DE69435045D1 - Halbleiter-Anordnung und Herstellungsverfahren dafür - Google Patents

Halbleiter-Anordnung und Herstellungsverfahren dafür

Info

Publication number
DE69435045D1
DE69435045D1 DE69435045T DE69435045T DE69435045D1 DE 69435045 D1 DE69435045 D1 DE 69435045D1 DE 69435045 T DE69435045 T DE 69435045T DE 69435045 T DE69435045 T DE 69435045T DE 69435045 D1 DE69435045 D1 DE 69435045D1
Authority
DE
Germany
Prior art keywords
manufacturing
method therefor
semiconductor arrangement
semiconductor
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69435045T
Other languages
English (en)
Other versions
DE69435045T2 (de
Inventor
Toshimitsu Konuma
Akira Sugawara
Yukiko Uehara
Hongyong Zhang
Atsunori Suzuki
Hideto Ohnuma
Naoaki Yamaguchi
Hideomi Suzawa
Hideki Uochi
Yasuhiko Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28428793A external-priority patent/JP2759414B2/ja
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Application granted granted Critical
Publication of DE69435045D1 publication Critical patent/DE69435045D1/de
Publication of DE69435045T2 publication Critical patent/DE69435045T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/665—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02142—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
    • H01L21/02145—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides the material containing aluminium, e.g. AlSiOx
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02244—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of a metallic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02258—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
    • H01L21/31683—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of metallic layers, e.g. Al deposited on the body, e.g. formation of multi-layer insulating structures
    • H01L21/31687—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of metallic layers, e.g. Al deposited on the body, e.g. formation of multi-layer insulating structures by anodic oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/456—Ohmic electrodes on silicon
    • H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
    • H01L29/66598—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET forming drain [D] and lightly doped drain [LDD] simultaneously, e.g. using implantation through the wings a T-shaped layer, or through a specially shaped layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • H01L29/78627—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
    • H01L21/31683—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of metallic layers, e.g. Al deposited on the body, e.g. formation of multi-layer insulating structures
DE69435045T 1993-09-20 1994-09-20 Halbleiter-Anordnung und Herstellungsverfahren dafür Expired - Lifetime DE69435045T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP25656793 1993-09-20
JP25656593 1993-09-20
JP25656393 1993-09-20
JP25656793 1993-09-20
JP25656393 1993-09-20
JP25656593 1993-09-20
JP28428793A JP2759414B2 (ja) 1993-10-19 1993-10-19 半導体装置の作製方法
JP28428793 1993-10-19

Publications (2)

Publication Number Publication Date
DE69435045D1 true DE69435045D1 (de) 2008-01-03
DE69435045T2 DE69435045T2 (de) 2008-10-02

Family

ID=27478405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69435045T Expired - Lifetime DE69435045T2 (de) 1993-09-20 1994-09-20 Halbleiter-Anordnung und Herstellungsverfahren dafür

Country Status (6)

