DE69527353D1 - Beschichtungsverfahren und -vorrichtung - Google Patents
Beschichtungsverfahren und -vorrichtungInfo
- Publication number
- DE69527353D1 DE69527353D1 DE69527353T DE69527353T DE69527353D1 DE 69527353 D1 DE69527353 D1 DE 69527353D1 DE 69527353 T DE69527353 T DE 69527353T DE 69527353 T DE69527353 T DE 69527353T DE 69527353 D1 DE69527353 D1 DE 69527353D1
- Authority
- DE
- Germany
- Prior art keywords
- coating method
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S118/00—Coating apparatus
- Y10S118/02—Bead coater
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32824294 | 1994-12-28 | ||
JP32824194 | 1994-12-28 | ||
JP32908894A JP3561998B2 (ja) | 1994-12-28 | 1994-12-28 | 枚葉塗工方法およびその装置 |
JP6135995 | 1995-03-20 | ||
PCT/JP1995/002741 WO1996020045A1 (fr) | 1994-12-28 | 1995-12-27 | Procede de depot d'une revetement et appareil associe |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69527353D1 true DE69527353D1 (de) | 2002-08-14 |
DE69527353T2 DE69527353T2 (de) | 2003-01-30 |
Family
ID=27464036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69527353T Expired - Lifetime DE69527353T2 (de) | 1994-12-28 | 1995-12-27 | Beschichtungsverfahren und -vorrichtung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6139639A (de) |
EP (1) | EP0761317B1 (de) |
KR (1) | KR100369571B1 (de) |
CN (1) | CN1080143C (de) |
CA (1) | CA2183163C (de) |
DE (1) | DE69527353T2 (de) |
TW (1) | TW484463U (de) |
WO (1) | WO1996020045A1 (de) |
Families Citing this family (86)
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US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
US20050217707A1 (en) * | 1998-03-13 | 2005-10-06 | Aegerter Brian K | Selective processing of microelectronic workpiece surfaces |
US6423642B1 (en) * | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
US6197481B1 (en) * | 1998-09-17 | 2001-03-06 | Taiwan Semiconductor Manufacturing Company | Wafer alignment marks protected by photoresist |
US6530340B2 (en) | 1998-11-12 | 2003-03-11 | Advanced Micro Devices, Inc. | Apparatus for manufacturing planar spin-on films |
US6317642B1 (en) * | 1998-11-12 | 2001-11-13 | Advanced Micro Devices, Inc. | Apparatus and methods for uniform scan dispensing of spin-on materials |
US6407009B1 (en) | 1998-11-12 | 2002-06-18 | Advanced Micro Devices, Inc. | Methods of manufacture of uniform spin-on films |
US6287636B1 (en) * | 1998-11-25 | 2001-09-11 | Canon Kabushiki Kaisha | Coating apparatus and method utilizing a diluent and a method for producing a color filter substrate |
EP1010473B1 (de) * | 1998-12-17 | 2006-07-12 | Guardian Industries Corp. | Vorrichtung und Verfahren zum Beschichten eines ebenen Substrates |
US6324440B1 (en) * | 1998-12-29 | 2001-11-27 | Lek Technologies, Llc | Apparatus for fabricating surface structures |
US7217325B2 (en) * | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
