DE69517248D1 - Keramik-Gehäuse mit hoher Wärmeabstrahlung - Google Patents

Keramik-Gehäuse mit hoher Wärmeabstrahlung

Info

Publication number
DE69517248D1
DE69517248D1 DE69517248T DE69517248T DE69517248D1 DE 69517248 D1 DE69517248 D1 DE 69517248D1 DE 69517248 T DE69517248 T DE 69517248T DE 69517248 T DE69517248 T DE 69517248T DE 69517248 D1 DE69517248 D1 DE 69517248D1
Authority
DE
Germany
Prior art keywords
heat radiation
high heat
ceramic housing
ceramic
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69517248T
Other languages
English (en)
Other versions
DE69517248T2 (de
Inventor
Toshiyuki Nagase
Yoshio Kanda
Yoshiro Kuromitsu
Masafumi Hatsushika
Hirokazu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of DE69517248D1 publication Critical patent/DE69517248D1/de
Application granted granted Critical
Publication of DE69517248T2 publication Critical patent/DE69517248T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3675Cooling facilitated by shape of device characterised by the shape of the housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
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    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
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    • H01L2224/32188Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
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    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
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    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
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    • H01L2224/73265Layer and wire connectors
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
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    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/01Chemical elements
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    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
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    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1517Multilayer substrate
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]
DE69517248T 1994-07-15 1995-07-01 Keramik-Gehäuse mit hoher Wärmeabstrahlung Expired - Lifetime DE69517248T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16372494 1994-07-15

Publications (2)

Publication Number Publication Date
DE69517248D1 true DE69517248D1 (de) 2000-07-06
DE69517248T2 DE69517248T2 (de) 2000-10-12

Family

ID=15779464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69517248T Expired - Lifetime DE69517248T2 (de) 1994-07-15 1995-07-01 Keramik-Gehäuse mit hoher Wärmeabstrahlung

Country Status (3)

