Inc. Process for etching trace side walls
JP3393035B2 (ja) * 1997-05-06 2003-04-07 東京エレクトロン株式会社 制御装置及び半導体製造装置
JPH10326729A (ja) * 1997-05-26 1998-12-08 Toshiba Corp 製造システム
US6269279B1 (en) * 1997-06-20 2001-07-31 Tokyo Electron Limited Control system
US5965465A (en) * 1997-09-18 1999-10-12 International Business Machines Corporation Etching of silicon nitride
US6150282A (en) * 1997-11-13 2000-11-21 International Business Machines Corporation Selective removal of etching residues
US6033996A (en) * 1997-11-13 2000-03-07 International Business Machines Corporation Process for removing etching residues, etching mask and silicon nitride and/or silicon dioxide
KR19990065483A (ko) * 1998-01-14 1999-08-05 윤종용 반도체 제조설비 관리시스템의 설비 유닛상태 관리방법
US6292708B1 (en) * 1998-06-11 2001-09-18 Speedfam-Ipec Corporation Distributed control system for a semiconductor wafer processing machine
US6200891B1 (en) 1998-08-13 2001-03-13 International Business Machines Corporation Removal of dielectric oxides
US6117796A (en) * 1998-08-13 2000-09-12 International Business Machines Corporation Removal of silicon oxide
JP2000066706A (ja) * 1998-08-21 2000-03-03 Matsushita Electric Ind Co Ltd ロボット制御装置とその制御方法
JP2000075907A (ja) * 1998-09-01 2000-03-14 Yokogawa Electric Corp 生産システム
US6732053B1 (en) * 1998-09-30 2004-05-04 Intel Corporation Method and apparatus for controlling a test cell
US6629003B1 (en) * 1998-12-04 2003-09-30 Vector Corporation Batch processing control system recipe management and batch information system
WO2000036479A1 (en) * 1998-12-16 2000-06-22 Speedfam-Ipec Corporation An equipment virtual controller
AUPP776498A0 (en) 1998-12-17 1999-01-21 Portus Pty Ltd Local and remote monitoring using a standard web browser
US6768930B2 (en) 1998-12-31 2004-07-27 Asml Holding N.V. Method and apparatus for resolving conflicts in a substrate processing system
US6418356B1 (en) 1998-12-31 2002-07-09 Silicon Valley Group, Inc. Method and apparatus for resolving conflicts in a substrate processing system
US6865437B1 (en) 1998-12-31 2005-03-08 Asml Holdings N.V. Robot pre-positioning in a wafer processing system
US6678572B1 (en) 1998-12-31 2004-01-13 Asml Holdings, N.V. Recipe cascading in a wafer processing system
US6573141B1 (en) * 1999-03-12 2003-06-03 Zilog, Inc. In-situ etch and pre-clean for high quality thin oxides
KR100303322B1 (ko) * 1999-05-20 2001-09-26 박종섭 반도체 라인 관리를 위한 통합 자동화 시스템 및 그 방법
AU5636600A (en) * 1999-06-23 2001-01-09 Silicon Valley Group, Inc. Robot pre-positioning in a wafer processing system
JP4603131B2 (ja) * 1999-06-28 2010-12-22 株式会社ハイニックスセミコンダクター 半導体製造システムの工程レシピ再設定装置及び工程レシピ再設定方法
US6834370B1 (en) * 1999-07-08 2004-12-21 Osi Software, Inc. Method for creating master recipes
US6826439B1 (en) * 2000-05-23 2004-11-30 Advanced Micro Devices, Inc. Broadband distribution of SECS-II data
FR2810432B1 (fr) * 2000-06-15 2002-11-22 Bull Sa Procede de gestion de controle de coherence de parametres associes a des ressources physiques et/ou logiques dans un systeme informatique
US6461878B1 (en) * 2000-07-12 2002-10-08 Advanced Micro Devices, Inc. Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode
JP2002027567A (ja) * 2000-07-12 2002-01-25 Hitachi Kokusai Electric Inc 半導体製造装置のリモート操作システム、半導体製造装置および遠隔操作装置
JP2002041115A (ja) * 2000-07-25 2002-02-08 Fuji Photo Film Co Ltd 工程管理システムおよび工程管理プログラム記憶媒体
IT1320637B1 (it) 2000-09-12 2003-12-10 Bottero Spa Supervisore per una linea per la fabbricazione di articoli di vetrocavo.
US6671570B2 (en) * 2000-10-17 2003-12-30 Brooks Automation, Inc. System and method for automated monitoring and assessment of fabrication facility
FR2815746B1 (fr) * 2000-10-19 2005-04-08 Patrick Yves Raymond Jost Systeme de pilotage par lot, d'ordre de realisation monophase a processus connexe, destine a toute realisation technique, materialisee ou non, devant respecter un sequence operation de mise en oeuvre
JP2002136936A (ja) * 2000-11-02 2002-05-14 Ecolab Kk 洗浄処理方法およびシステム、情報記憶媒体
US8181338B2 (en) * 2000-11-02 2012-05-22 Danfoss A/S Method of making a multilayer composite
US7548015B2 (en) * 2000-11-02 2009-06-16 Danfoss A/S Multilayer composite and a method of making such
US6990380B2 (en) * 2000-12-27 2006-01-24 Tokyo Electron Limited Substrate processing apparatus and information storage apparatus and method
US7031792B2 (en) * 2001-04-04 2006-04-18 Tokyo Electron Limited Processing apparatus and information storage apparatus and method
US20020198964A1 (en) * 2001-06-26 2002-12-26 International Business Machines Corporation Method and system for wireless remote monitoring and control of a manufacturing execution system
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
US7152068B2 (en) 2001-12-21 2006-12-19 Honeywell International Inc. Method and apparatus for retrieving time series data related to an activity
US7027954B2 (en) 2001-12-21 2006-04-11 Honeywell International Inc. Method and apparatus for retrieving activity data related to an activity
US7225193B2 (en) * 2001-12-21 2007-05-29 Honeywell International Inc. Method and apparatus for retrieving event data related to an activity
US7496591B2 (en) 2001-12-21 2009-02-24 Honeywell International Inc. Method and system for capturing, storing and retrieving events and activities
US6776872B2 (en) * 2002-03-05 2004-08-17 Hitachi, Ltd. Data processing apparatus for semiconductor processing apparatus
US6748288B2 (en) * 2002-04-30 2004-06-08 Macronix International Co., Ltd. Semiconductor wafer manufacturing execution system with recipe distribution management database
TWI239032B (en) * 2002-06-28 2005-09-01 Tokyo Electron Ltd Method and system for controlling a process using material processing tool and performance data
US7123974B1 (en) 2002-11-19 2006-10-17 Rockwell Software Inc. System and methodology providing audit recording and tracking in real time industrial controller environment
JP2004336024A (ja) * 2003-04-16 2004-11-25 Tokyo Electron Ltd 基板処理システム、基板処理方法及び該方法を実行するプログラム
US7065424B1 (en) 2004-03-04 2006-06-20 National Semiconductor Corporation Systems and methods that monitor re-qualification indicia associated with durable items to ensure physical process quality
US7647132B2 (en) * 2004-05-05 2010-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for problem case packaging
US7058469B2 (en) * 2004-06-24 2006-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for fully automatic manufacturing control in a furnace area of a semiconductor foundry
WO2006062096A1 (ja) * 2004-12-07 2006-06-15 Nikon Corporation 露光装置及びデバイス製造方法
KR101192676B1 (ko) * 2006-01-27 2012-10-19 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치
US8014887B2 (en) * 2006-03-22 2011-09-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP5224744B2 (ja) * 2006-10-04 2013-07-03 株式会社日立国際電気 基板処理装置
JP5020605B2 (ja) * 2006-11-16 2012-09-05 東京エレクトロン株式会社 上位制御装置、下位制御装置、画面の操作権付与方法および画面の操作権付与プログラムを記憶した記憶媒体
US8135824B2 (en) * 2007-10-01 2012-03-13 Ebay Inc. Method and system to detect a network deficiency
US8234012B1 (en) * 2008-09-26 2012-07-31 Intermolecular, Inc. Preparing a chemical delivery line of a chemical dispense system for delivery
JP5042266B2 (ja) * 2009-04-27 2012-10-03 株式会社日立国際電気 半導体製造装置及び半導体製造装置の表示方法及びレシピ制御方法及びレシピ実行プログラム
JP2012080107A (ja) * 2011-11-08 2012-04-19 Hitachi Kokusai Electric Inc 固体デバイス製造装置、固体デバイスの製造方法、固体デバイス製造装置の基板搬送方法及びレシピ作成方法
CN104794568B (zh) * 2015-04-09 2018-09-28 杭州滨鸿光电科技有限公司 数字存储系统
US10549301B2 (en) * 2016-03-08 2020-02-04 Carlisle Fluid Technologies, Inc. System and method for monitoring and improving operation of spray tool
US10783290B2 (en) * 2017-09-28 2020-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. IC manufacturing recipe similarity evaluation methods and systems

