DE69524756T2 - Vertikales zwischenverbindungsverfahren für silikonsegmente - Google Patents

Vertikales zwischenverbindungsverfahren für silikonsegmente

Info

Publication number
DE69524756T2
DE69524756T2 DE69524756T DE69524756T DE69524756T2 DE 69524756 T2 DE69524756 T2 DE 69524756T2 DE 69524756 T DE69524756 T DE 69524756T DE 69524756 T DE69524756 T DE 69524756T DE 69524756 T2 DE69524756 T2 DE 69524756T2
Authority
DE
Germany
Prior art keywords
segments
stack
segment
interconnected
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69524756T
Other languages
English (en)
Other versions
DE69524756D1 (de
Inventor
V Pedersen
G Finley
M Sautter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertical Circuits Inc
Original Assignee
CUBIC MEMORY SCOTTS VALLEY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CUBIC MEMORY SCOTTS VALLEY filed Critical CUBIC MEMORY SCOTTS VALLEY
Application granted granted Critical
Publication of DE69524756D1 publication Critical patent/DE69524756D1/de
Publication of DE69524756T2 publication Critical patent/DE69524756T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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DE69524756T 1994-06-23 1995-06-08 Vertikales zwischenverbindungsverfahren für silikonsegmente Expired - Fee Related DE69524756T2 (de)

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US08/265,081 US5675180A (en) 1994-06-23 1994-06-23 Vertical interconnect process for silicon segments
PCT/US1995/006884 WO1996000494A1 (en) 1994-06-23 1995-06-08 Vertical interconnect process for silicon segments

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JP2007019527A (ja) 2007-01-25
AU2815395A (en) 1996-01-19
DE69534976D1 (de) 2006-06-08
JP3895768B2 (ja) 2007-03-22
JPH10508154A (ja) 1998-08-04
US5837566A (en) 1998-11-17
EP1158570B1 (de) 2006-05-03
EP0766909B1 (de) 2001-12-19
US5661087A (en) 1997-08-26
ATE211350T1 (de) 2002-01-15
ATE325426T1 (de) 2006-06-15
EP0766909A4 (de) 1997-10-22
TW271487B (de) 1996-03-01
DE69524756D1 (de) 2002-01-31
EP1158570A1 (de) 2001-11-28
US5675180A (en) 1997-10-07
EP0766909A1 (de) 1997-04-09
US6188126B1 (en) 2001-02-13
DE69534976T2 (de) 2006-12-28
WO1996000494A1 (en) 1996-01-04
KR100377657B1 (ko) 2004-02-05

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