DE69605126D1 - Copolyamid und elektrische und elektronische komponenten aus einer polyamidzusammensetzung - Google Patents

Copolyamid und elektrische und elektronische komponenten aus einer polyamidzusammensetzung

Info

Publication number
DE69605126D1
DE69605126D1 DE69605126T DE69605126T DE69605126D1 DE 69605126 D1 DE69605126 D1 DE 69605126D1 DE 69605126 T DE69605126 T DE 69605126T DE 69605126 T DE69605126 T DE 69605126T DE 69605126 D1 DE69605126 D1 DE 69605126D1
Authority
DE
Germany
Prior art keywords
copolyamide
electrical
electronic components
polyamide composition
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69605126T
Other languages
English (en)
Other versions
DE69605126T2 (de
Inventor
Cornelis Koning
Petronella Knape
Robert Leeuwendal
Josefina Ortmans-Schiffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DSM IP Assets BV
Original Assignee
DSM NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DSM NV filed Critical DSM NV
Publication of DE69605126D1 publication Critical patent/DE69605126D1/de
Application granted granted Critical
Publication of DE69605126T2 publication Critical patent/DE69605126T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/36Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305Polyamides or polyesteramides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
DE69605126T 1995-09-19 1996-09-18 Copolyamid und elektrische und elektronische komponenten aus einer polyamidzusammensetzung Expired - Lifetime DE69605126T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE9500768A BE1009637A4 (nl) 1995-09-19 1995-09-19 Electrische en electronische onderdelen uit een polyamidesamenstelling.
PCT/NL1996/000364 WO1997011108A1 (en) 1995-09-19 1996-09-18 Electrical and electronic components made of a polyamide composition

Publications (2)

Publication Number Publication Date
DE69605126D1 true DE69605126D1 (de) 1999-12-16
DE69605126T2 DE69605126T2 (de) 2000-06-29

Family

ID=3889178

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605126T Expired - Lifetime DE69605126T2 (de) 1995-09-19 1996-09-18 Copolyamid und elektrische und elektronische komponenten aus einer polyamidzusammensetzung

Country Status (10)

Country Link
US (1) US5965689A (de)
EP (1) EP0851884B1 (de)
JP (1) JP4038240B2 (de)
KR (1) KR100462709B1 (de)
CN (1) CN1088073C (de)
AU (1) AU7146396A (de)
BE (1) BE1009637A4 (de)
DE (1) DE69605126T2 (de)
TW (1) TW457259B (de)
WO (1) WO1997011108A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1013939C2 (nl) * 1999-12-23 2001-06-26 Dsm Nv Werkwijze voor de bereiding van een polyamide.
AU2001261776A1 (en) 2000-05-19 2001-12-03 Arizona Chemical Company Nitrocellulose-compatible laminating ink resins
WO2002048239A1 (fr) 2000-12-11 2002-06-20 Asahi Kasei Kabushiki Kaisha Polyamide
KR20100115796A (ko) 2008-03-12 2010-10-28 아사히 가세이 케미칼즈 가부시키가이샤 폴리아미드, 폴리아미드 조성물 및 폴리아미드의 제조 방법
JP5667983B2 (ja) * 2009-09-08 2015-02-12 旭化成ケミカルズ株式会社 ポリアミド共重合体及び成形品
CN102482415B (zh) 2009-09-11 2013-11-06 旭化成化学株式会社 聚酰胺及聚酰胺组合物
JP5612349B2 (ja) * 2010-04-14 2014-10-22 旭化成ケミカルズ株式会社 ポリアミド組成物及びポリアミド組成物からなる成形体
US9611356B2 (en) 2011-01-07 2017-04-04 Asahi Kasei Chemicals Corporation Copolymer polyamide
CN103403063B (zh) 2011-03-15 2016-01-20 旭化成化学株式会社 聚酰胺及聚酰胺组合物
KR20150024819A (ko) * 2012-05-25 2015-03-09 디에스엠 아이피 어셋츠 비.브이. 높은 용융 온도를 갖는 용융-가공가능한 폴리아미드
EP2871201A4 (de) 2012-07-09 2015-06-24 Asahi Kasei Chemicals Corp Polyamid, polyamidzusammensetzung und formkörper
JP6247906B2 (ja) * 2012-11-12 2017-12-13 株式会社クラレ 長繊維強化ポリアミド樹脂組成物
JP6247905B2 (ja) * 2012-11-12 2017-12-13 株式会社クラレ ポリアミド樹脂組成物
CN104937034B (zh) 2013-01-11 2016-08-24 旭化成株式会社 聚酰胺组合物及成形品
KR101821512B1 (ko) 2013-12-13 2018-01-23 아사히 가세이 가부시키가이샤 폴리아미드 조성물, 성형품, led 용 반사판, 및 열에 의한 반사율의 저하를 억제하는 방법
CN109661554B (zh) 2016-08-08 2021-05-11 提克纳有限责任公司 用于散热器的导热聚合物组合物
CN107916093A (zh) * 2016-10-08 2018-04-17 中石化石油工程技术服务有限公司 一种乳化剂及其制备方法和油基钻井液
CN113956470B (zh) * 2021-02-08 2022-08-09 东阳市福雕文化创意有限公司 高韧性透明树脂及其制备方法
CN113999389B (zh) * 2021-11-19 2022-12-06 四川大学 一种长链尼龙与缩二脲的共聚物的薄膜及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3950310A (en) * 1971-02-12 1976-04-13 Exxon Research & Engineering Co. Polyamides from cyclohexane bis(ethylamine)
US4398012A (en) * 1982-01-19 1983-08-09 Allied Corporation Transparent copolyamide from caprolactam, cyclic diamine and cyclic dicarboxylic acid
DE3637677A1 (de) * 1986-11-05 1988-05-19 Bayer Ag Schlagzaehe, dimensionsstabile polyamid-formmassen
GB8720490D0 (en) * 1987-08-29 1987-10-07 Bp Chem Int Ltd Preparation of homopolyamides

Also Published As

Publication number Publication date
EP0851884A1 (de) 1998-07-08
KR19990063680A (ko) 1999-07-26
AU7146396A (en) 1997-04-09
DE69605126T2 (de) 2000-06-29
CN1201470A (zh) 1998-12-09
WO1997011108A1 (en) 1997-03-27
KR100462709B1 (ko) 2005-02-28
JP4038240B2 (ja) 2008-01-23
EP0851884B1 (de) 1999-11-10
CN1088073C (zh) 2002-07-24
US5965689A (en) 1999-10-12
JPH11512476A (ja) 1999-10-26
TW457259B (en) 2001-10-01
BE1009637A4 (nl) 1997-06-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DSM IP ASSETS B.V., HEERLEN, NL