Country Link
US (7) US6867431B2 (de)
EP (3) EP1564800A3 (de)
KR (1) KR100306829B1 (de)
CN (5) CN1652351B (de)
DE (1) DE69435045T2 (de)
TW (1) TW297142B (de)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3437863B2 (ja) 1993-01-18 2003-08-18 株式会社半導体エネルギー研究所 Ｍｉｓ型半導体装置の作製方法
TW297142B (de) 1993-09-20 1997-02-01 Handotai Energy Kenkyusho Kk
US5719065A (en) 1993-10-01 1998-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with removable spacers
US6777763B1 (en) 1993-10-01 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
TW299897U (en) 1993-11-05 1997-03-01 Semiconductor Energy Lab A semiconductor integrated circuit
JPH09146108A (ja) 1995-11-17 1997-06-06 Semiconductor Energy Lab Co Ltd 液晶表示装置およびその駆動方法
JP3963974B2 (ja) 1995-12-20 2007-08-22 株式会社半導体エネルギー研究所 液晶電気光学装置
TW374196B (en) 1996-02-23 1999-11-11 Semiconductor Energy Lab Co Ltd Semiconductor thin film and method for manufacturing the same and semiconductor device and method for manufacturing the same
JPH10135475A (ja) * 1996-10-31 1998-05-22 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP3788649B2 (ja) * 1996-11-22 2006-06-21 株式会社半導体エネルギー研究所 液晶表示装置
JPH10228248A (ja) * 1996-12-09 1998-08-25 Semiconductor Energy Lab Co Ltd アクティブマトリクス表示装置およびその作製方法
JP4318768B2 (ja) 1997-07-23 2009-08-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6686623B2 (en) 1997-11-18 2004-02-03 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile memory and electronic apparatus
US20080042554A1 (en) * 1998-05-18 2008-02-21 Kabushiki Kaisha Toshiba Image display device and light emission device
JP2000012864A (ja) 1998-06-22 2000-01-14 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP4324259B2 (ja) * 1998-07-07 2009-09-02 シャープ株式会社 液晶表示装置の製造方法
JP3592535B2 (ja) * 1998-07-16 2004-11-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6271101B1 (en) * 1998-07-29 2001-08-07 Semiconductor Energy Laboratory Co., Ltd. Process for production of SOI substrate and process for production of semiconductor device
US6559036B1 (en) * 1998-08-07 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
JP4476390B2 (ja) 1998-09-04 2010-06-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6617644B1 (en) 1998-11-09 2003-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US6909114B1 (en) 1998-11-17 2005-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having LDD regions
US6501098B2 (en) * 1998-11-25 2002-12-31 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
US6365917B1 (en) * 1998-11-25 2002-04-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6777716B1 (en) 1999-02-12 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and method of manufacturing therefor
US6576924B1 (en) * 1999-02-12 2003-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having at least a pixel unit and a driver circuit unit over a same substrate
EP1031873A3 (de) * 1999-02-23 2005-02-23 Sel Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Verfahren zu dessen Herstellung
US7821065B2 (en) 1999-03-02 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same
US6674136B1 (en) * 1999-03-04 2004-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having driver circuit and pixel section provided over same substrate
US6531713B1 (en) 1999-03-19 2003-03-11 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and manufacturing method thereof
TW469484B (en) 1999-03-26 2001-12-21 Semiconductor Energy Lab A method for manufacturing an electrooptical device
US7145536B1 (en) * 1999-03-26 2006-12-05 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
TW444257B (en) 1999-04-12 2001-07-01 Semiconductor Energy Lab Semiconductor device and method for fabricating the same
TW518637B (en) * 1999-04-15 2003-01-21 Semiconductor Energy Lab Electro-optical device and electronic equipment
US6512504B1 (en) * 1999-04-27 2003-01-28 Semiconductor Energy Laborayory Co., Ltd. Electronic device and electronic apparatus
EP2256808A2 (de) 1999-04-30 2010-12-01 Semiconductor Energy Laboratory Co, Ltd. Halbleiterbauelement und dessen Herstellungsverfahren
US6370502B1 (en) * 1999-05-27 2002-04-09 America Online, Inc. Method and system for reduction of quantization-induced block-discontinuities and general purpose audio codec
JP2000340794A (ja) * 1999-06-01 2000-12-08 Mitsubishi Electric Corp 半導体装置およびその製造方法
US7245018B1 (en) * 1999-06-22 2007-07-17 Semiconductor Energy Laboratory Co., Ltd. Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof
US6952020B1 (en) 1999-07-06 2005-10-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US6515648B1 (en) * 1999-08-31 2003-02-04 Semiconductor Energy Laboratory Co., Ltd. Shift register circuit, driving circuit of display device, and display device using the driving circuit
US6645837B2 (en) * 2000-05-31 2003-11-11 Sony Corporation Method of manufacturing semiconductor device
CN100523966C (zh) * 2001-02-06 2009-08-05 株式会社日立制作所 显示装置及其制造方法
JP5038560B2 (ja) 2001-08-01 2012-10-03 ゲットナー・ファンデーション・エルエルシー 電界効果型トランジスタ及びその製造方法並びに該トランジスタを使った液晶表示装置及びその製造方法
JP4308496B2 (ja) * 2002-03-01 2009-08-05 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2004134687A (ja) * 2002-10-15 2004-04-30 Toshiba Corp 半導体装置及びその製造方法
TW582099B (en) * 2003-03-13 2004-04-01 Ind Tech Res Inst Method of adhering material layer on transparent substrate and method of forming single crystal silicon on transparent substrate
JP4537029B2 (ja) * 2003-09-30 2010-09-01 シャープ株式会社 薄膜トランジスタ装置及びその製造方法、並びにそれを備えた薄膜トランジスタ基板及び表示装置
US6852584B1 (en) * 2004-01-14 2005-02-08 Tokyo Electron Limited Method of trimming a gate electrode structure
KR101155943B1 (ko) * 2004-04-28 2012-06-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Ｍｏｓ 캐패시터 및 반도체 장치
JP4321486B2 (ja) * 2004-07-12 2009-08-26 セイコーエプソン株式会社 半導体装置及び半導体装置の製造方法
US7939873B2 (en) * 2004-07-30 2011-05-10 Semiconductor Energy Laboratory Co., Ltd. Capacitor element and semiconductor device
US7575959B2 (en) * 2004-11-26 2009-08-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US20060197088A1 (en) * 2005-03-07 2006-09-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
CN100362355C (zh) * 2005-05-27 2008-01-16 东南大学 微型抗辐射电场传感器
US20070054442A1 (en) * 2005-09-08 2007-03-08 Po-Chih Liu Method for manufacturing thin film transistor, thin film transistor and pixel structure
US7659580B2 (en) * 2005-12-02 2010-02-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7790527B2 (en) * 2006-02-03 2010-09-07 International Business Machines Corporation High-voltage silicon-on-insulator transistors and methods of manufacturing the same
ES2535232T3 (es) * 2006-03-27 2015-05-06 The Lubrizol Corporation Polímeros y composiciones lubricantes de los mismos
US7696024B2 (en) * 2006-03-31 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1863090A1 (de) * 2006-06-01 2007-12-05 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
JP5352081B2 (ja) * 2006-12-20 2013-11-27 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI345318B (en) * 2007-07-20 2011-07-11 Chimei Innolux Corp Light emitting diode
JP5393058B2 (ja) * 2007-09-05 2014-01-22 キヤノン株式会社 電界効果型トランジスタ
JP5219529B2 (ja) * 2008-01-23 2013-06-26 キヤノン株式会社 電界効果型トランジスタ及び、該電界効果型トランジスタを備えた表示装置
JP5234333B2 (ja) * 2008-05-28 2013-07-10 Ｎｌｔテクノロジー株式会社 ゲート線駆動回路、アクティブマトリクス基板及び液晶表示装置
US8314765B2 (en) 2008-06-17 2012-11-20 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, display device, and electronic device
WO2011074407A1 (en) 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8791546B2 (en) * 2010-10-21 2014-07-29 Freescale Semiconductor, Inc. Bipolar transistors having emitter-base junctions of varying depths and/or doping concentrations
US20120319113A1 (en) * 2011-06-17 2012-12-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI556319B (zh) 2011-11-30 2016-11-01 半導體能源研究所股份有限公司 半導體裝置的製造方法
US9099489B2 (en) 2012-07-10 2015-08-04 Freescale Semiconductor Inc. Bipolar transistor with high breakdown voltage
US9368360B2 (en) 2013-04-28 2016-06-14 Boe Technology Group Co., Ltd Anti-diffusion layer, preparation method thereof, thin-film transistor (TFT), array substrate, display device
US9449827B2 (en) 2014-02-04 2016-09-20 International Business Machines Corporation Metal semiconductor alloy contact resistance improvement
US9087689B1 (en) * 2014-07-11 2015-07-21 Inoso, Llc Method of forming a stacked low temperature transistor and related devices
US10580708B2 (en) * 2017-02-17 2020-03-03 Ablic Inc. Method of manufacturing a semiconductor device and semiconductor device
CN109637932B (zh) * 2018-11-30 2020-11-10 武汉华星光电技术有限公司 薄膜晶体管及其制备方法
CN110223990B (zh) * 2019-06-18 2022-03-08 京东方科技集团股份有限公司 顶栅结构及其制备方法、阵列基板、显示设备
CN112928153B (zh) * 2019-12-05 2023-07-04 中芯国际集成电路制造（天津）有限公司 半导体结构及其形成方法
CN113140637A (zh) * 2020-01-20 2021-07-20 京东方科技集团股份有限公司 显示装置、阵列基板、薄膜晶体管及其制造方法
CN112103245B (zh) * 2020-09-22 2023-08-11 成都京东方显示科技有限公司 阵列基板的制造方法、阵列基板及显示面板
CN112114460B (zh) * 2020-09-23 2022-12-23 北海惠科光电技术有限公司 基于阵列基板的绝缘单元及其制备方法、阵列基板及其制备方法、显示机构
CN113430615B (zh) * 2021-06-09 2022-02-15 华南理工大学 一种阳极氧化铝膜及其制备方法和应用
CN113529150B (zh) * 2021-06-23 2022-03-29 华南理工大学 一种亚微米氧化铝管及其制备方法和应用