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3630804A (en) * 1968-08-19 1971-12-28 Chemcut Corp Etching apparatus
US4027246A (en) * 1976-03-26 1977-05-31 International Business Machines Corporation Automated integrated circuit manufacturing system
HU198345B (en) * 1985-10-15 1989-09-28 Numerik Karl Marx Veb Hierarchical control system
US4827423A (en) * 1987-01-20 1989-05-02 R. J. Reynolds Tobacco Company Computer integrated manufacturing system
EP0397924B1 (de) * 1989-05-17 1995-11-29 Koninklijke Philips Electronics N.V. Steuermodul für eine Arbeitsstation
JP3309997B2 (ja) * 1991-09-05 2002-07-29 株式会社日立製作所 複合処理装置
DE4312931A1 (de) * 1992-05-08 1993-12-02 Siemens Ag Führungsverfahren für ein Automatisierungssystem
GB2281132A (en) * 1993-08-13 1995-02-22 Dunbar Limited A process control method
US5445705A (en) * 1994-06-30 1995-08-29 International Business Machines Corporation Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process

Also Published As

Publication number Publication date
JPH09115876A (ja) 1997-05-02
ATE223078T1 (de) 2002-09-15
EP0740241A3 (de) 1998-08-12
DE69623169T2 (de) 2003-04-30
EP0740241A2 (de) 1996-10-30
EP0740241B1 (de) 2002-08-28
US5591299A (en) 1997-01-07

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