DE69524855D1 - Bauelementstapel in mehrchiphalbleiterpackungen - Google Patents

Bauelementstapel in mehrchiphalbleiterpackungen

Info

Publication number
DE69524855D1
DE69524855D1 DE69524855T DE69524855T DE69524855D1 DE 69524855 D1 DE69524855 D1 DE 69524855D1 DE 69524855 T DE69524855 T DE 69524855T DE 69524855 T DE69524855 T DE 69524855T DE 69524855 D1 DE69524855 D1 DE 69524855D1
Authority
DE
Germany
Prior art keywords
packs
chip semiconductor
component stack
stack
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69524855T
Other languages
English (en)
Other versions
DE69524855T2 (de
Inventor
Hem Takiar
Uli Hegel
Peter Spalding
Jim Crozier
Michelle Hou-Chang
H Delateur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of DE69524855D1 publication Critical patent/DE69524855D1/de
Application granted granted Critical
Publication of DE69524855T2 publication Critical patent/DE69524855T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
DE69524855T 1994-08-25 1995-08-25 Bauelementstapel in mehrchiphalbleiterpackungen Expired - Lifetime DE69524855T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29598294A 1994-08-25 1994-08-25
PCT/US1995/010837 WO1996006459A1 (en) 1994-08-25 1995-08-25 Component stacking in multi-chip semiconductor packages

Publications (2)

Publication Number Publication Date
DE69524855D1 true DE69524855D1 (de) 2002-02-07
DE69524855T2 DE69524855T2 (de) 2002-08-14

Family

ID=23140071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524855T Expired - Lifetime DE69524855T2 (de) 1994-08-25 1995-08-25 Bauelementstapel in mehrchiphalbleiterpackungen

Country Status (5)

Country Link
US (1) US5629563A (de)
EP (1) EP0725981B1 (de)
KR (1) KR100360076B1 (de)
DE (1) DE69524855T2 (de)
WO (1) WO1996006459A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5731970A (en) * 1989-12-22 1998-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
US5804880A (en) * 1996-11-04 1998-09-08 National Semiconductor Corporation Solder isolating lead frame
US6849480B1 (en) 1999-05-07 2005-02-01 Seagate Technology Llc Surface mount IC stacking method and device
US6890798B2 (en) 1999-06-08 2005-05-10 Intel Corporation Stacked chip packaging
US6525628B1 (en) 1999-06-18 2003-02-25 Avx Corporation Surface mount RC array with narrow tab portions on each of the electrode plates
US7173336B2 (en) * 2000-01-31 2007-02-06 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US6225684B1 (en) * 2000-02-29 2001-05-01 Texas Instruments Tucson Corporation Low temperature coefficient leadframe
TWI250406B (en) 2000-03-22 2006-03-01 Int Rectifier Corp Gate driver multi-chip module
TW502492B (en) * 2000-05-30 2002-09-11 Alps Electric Co Ltd Electronic circuit unit
TW483233B (en) * 2000-05-30 2002-04-11 Alps Electric Co Ltd Electronic circuit unit
US6856006B2 (en) * 2002-03-28 2005-02-15 Siliconix Taiwan Ltd Encapsulation method and leadframe for leadless semiconductor packages
US6677672B2 (en) 2002-04-26 2004-01-13 Semiconductor Components Industries Llc Structure and method of forming a multiple leadframe semiconductor device
US6917219B2 (en) * 2003-03-12 2005-07-12 Xilinx, Inc. Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice
US6984881B2 (en) * 2003-06-16 2006-01-10 Sandisk Corporation Stackable integrated circuit package and method therefor
US7309923B2 (en) * 2003-06-16 2007-12-18 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor
US7068072B2 (en) 2003-06-30 2006-06-27 Xilinx, Inc. Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit
US20060267173A1 (en) * 2005-05-26 2006-11-30 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor
CN101283449B (zh) * 2005-07-01 2014-08-20 维税-希力康克斯公司 以单个贴装封装实现的完整功率管理系统
US20090128189A1 (en) * 2007-11-19 2009-05-21 Raminda Udaya Madurawe Three dimensional programmable devices
US8296578B1 (en) 2009-08-03 2012-10-23 Xilinx, Inc. Method and apparatus for communicating data between stacked integrated circuits
TWI484569B (zh) * 2012-07-20 2015-05-11 Nat Univ Tsing Hua 系統級封裝方法
US9859896B1 (en) 2015-09-11 2018-01-02 Xilinx, Inc. Distributed multi-die routing in a multi-chip module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112992A (en) * 1964-08-18 1968-05-08 Texas Instruments Inc Three-dimensional integrated circuits and methods of making same
US3714709A (en) * 1970-07-06 1973-02-06 Rca Corp Method of manufacturing thick-film hybrid integrated circuits
US3958075A (en) * 1974-11-11 1976-05-18 Gentron Corporation High power thick film circuit with overlapping lead frame
US5298787A (en) * 1979-08-10 1994-03-29 Massachusetts Institute Of Technology Semiconductor embedded layer technology including permeable base transistor
JPS57130453A (en) * 1981-02-06 1982-08-12 Nec Corp Thin film circuit device
US4754316A (en) * 1982-06-03 1988-06-28 Texas Instruments Incorporated Solid state interconnection system for three dimensional integrated circuit structures
DE3301673A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisches bzw. elektronisches mehrschichtbauelement
JPS62101064A (ja) * 1985-10-26 1987-05-11 Sumitomo Electric Ind Ltd 高密度集積回路装置
JPH0630292B2 (ja) * 1986-05-23 1994-04-20 株式会社村田製作所 複合部品の製造方法
US4853759A (en) * 1986-09-29 1989-08-01 American Microsystems, Inc. Integrated circuit filter with reduced die area
US5196915A (en) * 1988-11-21 1993-03-23 Hitachi, Ltd. Semiconductor device
JPH0453219A (ja) * 1990-06-20 1992-02-20 Murata Mfg Co Ltd 表面実装型電子部品
FI913587A (fi) * 1990-08-03 1992-02-04 Ppg Industries Inc Vid laog temperatur haerdbara anjoniska elektrokemiskt faellbara kompositioner.
EP0496491A1 (de) * 1991-01-22 1992-07-29 National Semiconductor Corporation Kontaktstiftloser Chip-Widerstand-Kondensator-Träger und Herstellungsverfahren
US5312765A (en) * 1991-06-28 1994-05-17 Hughes Aircraft Company Method of fabricating three dimensional gallium arsenide microelectronic device
US5382827A (en) * 1992-08-07 1995-01-17 Fujitsu Limited Functional substrates for packaging semiconductor chips
US5541442A (en) * 1994-08-31 1996-07-30 International Business Machines Corporation Integrated compact capacitor-resistor/inductor configuration

Also Published As

Publication number Publication date
EP0725981B1 (de) 2002-01-02
EP0725981A1 (de) 1996-08-14
WO1996006459A1 (en) 1996-02-29
KR100360076B1 (ko) 2003-01-15
KR960706196A (ko) 1996-11-08
DE69524855T2 (de) 2002-08-14
US5629563A (en) 1997-05-13

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