DE69615792T2 - Miniatur-halbleiteranordnung für oberflächenmontage - Google Patents

Miniatur-halbleiteranordnung für oberflächenmontage

Info

Publication number
DE69615792T2
DE69615792T2 DE69615792T DE69615792T DE69615792T2 DE 69615792 T2 DE69615792 T2 DE 69615792T2 DE 69615792 T DE69615792 T DE 69615792T DE 69615792 T DE69615792 T DE 69615792T DE 69615792 T2 DE69615792 T2 DE 69615792T2
Authority
DE
Germany
Prior art keywords
surface mounting
semiconductor arrangement
miniature semiconductor
miniature
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69615792T
Other languages
English (en)
Other versions
DE69615792D1 (de
Inventor
De Water Wilhelmus Van
Anco Groenhof
Gerarus Schriks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69615792D1 publication Critical patent/DE69615792D1/de
Publication of DE69615792T2 publication Critical patent/DE69615792T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69615792T 1995-05-10 1996-05-07 Miniatur-halbleiteranordnung für oberflächenmontage Expired - Fee Related DE69615792T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95201203 1995-05-10
PCT/IB1996/000411 WO1996036075A2 (en) 1995-05-10 1996-05-07 Miniature semiconductor device for surface mounting

Publications (2)

Publication Number Publication Date
DE69615792D1 DE69615792D1 (de) 2001-11-15
DE69615792T2 true DE69615792T2 (de) 2002-05-23

Family

ID=8220281

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69615792T Expired - Fee Related DE69615792T2 (de) 1995-05-10 1996-05-07 Miniatur-halbleiteranordnung für oberflächenmontage

Country Status (8)

Country Link
US (1) US5703401A (de)
EP (1) EP0775369B1 (de)
JP (1) JPH10503330A (de)
KR (1) KR100372136B1 (de)
CN (1) CN1097852C (de)
DE (1) DE69615792T2 (de)
MY (1) MY112050A (de)
WO (1) WO1996036075A2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8866169B2 (en) * 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US9468070B2 (en) 2010-02-16 2016-10-11 Cree Inc. Color control of light emitting devices and applications thereof
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
EP0139029A1 (de) * 1983-10-19 1985-05-02 Olin Corporation Halbleiterpackung
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
NL9000161A (nl) * 1990-01-23 1991-08-16 Koninkl Philips Electronics Nv Halfgeleiderinrichting bevattende een drager en werkwijze voor het vervaardigen van de drager.
EP0705484B1 (de) * 1994-04-15 1999-02-24 Koninklijke Philips Electronics N.V. Herstellungsverfahren für eine anordnung, wobei ein längsträger mit leiterbahnen zur elektrischen kontaktierung eines halbleiterelements versehen ist
ATE350765T1 (de) * 1994-07-26 2007-01-15 Koninkl Philips Electronics Nv Verfahren zur herstellung einer halbleitervorrichtunng und eine halbleitervorrichtung

Also Published As

Publication number Publication date
CN1097852C (zh) 2003-01-01
KR970705181A (ko) 1997-09-06
DE69615792D1 (de) 2001-11-15
WO1996036075A2 (en) 1996-11-14
EP0775369B1 (de) 2001-10-10
JPH10503330A (ja) 1998-03-24
WO1996036075A3 (en) 1997-02-13
CN1153579A (zh) 1997-07-02
EP0775369A2 (de) 1997-05-28
US5703401A (en) 1997-12-30
KR100372136B1 (ko) 2003-03-15
MY112050A (en) 2001-03-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee