DE69603931D1 - Methode zur herstellung von mehrlagigen elektronischen komponenten - Google Patents

Methode zur herstellung von mehrlagigen elektronischen komponenten

Info

Publication number
DE69603931D1
DE69603931D1 DE69603931T DE69603931T DE69603931D1 DE 69603931 D1 DE69603931 D1 DE 69603931D1 DE 69603931 T DE69603931 T DE 69603931T DE 69603931 T DE69603931 T DE 69603931T DE 69603931 D1 DE69603931 D1 DE 69603931D1
Authority
DE
Germany
Prior art keywords
electronic components
multilayer electronic
producing multilayer
producing
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69603931T
Other languages
English (en)
Other versions
DE69603931T2 (de
Inventor
Antonius Rijnbeek
Jacques Warnier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phycomp Holding BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69603931D1 publication Critical patent/DE69603931D1/de
Publication of DE69603931T2 publication Critical patent/DE69603931T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/304—Stacked capacitors obtained from a another capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
DE69603931T 1995-06-27 1996-05-31 Methode zur herstellung von mehrlagigen elektronischen komponenten Expired - Fee Related DE69603931T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95201740 1995-06-27
PCT/IB1996/000524 WO1997001868A1 (en) 1995-06-27 1996-05-31 Method of manufacturing multilayer electronic components

Publications (2)

Publication Number Publication Date
DE69603931D1 true DE69603931D1 (de) 1999-09-30
DE69603931T2 DE69603931T2 (de) 2000-03-30

Family

ID=8220421

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69603931T Expired - Fee Related DE69603931T2 (de) 1995-06-27 1996-05-31 Methode zur herstellung von mehrlagigen elektronischen komponenten

Country Status (7)

Country Link
US (1) US5758398A (de)
EP (1) EP0777913B1 (de)
JP (1) JPH10505463A (de)
KR (1) KR970705839A (de)
DE (1) DE69603931T2 (de)
TW (1) TW337021B (de)
WO (1) WO1997001868A1 (de)

