DE69622427D1 - Herstellungsüberwachung und analyse mittels statistischer simulation mit einzelschritt-feedback - Google Patents

Herstellungsüberwachung und analyse mittels statistischer simulation mit einzelschritt-feedback

Info

Publication number
DE69622427D1
DE69622427D1 DE69622427T DE69622427T DE69622427D1 DE 69622427 D1 DE69622427 D1 DE 69622427D1 DE 69622427 T DE69622427 T DE 69622427T DE 69622427 T DE69622427 T DE 69622427T DE 69622427 D1 DE69622427 D1 DE 69622427D1
Authority
DE
Germany
Prior art keywords
analysis
manufacturing monitoring
statistical simulation
step feedback
feedback
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69622427T
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English (en)
Other versions
DE69622427T2 (de
Inventor
Chun Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE69622427D1 publication Critical patent/DE69622427D1/de
Publication of DE69622427T2 publication Critical patent/DE69622427T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69622427T 1995-12-04 1996-09-27 Herstellungsüberwachung und analyse mittels statistischer simulation mit einzelschritt-feedback Expired - Fee Related DE69622427T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/566,529 US5719796A (en) 1995-12-04 1995-12-04 System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
PCT/US1996/015511 WO1997021244A1 (en) 1995-12-04 1996-09-27 A system for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback

Publications (2)

Publication Number Publication Date
DE69622427D1 true DE69622427D1 (de) 2002-08-22
DE69622427T2 DE69622427T2 (de) 2003-03-20

Family

ID=24263283

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622427T Expired - Fee Related DE69622427T2 (de) 1995-12-04 1996-09-27 Herstellungsüberwachung und analyse mittels statistischer simulation mit einzelschritt-feedback

Country Status (6)

Country Link
US (2) US5719796A (de)
EP (1) EP0865666B1 (de)
JP (1) JP2000517473A (de)
KR (1) KR19990071784A (de)
DE (1) DE69622427T2 (de)
WO (1) WO1997021244A1 (de)