US6969682B2 (en) * | 1999-01-22 | 2005-11-29 | Semitool, Inc. | Single workpiece processing system |
TW471015B (en) * | 1999-10-26 | 2002-01-01 | Tokyo Electron Ltd | Solution processing apparatus |
US6478483B2 (en) * | 1999-12-20 | 2002-11-12 | Mitsubishi Paper Mills Limited | Apparatus for processing photosensitive material |
US6544590B1 (en) * | 2000-01-17 | 2003-04-08 | Canon Kabushiki Kaisha | Liquid coating method, apparatus and film-forming method for producing the same employing excess coating removing unit having absorbent fabric on porous structure |
JP3824057B2 (ja) * | 2000-09-13 | 2006-09-20 | 東京エレクトロン株式会社 | 液処理装置 |
JP4130058B2 (ja) * | 2000-10-10 | 2008-08-06 | 東京応化工業株式会社 | 塗布方法 |
US6641670B2 (en) * | 2000-10-12 | 2003-11-04 | Toray Industries, Inc. | Leaf coater for producing leaf type coated substrates |
KR100470682B1 (ko) * | 2001-09-11 | 2005-03-07 | 나노에프에이 주식회사 | 포토레지스트의 흘림 길이를 조절할 수 있는 포토레지스트공급 장치 및 이를 이용한 포토레지스트 공급 방법 |
TWI285563B (en) * | 2002-01-24 | 2007-08-21 | Three Bond Co Ltd | Material coating device |
US20030230323A1 (en) * | 2002-06-14 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for improving scrubber cleaning |
US7160390B2 (en) * | 2002-07-18 | 2007-01-09 | Dai Nippon Printing Co. Ltd | Die head coating, coating device, and method of manufacturing die head for coating |
KR100689310B1 (ko) * | 2002-11-11 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 디스펜서 및 이를 이용한 노즐과 기판의갭 제어방법 |
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US7014724B2 (en) | 2003-06-25 | 2006-03-21 | Lear Corporation | Gravity regulated method and apparatus for controlling application of a fluid |
US7078355B2 (en) * | 2003-12-29 | 2006-07-18 | Asml Holding N.V. | Method and system of coating polymer solution on surface of a substrate |
JP4490797B2 (ja) * | 2004-01-23 | 2010-06-30 | 大日本スクリーン製造株式会社 | 基板処理装置 |
CN1304209C (zh) * | 2004-06-03 | 2007-03-14 | 李永南 | 小珠手动涂层设备 |
CN1304210C (zh) * | 2004-06-03 | 2007-03-14 | 李永南 | 小珠自动涂层设备 |
CN100558940C (zh) * | 2004-08-18 | 2009-11-11 | 陶氏康宁公司 | 涂布的基片及其制备方法 |
KR101074952B1 (ko) * | 2004-08-31 | 2011-10-18 | 엘지디스플레이 주식회사 | 포토레지스트 코팅장치 및 코팅방법 |
KR100780718B1 (ko) | 2004-12-28 | 2007-12-26 | 엘지.필립스 엘시디 주식회사 | 도포액 공급장치를 구비한 슬릿코터 |
CN100400172C (zh) * | 2004-12-30 | 2008-07-09 | 刘大佼 | 共挤压涂布两种涂层的方法 |
KR100700181B1 (ko) | 2004-12-31 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | 노즐대기부를 구비한 슬릿코터 및 이를 이용한 코팅방법 |
KR100675643B1 (ko) | 2004-12-31 | 2007-02-02 | 엘지.필립스 엘시디 주식회사 | 슬릿코터 |
WO2007007455A1 (ja) * | 2005-07-08 | 2007-01-18 | Murata Manufacturing Co., Ltd. | 電子部品の外部電極形成方法および装置 |
KR101182514B1 (ko) * | 2005-11-28 | 2012-09-12 | 엘지디스플레이 주식회사 | 진공 건조용 열경화 장치 및 진공건조 열경화방법 |
KR100703651B1 (ko) * | 2005-11-30 | 2007-04-06 | 주식회사 아이피에스 | 박막증착장치 |
JP4884871B2 (ja) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
CN100448551C (zh) * | 2006-08-18 | 2009-01-07 | 青岛美露亚工艺品有限公司 | 人造珍珠小球的自动涂层装置 |
KR100824748B1 (ko) * | 2006-12-29 | 2008-04-24 | 세메스 주식회사 | 기판 처리 장치의 구동 방법 |
KR20110014653A (ko) * | 2008-05-19 | 2011-02-11 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자 소자에서 증기 코팅 장치 및 방법 |
CN102085507B (zh) * | 2009-12-03 | 2016-05-11 | 塔工程有限公司 | 向液晶涂布机供应液晶的方法 |
KR101730644B1 (ko) * | 2009-12-03 | 2017-04-26 | 주식회사 탑 엔지니어링 | 액정 디스펜서에 액정을 공급하는 방법 |
US8460754B2 (en) * | 2009-12-21 | 2013-06-11 | 3M Innovative Properties Company | Needle coating and in-line curing of a coated workpiece |
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CN102380468B (zh) * | 2010-08-27 | 2014-01-29 | 比亚迪股份有限公司 | 一种涂布设备 |
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JP6533043B2 (ja) | 2014-08-25 | 2019-06-19 | 三菱航空機株式会社 | 航空機エンジンの取り付け方法 |
CN104226545B (zh) * | 2014-09-26 | 2020-04-24 | 宁波旭升汽车技术股份有限公司 | 自动涂密封胶装置 |
US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
CN105281505B (zh) * | 2015-10-26 | 2017-12-12 | 珠海凯邦电机制造有限公司 | 一种转子表面处理装置 |
CN105583123A (zh) * | 2015-12-15 | 2016-05-18 | 深圳市联得自动化装备股份有限公司 | 涂胶装置 |
JP6737693B2 (ja) * | 2016-01-13 | 2020-08-12 | Ntn株式会社 | 微小突起の体積測定方法および液状材料の塗布方法 |
JP6473832B2 (ja) * | 2016-02-03 | 2019-02-20 | 富士フイルム株式会社 | 有機半導体膜の製造装置 |
CN105537064A (zh) * | 2016-02-18 | 2016-05-04 | 易美芯光(北京)科技有限公司 | 一种用于cob围栏胶的生产控制系统 |
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JP6835696B2 (ja) * | 2017-10-24 | 2021-02-24 | 株式会社ヒラノテクシード | 塗工装置 |
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DE69427954T2 (de) * | 1993-05-27 | 2002-04-04 | Dainippon Printing Co Ltd | Verfahren und vorrichtung zum flüssigkeitsauftrag |
JP3048789B2 (ja) * | 1993-05-31 | 2000-06-05 | 平田機工株式会社 | 流体塗布装置 |
JPH07328515A (ja) * | 1994-06-08 | 1995-12-19 | Dainippon Screen Mfg Co Ltd | 処理液塗布装置 |
-
1995
- 1995-12-27 EP EP95942298A patent/EP0761317B1/de not_active Expired - Lifetime
- 1995-12-27 US US08/700,421 patent/US6139639A/en not_active Expired - Lifetime
- 1995-12-27 CA CA002183163A patent/CA2183163C/en not_active Expired - Fee Related
- 1995-12-27 CN CN95192822A patent/CN1080143C/zh not_active Expired - Lifetime
- 1995-12-27 DE DE69527353T patent/DE69527353T2/de not_active Expired - Lifetime
- 1995-12-27 WO PCT/JP1995/002741 patent/WO1996020045A1/ja active IP Right Grant
- 1995-12-27 KR KR1019960704741A patent/KR100369571B1/ko not_active IP Right Cessation
- 1995-12-30 TW TW087219356U patent/TW484463U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69527353T2 (de) | 2003-01-30 |
EP0761317B1 (de) | 2002-07-10 |
WO1996020045A1 (fr) | 1996-07-04 |
TW484463U (en) | 2002-04-21 |
US6139639A (en) | 2000-10-31 |
KR970701099A (ko) | 1997-03-17 |
EP0761317A4 (de) | 1997-11-12 |
CN1080143C (zh) | 2002-03-06 |
CA2183163C (en) | 2006-08-08 |
CN1147215A (zh) | 1997-04-09 |
KR100369571B1 (ko) | 2003-04-10 |
CA2183163A1 (en) | 1996-10-04 |
EP0761317A1 (de) | 1997-03-12 |
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