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US6832735B2 (en) * 2002-01-03 2004-12-21 Nanoproducts Corporation Post-processed nanoscale powders and method for such post-processing
WO1999021709A2 (en) * 1997-10-29 1999-05-06 Koninklijke Philips Electronics N.V. Method of manufacturing a multilayer electronic component
US5983472A (en) * 1997-11-12 1999-11-16 Pacesetter, Inc. Capacitor for an implantable cardiac defibrillator
DE19757877A1 (de) 1997-12-24 1999-07-01 Bosch Gmbh Robert Verfahren zur Herstellung piezoelektrischer Aktoren und piezoelektrischer Aktor
US6453527B1 (en) * 1998-07-28 2002-09-24 Delaware Capital Formation, Inc. Free form capacitor
DE19850610A1 (de) * 1998-11-03 2000-05-04 Bosch Gmbh Robert Verfahren zur Herstellung piezoelektrischer Aktoren
US6662439B1 (en) 1999-10-04 2003-12-16 Roche Diagnostics Corporation Laser defined features for patterned laminates and electrodes
US6645359B1 (en) * 2000-10-06 2003-11-11 Roche Diagnostics Corporation Biosensor
US7073246B2 (en) * 1999-10-04 2006-07-11 Roche Diagnostics Operations, Inc. Method of making a biosensor
WO2001097296A1 (fr) * 2000-06-16 2001-12-20 Ngk Insulators, Ltd. Dispositif piezoelectrique/electrostrictif et son procede de fabrication
DE10046657A1 (de) * 2000-09-20 2002-04-04 Bosch Gmbh Robert Piezoelement und ein Verfahren zu seiner Herstellung
US6540890B1 (en) * 2000-11-01 2003-04-01 Roche Diagnostics Corporation Biosensor
US6814844B2 (en) * 2001-08-29 2004-11-09 Roche Diagnostics Corporation Biosensor with code pattern
US6866758B2 (en) 2002-03-21 2005-03-15 Roche Diagnostics Corporation Biosensor
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US20040220627A1 (en) * 2003-04-30 2004-11-04 Crespi Ann M. Complex-shaped ceramic capacitors for implantable cardioverter defibrillators and method of manufacture
US6984284B2 (en) * 2003-05-14 2006-01-10 Sunnybrook And Women's College Health Sciences Centre Piezoelectric composites and methods for manufacturing same
CA2529657C (en) 2003-06-20 2011-04-12 F. Hoffmann-La Roche Ag Test strip with slot vent opening
JP2005123288A (ja) * 2003-10-15 2005-05-12 Tdk Corp 積層電子部品の製造方法
JP4473715B2 (ja) 2004-11-29 2010-06-02 富士通株式会社 積層体切断方法及び積層体
US7379787B2 (en) * 2005-04-09 2008-05-27 Floodcooling Technologies, Llc Method for forming a tangible item and a tangible item formed by the method
JP4475294B2 (ja) * 2007-05-30 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
JP4479747B2 (ja) * 2007-05-30 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
JP5052619B2 (ja) * 2007-09-27 2012-10-17 京セラ株式会社 積層型圧電素子、これを備えた噴射装置及び燃料噴射システム
JP5405916B2 (ja) * 2008-06-24 2014-02-05 パナソニック株式会社 バイオセンサ、その製造方法、及びそれを備える検出システム
JP5882053B2 (ja) * 2011-12-28 2016-03-09 太陽誘電株式会社 弾性波デバイスの製造方法
JP5679010B2 (ja) * 2013-05-07 2015-03-04 Tdk株式会社 圧電素子およびその製造方法
JP6064228B2 (ja) * 2013-05-24 2017-01-25 パナソニックＩｐマネジメント株式会社 レーザ切断装置およびレーザ切断方法
WO2016037762A1 (en) * 2014-09-11 2016-03-17 Sicpa Holding Sa Pyroelectric generator
KR20170078136A (ko) * 2015-12-29 2017-07-07 삼성전기주식회사 적층 전자 부품 및 그 제조 방법
JP7188345B2 (ja) * 2019-09-30 2022-12-13 株式会社村田製作所 積層セラミック電子部品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2557732B1 (fr) * 1983-12-28 1986-04-11 Lefevre Rene Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede
DK168593B1 (da) * 1985-05-09 1994-05-02 Aga Ab Fremgangsmåde ved laserskæring af metalliske emner
US4776904A (en) * 1985-07-19 1988-10-11 Miles Inc. Multilayer analytical element and method of making, using ultrasonic or laser energy
DE3768682D1 (de) * 1986-01-31 1991-04-25 Alusuisse Lonza Services Ag Kondensatorfolie aus aluminium oder einer aluminiumlegierung.
US4841411A (en) * 1987-05-12 1989-06-20 Siemens Aktiengesellschaft Electrical capacitors having low capacitance tolerances and method for the manufacture thereof
EP0383972B1 (de) * 1989-02-22 1993-12-15 Siemens Aktiengesellschaft Ultraschall-Array mit trapezförmigen Schwingerelementen sowie Verfahren und Vorrichtung zu seiner Herstellung
JPH04340778A (ja) * 1991-01-30 1992-11-27 Nec Corp 積層圧電アクチュエータ素子
FR2675302A1 (fr) * 1991-04-09 1992-10-16 Europ Composants Electron Procede de cicatrisation des faces de decoupe des condensateurs a films plastiques souples metallises de type empile et procede de fabrication de condensateurs de ce type.
JP3018645B2 (ja) * 1991-10-03 2000-03-13 株式会社村田製作所 チップ部品の製造方法
US5239736A (en) * 1991-11-12 1993-08-31 Acuson Corporation Method for making piezoelectric composites
US5603147A (en) * 1995-06-07 1997-02-18 Microelectronic Packaging, Inc. Method of making a high energy multilayer ceramic capacitor

Also Published As

Publication number Publication date
WO1997001868A1 (en) 1997-01-16
TW337021B (en) 1998-07-21
US5758398A (en) 1998-06-02
DE69603931T2 (de) 2000-03-30
EP0777913B1 (de) 1999-08-25
JPH10505463A (ja) 1998-05-26
KR970705839A (ko) 1997-10-09
EP0777913A1 (de) 1997-06-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHYCOMP HOLDING B.V., ROERMOND, NL

8339 Ceased/non-payment of the annual fee