Families Citing this family (210)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09171521A (ja) * 1995-12-20 1997-06-30 Sony Corp 半導体のシミュレーション方法及び装置
US6304836B1 (en) 1996-10-28 2001-10-16 Advanced Micro Devices Worst case design parameter extraction for logic technologies
US5940604A (en) * 1996-11-19 1999-08-17 Unisys Corporation Method and apparatus for monitoring the performance of a circuit optimization tool
US6480751B1 (en) * 1997-01-16 2002-11-12 Matsushita Electric Industrial Co., Ltd. Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods
US6104964A (en) * 1997-02-06 2000-08-15 Matsushita Electric Industrial Co., Ltd. Processing rate calculation apparatus, a processing rate calculation method, and a computer readable recording medium having thereon a processing rate calculation program
JP3102372B2 (ja) * 1997-02-27 2000-10-23 日本電気株式会社 イオン注入プロセスシミュレーション方法
US5914879A (en) * 1997-03-04 1999-06-22 Advanced Micro Devices System and method for calculating cluster tool performance metrics using a weighted configuration matrix
US6116766A (en) * 1997-04-15 2000-09-12 Maseeh; Fariborz Fabrication based computer aided design system using virtual fabrication techniques
JPH10301979A (ja) * 1997-04-30 1998-11-13 Oki Electric Ind Co Ltd モデルパラメータ抽出方法およびモデルパラメータ抽出装置
JPH10335193A (ja) * 1997-05-30 1998-12-18 Toshiba Corp 製造工程仕様作成運営システム、プロセスデータ作成システム及び半導体装置の製造方法
JPH1116795A (ja) * 1997-06-25 1999-01-22 Sony Corp 半導体特性シミユレーシヨン装置及びその方法
US6097887A (en) * 1997-10-27 2000-08-01 Kla-Tencor Corporation Software system and method for graphically building customized recipe flowcharts
US6154711A (en) * 1997-12-05 2000-11-28 Advanced Micro Devices, Inc. Disposition tool for factory process control
US6151532A (en) * 1998-03-03 2000-11-21 Lam Research Corporation Method and apparatus for predicting plasma-process surface profiles
JP3612995B2 (ja) * 1998-03-26 2005-01-26 ソニー株式会社 最大理論収量の自動計算装置および最大理論収量の自動計算をコンピュータに実行させるためのプログラムを記憶したコンピュータ読み取り可能な記録媒体
US6327555B1 (en) * 1998-04-28 2001-12-04 Sony Corporation Semiconductor simulation method
US6028994A (en) * 1998-05-06 2000-02-22 Advanced Micro Devices Method for predicting performance of microelectronic device based on electrical parameter test data using computer model
JP3228220B2 (ja) * 1998-05-15 2001-11-12 日本電気株式会社 イオン注入シミュレーション方法
US6925346B1 (en) * 1998-06-30 2005-08-02 Jyoti Mazumder Closed-loop, rapid manufacturing of three-dimensional components using direct metal deposition
US6366822B1 (en) * 1998-08-04 2002-04-02 Advanced Micro Devices, Inc. Statistical process window design methodology
US6272392B1 (en) * 1998-12-04 2001-08-07 Advanced Micro Devices, Inc. Methodology for extracting effective lens aberrations using a neural network
US6148494A (en) * 1999-04-08 2000-11-21 General Electric Company Floating fastener tolerance method
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
JP3164106B2 (ja) * 1999-06-29 2001-05-08 日本電気株式会社 集積回路の故障検出方法及び故障検出装置及びその制御プログラムを記録した記憶媒体
US6556959B1 (en) * 1999-07-12 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for updating a manufacturing model based upon fault data relating to processing of semiconductor wafers
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6636818B1 (en) 1999-09-15 2003-10-21 Becton, Dickinson And Company Systems, methods and computer program products for constructing sampling plans for items that are manufactured
KR100335492B1 (ko) * 1999-10-26 2002-05-04 윤종용 간편한 모델 파라미터 집합 추출 방법과 이를 이용한 집적회로의 통계적 시뮬레이션 방법
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6449524B1 (en) * 2000-01-04 2002-09-10 Advanced Micro Devices, Inc. Method and apparatus for using equipment state data for run-to-run control of manufacturing tools
US6421571B1 (en) 2000-02-29 2002-07-16 Bently Nevada Corporation Industrial plant asset management system: apparatus and method
US6629044B1 (en) * 2000-03-17 2003-09-30 General Electric Company Electrical distribution analysis method and apparatus
US6430522B1 (en) * 2000-03-27 2002-08-06 The United States Of America As Represented By The Secretary Of The Navy Enhanced model identification in signal processing using arbitrary exponential functions
US6968303B1 (en) * 2000-04-13 2005-11-22 Advanced Micro Devices, Inc. Automated system for extracting and combining tool trace data and wafer electrical test (WET) data for semiconductor processing
US6622059B1 (en) * 2000-04-13 2003-09-16 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
US6847976B1 (en) * 2000-06-15 2005-01-25 Terrence B. Peace Method and apparatus for significance testing and confidence interval construction based on user-specified distribution
US20040172401A1 (en) * 2000-06-15 2004-09-02 Peace Terrence B. Significance testing and confidence interval construction based on user-specified distributions
US6556884B1 (en) 2000-06-16 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework
US7245980B1 (en) * 2000-07-03 2007-07-17 Wright Williams & Kelly, Inc. Method and apparatus for calculation of production quantities
GB2404787B (en) * 2000-07-05 2005-04-13 Metryx Ltd Apparatus and method for investigating semiconductor wafers
GB0016562D0 (en) * 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
JP2002023823A (ja) * 2000-07-12 2002-01-25 Mitsubishi Electric Corp 生産管理システム
US6410351B1 (en) * 2000-07-13 2002-06-25 Advanced Micro Devices, Inc. Method and apparatus for modeling thickness profiles and controlling subsequent etch process
FR2812401B1 (fr) * 2000-07-28 2002-10-11 Bealach Bo No Finne Teo Ta Gal Procede de test de composants electroniques tenant compte de la derive de la moyenne
US6708073B1 (en) * 2000-08-10 2004-03-16 Advanced Micro Devices, Inc. Lot specific process design methodology
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US6782337B2 (en) 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US7139083B2 (en) 2000-09-20 2006-11-21 Kla-Tencor Technologies Corp. Methods and systems for determining a composition and a thickness of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US7188142B2 (en) * 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7096176B1 (en) 2000-12-04 2006-08-22 Alcatel Optical route design system and method for analyzing the performance of an optical fiber transmission path
US6856849B2 (en) * 2000-12-06 2005-02-15 Advanced Micro Devices, Inc. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters
JP4553496B2 (ja) * 2001-01-24 2010-09-29 株式会社日立国際電気 半導体製造装置のトレーニングシステム
US6968300B2 (en) * 2001-01-26 2005-11-22 Dell Products L.P. Computer system and printed circuit board manufactured in accordance with a quasi-Monte Carlo simulation technique for multi-dimensional spaces
US7050957B2 (en) * 2001-02-26 2006-05-23 Agere Systems Inc. Projection electron beam lithography apparatus and method employing an estimator
US20020128735A1 (en) * 2001-03-08 2002-09-12 Hawkins Parris C.M. Dynamic and extensible task guide
US20020138321A1 (en) * 2001-03-20 2002-09-26 Applied Materials, Inc. Fault tolerant and automated computer software workflow
US6999164B2 (en) * 2001-04-26 2006-02-14 Tokyo Electron Limited Measurement system cluster
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
US6839655B2 (en) 2001-05-25 2005-01-04 University Of Chicago System for monitoring non-coincident, nonstationary process signals
US6934671B2 (en) * 2001-05-29 2005-08-23 International Business Machines Corporation Method and system for including parametric in-line test data in simulations for improved model to hardware correlation
KR100413541B1 (ko) * 2001-06-08 2003-12-31 강신원 액정 표시장치 백라이트용 산란형 도광판 설계 시뮬레이터.
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7160739B2 (en) * 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7201936B2 (en) * 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6913938B2 (en) * 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US6842659B2 (en) * 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
EP1329771B1 (de) * 2001-10-09 2006-09-06 ASML MaskTools B.V. Methode zur Kalibrierung und Optimierung einer 2-dimensionalen Modellierung von Mustern
JP2003133200A (ja) * 2001-10-19 2003-05-09 Canon Inc シミュレーション装置及びシミュレーション方法
US7672895B2 (en) * 2002-02-19 2010-03-02 Trading Technologies International, Inc. System and method for simulating an electronic trading environment
US7136796B2 (en) * 2002-02-28 2006-11-14 Timbre Technologies, Inc. Generation and use of integrated circuit profile-based simulation information
US7225047B2 (en) * 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) * 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6672716B2 (en) * 2002-04-29 2004-01-06 Xerox Corporation Multiple portion solid ink stick
