DE69529698D1 - Einkapselung eines Halbleiterbauelementes mit hoher Feuchtigkeitsfestigkeit - Google Patents
Einkapselung eines Halbleiterbauelementes mit hoher FeuchtigkeitsfestigkeitInfo
- Publication number
- DE69529698D1 DE69529698D1 DE69529698T DE69529698T DE69529698D1 DE 69529698 D1 DE69529698 D1 DE 69529698D1 DE 69529698 T DE69529698 T DE 69529698T DE 69529698 T DE69529698 T DE 69529698T DE 69529698 D1 DE69529698 D1 DE 69529698D1
- Authority
- DE
- Germany
- Prior art keywords
- encapsulation
- semiconductor device
- moisture resistance
- high moisture
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6134885A JP2531382B2 (ja) | 1994-05-26 | 1994-05-26 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69529698D1 true DE69529698D1 (de) | 2003-04-03 |
DE69529698T2 DE69529698T2 (de) | 2004-01-15 |
Family
ID=15138791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69529698T Expired - Fee Related DE69529698T2 (de) | 1994-05-26 | 1995-05-23 | Einkapselung eines Halbleiterbauelementes mit hoher Feuchtigkeitsfestigkeit |
Country Status (5)
Country | Link |
---|---|
US (2) | US5989940A (de) |
EP (1) | EP0684641B1 (de) |
JP (1) | JP2531382B2 (de) |
KR (1) | KR0152700B1 (de) |
DE (1) | DE69529698T2 (de) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3007497B2 (ja) * | 1992-11-11 | 2000-02-07 | 三菱電機株式会社 | 半導体集積回路装置、その製造方法、及びその実装方法 |
JP2531382B2 (ja) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
USRE39426E1 (en) | 1996-06-19 | 2006-12-12 | International Business Machines Corporation | Thermally enhanced flip chip package and method of forming |
US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
KR100484962B1 (ko) * | 1996-07-12 | 2005-04-25 | 후지쯔 가부시끼가이샤 | 반도체 장치의 제조 방법 및 반도체 장치 |
EP0886313A4 (de) * | 1996-12-04 | 2001-02-28 | Shinko Electric Ind Co | Harzversiegelte halbleitervorrichtung und herstellungsverfahren |
JP3671563B2 (ja) * | 1996-12-09 | 2005-07-13 | 株式会社デンソー | モールドicをケースに固定した構造の半導体装置 |
JP3032964B2 (ja) * | 1996-12-30 | 2000-04-17 | アナムインダストリアル株式会社 | ボールグリッドアレイ半導体のパッケージ及び製造方法 |
JP3398004B2 (ja) * | 1997-03-24 | 2003-04-21 | ローム株式会社 | パッケージ型半導体装置の構造 |
JPH10294418A (ja) * | 1997-04-21 | 1998-11-04 | Oki Electric Ind Co Ltd | 半導体装置 |
JPH10321631A (ja) * | 1997-05-19 | 1998-12-04 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法 |
KR19990005515A (ko) * | 1997-06-30 | 1999-01-25 | 윤종용 | 금형을 이용한 씨오비(cob) 패키지 제조 방법 |
WO1999016132A2 (de) * | 1997-09-22 | 1999-04-01 | Siemens Aktiengesellschaft | Verfahren zum herstellen eines kunststoffverbundkörpers sowie kunststoffverbundkörper |
JPH11219984A (ja) * | 1997-11-06 | 1999-08-10 | Sharp Corp | 半導体装置パッケージおよびその製造方法ならびにそのための回路基板 |
KR100246366B1 (ko) * | 1997-12-04 | 2000-03-15 | 김영환 | 에리어 어레이형 반도체 패키지 및 그 제조방법 |
JP3087709B2 (ja) * | 1997-12-08 | 2000-09-11 | 日本電気株式会社 | 半導体装置およびその製造方法 |
JPH11260863A (ja) * | 1998-03-09 | 1999-09-24 | Sumitomo Electric Ind Ltd | 半導体装置用接続端子とその製造方法 |
TW469611B (en) * | 1998-03-12 | 2001-12-21 | Delta Electronics Inc | Packaging method for electronic device |
JPH11283593A (ja) * | 1998-03-27 | 1999-10-15 | Mitsumi Electric Co Ltd | 電池パック |
JP3648053B2 (ja) | 1998-04-30 | 2005-05-18 | 沖電気工業株式会社 | 半導体装置 |
US6329709B1 (en) * | 1998-05-11 | 2001-12-11 | Micron Technology, Inc. | Interconnections for a semiconductor device |
US6190945B1 (en) * | 1998-05-21 | 2001-02-20 | Micron Technology, Inc. | Integrated heat sink |
KR100266693B1 (ko) | 1998-05-30 | 2000-09-15 | 김영환 | 적층가능한 비지에이 반도체 칩 패키지 및 그 제조방법 |
KR100266698B1 (ko) * | 1998-06-12 | 2000-09-15 | 김영환 | 반도체 칩 패키지 및 그 제조방법 |
JP2000068436A (ja) * | 1998-08-18 | 2000-03-03 | Oki Electric Ind Co Ltd | 半導体装置および半導体装置用フレーム |
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BR0010155A (pt) * | 1999-04-30 | 2002-01-15 | Univ Pennsylvania | Proteìnas isolada, e quimérica, composição, molécula de ácido nucleico, plasmìdeo, vacina recombinante ou vacina atenuada, composição de vacina recombinante ou composição de vacina atenuada, composição farmacêutica, métodos de imunizar um indivìduo contra um imunógeno, proteìna não-cd80 isolada, molécula de ácido nucleico, e, método de imunossuprimir um indivìduo |
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-
1994
- 1994-05-26 JP JP6134885A patent/JP2531382B2/ja not_active Expired - Fee Related
-
1995
- 1995-05-23 EP EP95107867A patent/EP0684641B1/de not_active Expired - Lifetime
- 1995-05-23 DE DE69529698T patent/DE69529698T2/de not_active Expired - Fee Related
- 1995-05-25 KR KR1019950013221A patent/KR0152700B1/ko not_active IP Right Cessation
-
1997
- 1997-08-06 US US08/907,037 patent/US5989940A/en not_active Expired - Fee Related
- 1997-08-22 US US08/916,824 patent/US5793118A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0684641A3 (de) | 1996-11-06 |
JPH07321248A (ja) | 1995-12-08 |
US5793118A (en) | 1998-08-11 |
US5989940A (en) | 1999-11-23 |
EP0684641A2 (de) | 1995-11-29 |
KR0152700B1 (ko) | 1998-10-01 |
JP2531382B2 (ja) | 1996-09-04 |
DE69529698T2 (de) | 2004-01-15 |
EP0684641B1 (de) | 2003-02-26 |
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