DE69613882T2 - Herstellungsverfahren eines piezoelektrischen Schichtenelementes - Google Patents

Herstellungsverfahren eines piezoelektrischen Schichtenelementes

Info

Publication number
DE69613882T2
DE69613882T2 DE69613882T DE69613882T DE69613882T2 DE 69613882 T2 DE69613882 T2 DE 69613882T2 DE 69613882 T DE69613882 T DE 69613882T DE 69613882 T DE69613882 T DE 69613882T DE 69613882 T2 DE69613882 T2 DE 69613882T2
Authority
DE
Germany
Prior art keywords
manufacturing
piezoelectric layer
layer element
piezoelectric
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69613882T
Other languages
English (en)
Other versions
DE69613882D1 (de
Inventor
Yasuo Okawa
Yasuji Chikaoka
Atsuo Sakaida
Yoshihumi Suzuki
Yoshiyuki Ikezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Application granted granted Critical
Publication of DE69613882D1 publication Critical patent/DE69613882D1/de
Publication of DE69613882T2 publication Critical patent/DE69613882T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1612—Production of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
DE69613882T 1995-04-05 1996-04-09 Herstellungsverfahren eines piezoelektrischen Schichtenelementes Expired - Lifetime DE69613882T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7080118A JPH08279631A (ja) 1995-04-05 1995-04-05 積層型圧電素子の製造方法

Publications (2)

Publication Number Publication Date
DE69613882D1 DE69613882D1 (de) 2001-08-23
DE69613882T2 true DE69613882T2 (de) 2002-04-04

Family

ID=13709292

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69613882T Expired - Lifetime DE69613882T2 (de) 1995-04-05 1996-04-09 Herstellungsverfahren eines piezoelektrischen Schichtenelementes

Country Status (4)

Country Link
US (1) US5860202A (de)
EP (1) EP0736386B1 (de)
JP (1) JPH08279631A (de)
DE (1) DE69613882T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3317308B2 (ja) * 1992-08-26 2002-08-26 セイコーエプソン株式会社 積層型インクジェット記録ヘッド、及びその製造方法
EP0819523A1 (de) * 1996-07-18 1998-01-21 Océ-Technologies B.V. Tintenstrahldüsenkopf
EP0819525A1 (de) * 1996-07-18 1998-01-21 Océ-Technologies B.V. Tintenstrahl-Düsenkopf mit mehrfacher Blockstruktur
JP2927286B1 (ja) 1998-02-05 1999-07-28 日本電気株式会社 圧電アクチュエータ及びその製造方法
US6417600B2 (en) 1998-09-17 2002-07-09 Seiko Epson Corporation Piezoelectric vibrator unit, method for manufacturing the same, and ink jet recording head comprising the same
US6592696B1 (en) 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
DE19850610A1 (de) * 1998-11-03 2000-05-04 Bosch Gmbh Robert Verfahren zur Herstellung piezoelektrischer Aktoren
US6715192B2 (en) * 1998-12-28 2004-04-06 Ngk Insulators, Ltd. Method for manufacturing a piezoelectric/electrostrictive device
US6455981B1 (en) * 1999-10-01 2002-09-24 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of manufacturing same
JP3965515B2 (ja) * 1999-10-01 2007-08-29 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
JP3845544B2 (ja) * 1999-10-01 2006-11-15 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
US6629341B2 (en) 1999-10-29 2003-10-07 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of fabricating a piezoelectric composite apparatus
US6238269B1 (en) * 2000-01-26 2001-05-29 Hewlett-Packard Company Ink feed slot formation in ink-jet printheads
US6928415B1 (en) 2000-06-05 2005-08-09 Barnet L. Liberman Method of delivering groceries purchased over the internet
US6586889B1 (en) 2000-06-21 2003-07-01 Si Diamond Technology, Inc. MEMS field emission device
US6505917B1 (en) * 2001-07-13 2003-01-14 Illinois Tool Works Inc. Electrode patterns for piezo-electric ink jet printer
JP4294924B2 (ja) * 2001-09-12 2009-07-15 日本碍子株式会社 マトリクス型圧電／電歪デバイス及び製造方法
US6794723B2 (en) 2001-09-12 2004-09-21 Ngk Insulators, Ltd. Matrix type piezoelectric/electrostrictive device and manufacturing method thereof
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
JP3997865B2 (ja) * 2002-08-29 2007-10-24 ブラザー工業株式会社 インクジェットプリンタヘッド
US6997708B2 (en) * 2003-10-22 2006-02-14 Ultradent Products, Inc. Treatment compositions and strips having a solid adhesive layer and treatment gel adjacent thereto
US20050236358A1 (en) * 2004-04-26 2005-10-27 Shen Buswell Micromachining methods and systems
US7326356B2 (en) * 2004-08-31 2008-02-05 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
KR100747459B1 (ko) * 2005-10-21 2007-08-09 엘지전자 주식회사 모듈의 충돌 방지가 보장되는 멀티태스킹 방법 및 이동단말기
DE102007003280A1 (de) * 2007-01-23 2008-07-24 Epcos Ag Piezoelektrisches Bauelement
US20080259134A1 (en) * 2007-04-20 2008-10-23 Hewlett-Packard Development Company Lp Print head laminate
JP6098803B2 (ja) * 2013-03-26 2017-03-22 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
US9741922B2 (en) 2013-12-16 2017-08-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Self-latching piezocomposite actuator
JP6357048B2 (ja) * 2014-08-07 2018-07-11 株式会社東芝 インクジェットヘッドの製造装置およびインクジェットヘッドの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0094078B1 (de) * 1982-05-11 1988-11-02 Nec Corporation Elektrostriktives Vielschichtelement welches wiederholter Pulsanwendung widersteht
JPH0733087B2 (ja) * 1989-06-09 1995-04-12 シャープ株式会社 インクジェットプリンタ
US5140773A (en) * 1990-02-14 1992-08-25 Brother Kogyo Kabushiki Kaisha Ultrasonic machine and its machining method
JP3041952B2 (ja) * 1990-02-23 2000-05-15 セイコーエプソン株式会社 インクジェット式記録ヘッド、圧電振動体、及びこれらの製造方法
JP3109017B2 (ja) * 1993-05-12 2000-11-13 セイコーエプソン株式会社 インクジェット式記録ヘッド
JPH0757545B2 (ja) * 1993-07-19 1995-06-21 セイコーエプソン株式会社 インクジェットヘッド及びその製造方法

Also Published As

Publication number Publication date
EP0736386B1 (de) 2001-07-18
EP0736386A2 (de) 1996-10-09
JPH08279631A (ja) 1996-10-22
US5860202A (en) 1999-01-19
DE69613882D1 (de) 2001-08-23
EP0736386A3 (de) 1998-03-25

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