JP3660328B2 (ja) * 2002-06-21 2005-06-15 ファナック株式会社 レーザ加工機
US7092110B2 (en) * 2002-07-25 2006-08-15 Timbre Technologies, Inc. Optimized model and parameter selection for optical metrology
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
KR20050026099A (ko) * 2002-08-01 2005-03-14 어플라이드 머티어리얼즈 인코포레이티드 고급 처리 제어 시스템 내의 부정확한 계측 데이터의 취급방법, 시스템 및 매체
US20040030667A1 (en) * 2002-08-02 2004-02-12 Capital One Financial Corporation Automated systems and methods for generating statistical models
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
US7752115B2 (en) 2002-10-02 2010-07-06 Trading Technologies International, Inc. Method and apparatus for a fair exchange
US20040088068A1 (en) * 2002-10-31 2004-05-06 Daniel Kadosh Method and apparatus for providing first-principles feed-forward manufacturing control
AU2003290932A1 (en) * 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7340318B1 (en) * 2002-12-20 2008-03-04 Advanced Micro Devices, Inc. Method and apparatus for assessing controller performance
US7333871B2 (en) * 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20040230328A1 (en) * 2003-03-21 2004-11-18 Steve Armstrong Remote data visualization within an asset data system for a process plant
US7205228B2 (en) * 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US20050014299A1 (en) * 2003-07-15 2005-01-20 Applied Materials, Inc. Control of metal resistance in semiconductor products via integrated metrology
US7354332B2 (en) * 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
DE10345551A1 (de) * 2003-09-30 2005-05-04 Infineon Technologies Ag Verfahren zum Charakterisieren einer Schicht
US8296687B2 (en) * 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8036869B2 (en) * 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8032348B2 (en) * 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8014991B2 (en) * 2003-09-30 2011-09-06 Tokyo Electron Limited System and method for using first-principles simulation to characterize a semiconductor manufacturing process
EP1530083A3 (de) * 2003-11-05 2006-03-01 ASML MaskTools B.V. Korrektur optischer Naheffekte basiert auf Zerlegung in Eigenfunktionen
JP4051332B2 (ja) * 2003-11-07 2008-02-20 株式会社日立ハイテクノロジーズ 検査データ解析システム
US6904370B1 (en) 2003-12-30 2005-06-07 Compliance Software Solutions Corp. System, method, and computer-readable medium for collection of environmental data and generation of user report for compliance with FDA requirements
US20060242005A1 (en) * 2004-01-08 2006-10-26 Rodney Rodrigue Comprehensive method to improve manufacturing
US7356377B2 (en) * 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7342646B2 (en) * 2004-01-30 2008-03-11 Asml Masktools B.V. Method of manufacturing reliability checking and verification for lithography process using a calibrated eigen decomposition model
KR100824031B1 (ko) 2004-01-30 2008-04-21 에이에스엠엘 마스크툴즈 비.브이. 캘리브레이션된 고유 분해 모델을 이용하여 노광 툴들의믹스/매치로 인한 모델 opc 편차를 예측하고최소화하는 방법
KR100606854B1 (ko) * 2004-03-06 2006-08-01 최준수 도광판의 광반사 패턴의 최적 설계 방법
US20050228737A1 (en) * 2004-03-26 2005-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor manufacturing capacity features exchange system
US7729789B2 (en) * 2004-05-04 2010-06-01 Fisher-Rosemount Systems, Inc. Process plant monitoring based on multivariate statistical analysis and on-line process simulation
US7096085B2 (en) * 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
JP2005345201A (ja) * 2004-06-01 2005-12-15 Denso Corp 走行軌跡表示装置及びプログラム
US7116411B2 (en) * 2004-08-26 2006-10-03 Asml Masktools B.V. Method of performing resist process calibration/optimization and DOE optimization for providing OPE matching between different lithography systems
CN1800971A (zh) * 2004-09-14 2006-07-12 Asml蒙片工具有限公司 一种用于实施全芯片制造可靠性检查和校正的方法
JP4792274B2 (ja) * 2004-10-29 2011-10-12 パナソニック株式会社 等価材料定数算出システム、等価材料定数算出プログラム、等価材料定数算出方法、設計システムおよび構造体の製造方法
US8364610B2 (en) 2005-04-08 2013-01-29 Caterpillar Inc. Process modeling and optimization method and system
US7877239B2 (en) 2005-04-08 2011-01-25 Caterpillar Inc Symmetric random scatter process for probabilistic modeling system for product design
US8209156B2 (en) 2005-04-08 2012-06-26 Caterpillar Inc. Asymmetric random scatter process for probabilistic modeling system for product design
US7565333B2 (en) 2005-04-08 2009-07-21 Caterpillar Inc. Control system and method
US7499777B2 (en) * 2005-04-08 2009-03-03 Caterpillar Inc. Diagnostic and prognostic method and system
US7355728B2 (en) * 2005-06-16 2008-04-08 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US7876845B2 (en) 2005-06-22 2011-01-25 Eices Research, Inc. Wireless communications systems and/or methods providing low interference, high privacy and/or cognitive flexibility
US8670493B2 (en) 2005-06-22 2014-03-11 Eices Research, Inc. Systems and/or methods of increased privacy wireless communications
WO2007001707A2 (en) * 2005-06-22 2007-01-04 Eices Research, Inc. Systems, methods, devices and/or computer program products for providing communications devoid of cyclostationary features
USRE47633E1 (en) 2005-06-22 2019-10-01 Odyssey Wireless Inc. Systems/methods of conducting a financial transaction using a smartphone
US8233554B2 (en) 2010-03-29 2012-07-31 Eices Research, Inc. Increased capacity communications for OFDM-based wireless communications systems/methods/devices
JP4874606B2 (ja) * 2005-09-12 2012-02-15 株式会社東芝 用力設備設計装置、自動用力設備設計方法及び用力設備設計プログラム
US7487134B2 (en) 2005-10-25 2009-02-03 Caterpillar Inc. Medical risk stratifying method and system
JP4335862B2 (ja) 2005-11-08 2009-09-30 富士通マイクロエレクトロニクス株式会社 半導体集積回路の特性抽出方法及び特性抽出装置
US7499842B2 (en) 2005-11-18 2009-03-03 Caterpillar Inc. Process model based virtual sensor and method
US7493589B2 (en) * 2005-12-29 2009-02-17 Asml Masktools B.V. Method, program product and apparatus for model based geometry decomposition for use in a multiple exposure process
US7505949B2 (en) 2006-01-31 2009-03-17 Caterpillar Inc. Process model error correction method and system
CA2576778C (en) * 2006-02-07 2014-09-02 Xinping Huang Self-calibrating multi-port circuit and method
JP2007218711A (ja) * 2006-02-16 2007-08-30 Hitachi High-Technologies Corp 電子顕微鏡装置を用いた計測対象パターンの計測方法
JP4256408B2 (ja) * 2006-07-20 2009-04-22 株式会社東芝 不良確率の算出方法、パターン作成方法及び半導体装置の製造方法
US8478506B2 (en) 2006-09-29 2013-07-02 Caterpillar Inc. Virtual sensor based engine control system and method
US8294907B2 (en) * 2006-10-13 2012-10-23 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7483774B2 (en) 2006-12-21 2009-01-27 Caterpillar Inc. Method and system for intelligent maintenance
US7525307B2 (en) * 2006-12-27 2009-04-28 Hitachi Global Storage Technologies Netherlands B.V. System and method for hard drive component testing
US8032349B2 (en) * 2007-01-25 2011-10-04 International Business Machines Corporation Efficient methodology for the accurate generation of customized compact model parameters from electrical test data
US7787969B2 (en) 2007-06-15 2010-08-31 Caterpillar Inc Virtual sensor system and method
US7831416B2 (en) 2007-07-17 2010-11-09 Caterpillar Inc Probabilistic modeling system for product design
US7788070B2 (en) 2007-07-30 2010-08-31 Caterpillar Inc. Product design optimization method and system
US7999920B2 (en) 2007-08-22 2011-08-16 Asml Netherlands B.V. Method of performing model-based scanner tuning
US7542879B2 (en) 2007-08-31 2009-06-02 Caterpillar Inc. Virtual sensor based control system and method
GB0719469D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
US7593804B2 (en) 2007-10-31 2009-09-22 Caterpillar Inc. Fixed-point virtual sensor control system and method
US8224468B2 (en) 2007-11-02 2012-07-17 Caterpillar Inc. Calibration certificate for virtual sensor network (VSN)
US8036764B2 (en) 2007-11-02 2011-10-11 Caterpillar Inc. Virtual sensor network (VSN) system and method
US8086640B2 (en) 2008-05-30 2011-12-27 Caterpillar Inc. System and method for improving data coverage in modeling systems
US9374746B1 (en) 2008-07-07 2016-06-21 Odyssey Wireless, Inc. Systems/methods of spatial multiplexing
US7917333B2 (en) 2008-08-20 2011-03-29 Caterpillar Inc. Virtual sensor network (VSN) based control system and method
US8527080B2 (en) * 2008-10-02 2013-09-03 Applied Materials, Inc. Method and system for managing process jobs in a semiconductor fabrication facility
US8989887B2 (en) * 2009-02-11 2015-03-24 Applied Materials, Inc. Use of prediction data in monitoring actual production targets
JP5375429B2 (ja) * 2009-02-12 2013-12-25 富士通株式会社 設計支援装置、方法、及びプログラム
US8055365B2 (en) * 2009-03-31 2011-11-08 Praxair Technology, Inc. Method for configuring gas supply for electronics fabrication facilities