Country Link
US (1) US5675474A (de)
EP (1) EP0693776B1 (de)
DE (1) DE69517248T2 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866320B2 (ja) * 1995-02-09 2007-01-10 日本碍子株式会社 接合体、および接合体の製造方法
EP0746022B1 (de) * 1995-05-30 1999-08-11 Motorola, Inc. Hybrid-Multichip-Modul und Verfahren zur seiner Herstellung
US5854511A (en) * 1995-11-17 1998-12-29 Anam Semiconductor, Inc. Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads
CN1160784C (zh) * 1996-03-06 2004-08-04 松下电器产业株式会社 射频功率放大模块
US5986340A (en) * 1996-05-02 1999-11-16 National Semiconductor Corporation Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
JPH09329395A (ja) * 1996-06-06 1997-12-22 Furukawa Electric Co Ltd:The ヒートシンク
DE19626227C2 (de) * 1996-06-29 1998-07-02 Bosch Gmbh Robert Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung
US6033787A (en) * 1996-08-22 2000-03-07 Mitsubishi Materials Corporation Ceramic circuit board with heat sink
US6035101A (en) * 1997-02-12 2000-03-07 Applied Materials, Inc. High temperature multi-layered alloy heater assembly and related methods
EP0899795A3 (de) * 1997-08-27 1999-05-12 Sumitomo Electric Industries, Ltd. Behälter für optisches Halbleiterelement
US6683384B1 (en) * 1997-10-08 2004-01-27 Agere Systems Inc Air isolated crossovers
US6073684A (en) 1998-02-23 2000-06-13 Applied Thermal Technology Clad casting for laptop computers and the like
US6201701B1 (en) * 1998-03-11 2001-03-13 Kimball International, Inc. Integrated substrate with enhanced thermal characteristics
US6299053B1 (en) * 1998-08-19 2001-10-09 Kulicke & Soffa Holdings, Inc. Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
US6329065B1 (en) * 1998-08-31 2001-12-11 Kyocera Corporation Wire board and method of producing the same
JP3864282B2 (ja) 1998-09-22 2006-12-27 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置
US6031727A (en) * 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
US6518515B2 (en) * 1999-02-10 2003-02-11 Matsushita Electric Industrial Co, Ltd. Printed wiring board, and method and apparatus for manufacturing the same
JP2001148451A (ja) 1999-03-24 2001-05-29 Mitsubishi Materials Corp パワーモジュール用基板
JP2000331835A (ja) * 1999-05-21 2000-11-30 Taiyo Yuden Co Ltd 積層電子部品及び回路モジュール
JP4649027B2 (ja) * 1999-09-28 2011-03-09 株式会社東芝 セラミックス回路基板
US6288900B1 (en) * 1999-12-02 2001-09-11 International Business Machines Corporation Warpage compensating heat spreader
JP4231610B2 (ja) * 2000-02-09 2009-03-04 サンデン株式会社 熱交換器用フィンの製造方法
US6763881B1 (en) * 2000-02-18 2004-07-20 Agilent Technologies, Inc. Thermally matched gradient heat sink
KR100378051B1 (ko) * 2001-03-31 2003-03-29 만도공조 주식회사 집적회로의 방열수단 접합방법과 그 접합재
JP2003163315A (ja) 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
US6449158B1 (en) * 2001-12-20 2002-09-10 Motorola, Inc. Method and apparatus for securing an electronic power device to a heat spreader
US6727193B2 (en) * 2002-03-08 2004-04-27 Sun Microsystems, Inc. Apparatus and methods for enhancing thermal performance of integrated circuit packages
US6637506B2 (en) * 2002-03-08 2003-10-28 Sun Microsystems, Inc. Multi-material heat spreader
US7274094B2 (en) * 2002-08-28 2007-09-25 Micron Technology, Inc. Leadless packaging for image sensor devices
US20040120117A1 (en) * 2002-12-20 2004-06-24 Cheng-Why Tan Electronic package with improved thermal performance
US7482685B2 (en) * 2003-09-25 2009-01-27 Kabushiki Kaisha Toshiba Ceramic circuit board, method for making the same, and power module
DE10352705A1 (de) * 2003-11-12 2005-06-23 Diehl Bgt Defence Gmbh & Co. Kg Schaltungsanordnung
WO2005098942A1 (ja) * 2004-04-05 2005-10-20 Mitsubishi Materials Corporation Ai/ain接合体、パワーモジュール用基板及びパワーモジュール並びにai/ain接合体の製造方法
TWI246760B (en) * 2004-12-22 2006-01-01 Siliconware Precision Industries Co Ltd Heat dissipating semiconductor package and fabrication method thereof
EP1858078A4 (de) * 2005-01-20 2009-03-04 Almt Corp Element für ein halbleiterbauteil und herstellungsverfahren dafür
KR101384426B1 (ko) * 2006-03-13 2014-04-10 쇼와 덴코 가부시키가이샤 파워 모듈용 베이스
TWI340010B (en) * 2006-08-04 2011-04-01 Everlight Electronics Co Ltd Circuit board with cooling functionality
JP4747315B2 (ja) * 2007-11-19 2011-08-17 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
DE102008009510B3 (de) 2008-02-15 2009-07-16 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern
US9076755B2 (en) * 2009-09-09 2015-07-07 Mitsubishi Materials Corporation Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
DE102015217231A1 (de) * 2014-09-09 2016-03-10 Ceramtec Gmbh Mehrlagenkühler
WO2023282598A1 (ko) * 2021-07-09 2023-01-12 주식회사 아모센스 세라믹 기판 및 그 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61230343A (ja) * 1985-04-05 1986-10-14 Matsushita Electric Ind Co Ltd 半導体素子用セラミツクパツケ−ジ
JPH02208033A (ja) * 1989-02-08 1990-08-17 Kawasaki Steel Corp 回路基板用セラミックス板
DE69127927T2 (de) * 1990-05-02 1998-06-04 Mitsubishi Materials Corp Keramisches Substrat verwendet für eine elektrische oder elektronische Schaltung
DE4031733A1 (de) * 1990-10-06 1992-04-09 Bosch Gmbh Robert Mehrlagenhybride mit leistungsbauelementen
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
US5455382A (en) * 1991-10-31 1995-10-03 Sumitomo Metal Industries, Ltd. IC package heat sink fin
JPH0669367A (ja) 1992-08-18 1994-03-11 Sumitomo Kinzoku Ceramics:Kk 高放熱性セラミックパッケージ
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe

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US5675474A (en) 1997-10-07
EP0693776A3 (de) 1996-04-03
EP0693776B1 (de) 2000-05-31
DE69517248T2 (de) 2000-10-12
EP0693776A2 (de) 1996-01-24

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