US8234295B2 (en) 2009-06-03 2012-07-31 International Business Machines Corporation Managing uncertain data using Monte Carlo techniques
JP5402351B2 (ja) * 2009-07-24 2014-01-29 富士通株式会社 多目的最適化設計支援装置、方法、及びプログラム
US9620426B2 (en) * 2010-02-18 2017-04-11 Kla-Tencor Corporation Method and system for providing process tool correctables using an optimized sampling scheme with smart interpolation
US9806790B2 (en) 2010-03-29 2017-10-31 Odyssey Wireless, Inc. Systems/methods of spectrally efficient communications
US9606453B2 (en) 2010-09-30 2017-03-28 Kla-Tencor Corporation Method and system for providing tool induced shift using a sub-sampling scheme
US8793004B2 (en) 2011-06-15 2014-07-29 Caterpillar Inc. Virtual sensor system and method for generating output parameters
US20130024019A1 (en) * 2011-07-22 2013-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for end point determination in semiconductor processing
US9157876B2 (en) 2011-07-25 2015-10-13 Electro Scientific Industries, Inc. Method and apparatus for characterizing objects and monitoring manufacturing processes
US8468471B2 (en) * 2011-09-23 2013-06-18 Kla-Tencor Corp. Process aware metrology
US8453101B1 (en) 2011-11-22 2013-05-28 International Business Machines Corporation Method, system and program storage device for generating accurate performance targets for active semiconductor devices during new technology node development
WO2013169875A2 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for displaying content associated with a corresponding affordance
KR101823288B1 (ko) 2012-05-09 2018-01-29 애플 인크. 제스처에 응답하여 디스플레이 상태들 사이를 전이하기 위한 디바이스, 방법, 및 그래픽 사용자 인터페이스
EP3185116B1 (de) 2012-05-09 2019-09-11 Apple Inc. Vorrichtung, verfahren und grafische benutzeroberfläche zur bereitstellung von taktilem feedback für auf einer benutzeroberfläche durchgeführte operationen
DE112013002409T5 (de) 2012-05-09 2015-02-26 Apple Inc. Vorrichtung, Verfahren und grafische Benutzeroberfläche für die Anzeige zusätzlicher Informationen in Reaktion auf einen Benutzerkontakt
WO2013169854A2 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for providing feedback for changing activation states of a user interface object
WO2013169849A2 (en) 2012-05-09 2013-11-14 Industries Llc Yknots Device, method, and graphical user interface for displaying user interface objects corresponding to an application
WO2013169865A2 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for moving a user interface object based on an intensity of a press input
WO2013169851A2 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for facilitating user interaction with controls in a user interface
WO2013169842A2 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for selecting object within a group of objects
WO2013169845A1 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for scrolling nested regions
WO2013169843A1 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for manipulating framed graphical objects
WO2013169877A2 (en) 2012-05-09 2013-11-14 Yknots Industries Llc Device, method, and graphical user interface for selecting user interface objects
CN108052264B (zh) 2012-05-09 2021-04-27 苹果公司 用于移动和放置用户界面对象的设备、方法和图形用户界面
EP2939098B1 (de) 2012-12-29 2018-10-10 Apple Inc. Vorrichtung, verfahren und grafische benutzerschnittstelle zum übergang zwischen berührungseingabe und anzeigenausgabe
CN104903835B (zh) 2012-12-29 2018-05-04 苹果公司 用于针对多接触手势而放弃生成触觉输出的设备、方法和图形用户界面
KR102001332B1 (ko) 2012-12-29 2019-07-17 애플 인크. 콘텐츠를 스크롤할지 선택할지 결정하기 위한 디바이스, 방법 및 그래픽 사용자 인터페이스
EP3467634B1 (de) 2012-12-29 2020-09-23 Apple Inc. Vorrichtung, verfahren und grafische benutzerschnittstelle zur navigation durch benutzerschnittstellenhierarchien
WO2014105277A2 (en) 2012-12-29 2014-07-03 Yknots Industries Llc Device, method, and graphical user interface for moving a cursor according to a change in an appearance of a control icon with simulated three-dimensional characteristics
US20150025857A1 (en) * 2013-07-22 2015-01-22 International Business Machines Corporation Statistical power estimation
JP6173851B2 (ja) * 2013-09-20 2017-08-02 株式会社日立ハイテクノロジーズ 分析方法およびプラズマエッチング装置
JP6739899B2 (ja) * 2015-01-16 2020-08-12 キオクシア株式会社 半導体装置の製造方法および半導体製造装置
US10089589B2 (en) * 2015-01-30 2018-10-02 Sap Se Intelligent threshold editor
US10095396B2 (en) 2015-03-08 2018-10-09 Apple Inc. Devices, methods, and graphical user interfaces for interacting with a control object while dragging another object
US10048757B2 (en) 2015-03-08 2018-08-14 Apple Inc. Devices and methods for controlling media presentation
US9645732B2 (en) 2015-03-08 2017-05-09 Apple Inc. Devices, methods, and graphical user interfaces for displaying and using menus
US9785305B2 (en) 2015-03-19 2017-10-10 Apple Inc. Touch input cursor manipulation
US20170045981A1 (en) 2015-08-10 2017-02-16 Apple Inc. Devices and Methods for Processing Touch Inputs Based on Their Intensities
DE102015105239A1 (de) * 2015-04-07 2016-10-13 Analytik Jena Ag Verfahren zur Korrektur von Untergrundsignalen in einem Spektrum
US9860451B2 (en) 2015-06-07 2018-01-02 Apple Inc. Devices and methods for capturing and interacting with enhanced digital images
US9674426B2 (en) 2015-06-07 2017-06-06 Apple Inc. Devices and methods for capturing and interacting with enhanced digital images
WO2017138948A1 (en) * 2016-02-11 2017-08-17 Intel Corporation Equipment process monitoring system with automatic configuration of control limits and alert zones
JP6959831B2 (ja) * 2017-08-31 2021-11-05 株式会社日立製作所 計算機、処理の制御パラメータの決定方法、代用試料、計測システム、及び計測方法
KR102132785B1 (ko) * 2017-08-31 2020-07-13 가부시끼가이샤 히다치 세이사꾸쇼 계산기, 처리의 제어 파라미터의 결정 방법, 대용 시료, 계측 시스템, 및 계측 방법
KR102519802B1 (ko) * 2017-09-04 2023-04-10 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 처리 장치의 이상 감시 방법, 및 기록 매체에 저장된 프로그램
EP3531205A1 (de) * 2018-02-22 2019-08-28 ASML Netherlands B.V. Steuerung basierend auf der wahrscheinlichkeitsdichtefunktion eines parameters
JP7108562B2 (ja) * 2019-02-22 2022-07-28 株式会社日立製作所 処理の制御パラメータの決定方法、及び計測システム
US11714114B2 (en) * 2019-05-20 2023-08-01 Miami University Non-invasive diagnostic systems and methods for using the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571685A (en) * 1982-06-23 1986-02-18 Nec Corporation Production system for manufacturing semiconductor devices
US4827395A (en) * 1983-04-21 1989-05-02 Intelli-Tech Corporation Manufacturing monitoring and control systems
US5115502A (en) * 1984-11-02 1992-05-19 Tektronix, Inc. Method and apparatus for determining internal status of a processor using simulation guided by acquired data
JP2635566B2 (ja) * 1987-01-14 1997-07-30 株式会社東芝 半導体製造自動制御システム
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
JPH01131470A (ja) * 1987-11-17 1989-05-24 Mitsubishi Electric Corp Lsi故障解析装置
US4887218A (en) * 1987-12-01 1989-12-12 International Business Machines Corporation Automated production release system
US4937765A (en) * 1988-07-29 1990-06-26 Mentor Graphics Corporation Method and apparatus for estimating fault coverage
US5495417A (en) * 1990-08-14 1996-02-27 Kabushiki Kaisha Toshiba System for automatically producing different semiconductor products in different quantities through a plurality of processes along a production line
US5365463A (en) * 1990-12-21 1994-11-15 International Business Machines Corporation Method for evaluating the timing of digital machines with statistical variability in their delays
US5301118A (en) * 1991-11-18 1994-04-05 International Business Machines Corporation Monte carlo simulation design methodology
JPH05267421A (ja) * 1992-03-17 1993-10-15 Hitachi Ltd 半導体デバイスシミュレーション方法
US5418974A (en) * 1992-10-08 1995-05-23 International Business Machines Corporation Circuit design method and system therefor
JPH06338552A (ja) * 1993-05-31 1994-12-06 Sony Corp 半導体シミュレーション装置
JP3367201B2 (ja) * 1994-05-06 2003-01-14 株式会社日立製作所 電子回路装置の製造方法
US5539652A (en) * 1995-02-07 1996-07-23 Hewlett-Packard Company Method for manufacturing test simulation in electronic circuit design
US5646870A (en) * 1995-02-13 1997-07-08 Advanced Micro Devices, Inc. Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-produced semiconductor wafers
US5621652A (en) * 1995-03-21 1997-04-15 Vlsi Technology, Inc. System and method for verifying process models in integrated circuit process simulators

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US5719796A (en) 1998-02-17
JP2000517473A (ja) 2000-12-26
DE69622427T2 (de) 2003-03-20
EP0865666B1 (de) 2002-07-17
KR19990071784A (ko) 1999-09-27
US5966312A (en) 1999-10-12

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