Family Cites Families (172)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL161617C (nl) 1968-06-17 1980-02-15 Nippon Electric Co Halfgeleiderinrichting met vlak oppervlak en werkwijze voor het vervaardigen daarvan.
JPS5124341B2 (de) 1971-12-24 1976-07-23
US3775262A (en) 1972-02-09 1973-11-27 Ncr Method of making insulated gate field effect transistor
JPS4995591A (de) 1973-01-12 1974-09-10
JPS5423345B2 (de) 1974-02-02 1979-08-13
US4065781A (en) 1974-06-21 1977-12-27 Westinghouse Electric Corporation Insulated-gate thin film transistor with low leakage current
US4040073A (en) 1975-08-29 1977-08-02 Westinghouse Electric Corporation Thin film transistor and display panel using the transistor
US3997367A (en) 1975-11-20 1976-12-14 Bell Telephone Laboratories, Incorporated Method for making transistors
JPS5470762A (en) * 1977-11-16 1979-06-06 Seiko Instr & Electronics Ltd Semiconductor device
US4236167A (en) 1978-02-06 1980-11-25 Rca Corporation Stepped oxide, high voltage MOS transistor with near intrinsic channel regions of different doping levels
JPS54161282A (en) * 1978-06-12 1979-12-20 Toshiba Corp Manufacture of mos semiconductor device
US4232327A (en) * 1978-11-13 1980-11-04 Rca Corporation Extended drain self-aligned silicon gate MOSFET
US4319395A (en) * 1979-06-28 1982-03-16 Motorola, Inc. Method of making self-aligned device
US4336550A (en) 1980-03-20 1982-06-22 Rca Corporation CMOS Device with silicided sources and drains and method
US4622735A (en) * 1980-12-12 1986-11-18 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a semiconductor device utilizing self-aligned silicide regions
DE3272410D1 (en) 1981-02-16 1986-09-11 Fujitsu Ltd Method of producing mosfet type semiconductor device
JPS5823479A (ja) 1981-08-05 1983-02-12 Fujitsu Ltd 半導体装置の製造方法
JPS5837967A (ja) * 1981-08-31 1983-03-05 Toshiba Corp Ｍｉｓ型半導体装置の製造方法
JPS5895814A (ja) 1981-11-30 1983-06-07 Mitsubishi Electric Corp 半導体装置の製造方法
JPS58105574A (ja) * 1981-12-17 1983-06-23 Seiko Epson Corp 液晶表示装置
JPS58118154A (ja) 1982-01-07 1983-07-14 Seiko Epson Corp 半導体集積回路装置
JPS58142566A (ja) * 1982-02-19 1983-08-24 Seiko Epson Corp 薄膜半導体装置
US4557036A (en) 1982-03-31 1985-12-10 Nippon Telegraph & Telephone Public Corp. Semiconductor device and process for manufacturing the same
JPS59188974A (ja) 1983-04-11 1984-10-26 Nec Corp 半導体装置の製造方法
US4503601A (en) 1983-04-18 1985-03-12 Ncr Corporation Oxide trench structure for polysilicon gates and interconnects
JPS59220971A (ja) 1983-05-31 1984-12-12 Toshiba Corp 半導体装置の製造方法
JPH0693509B2 (ja) 1983-08-26 1994-11-16 シャープ株式会社 薄膜トランジスタ
JPS6055665A (ja) * 1983-09-06 1985-03-30 Toshiba Corp 半導体装置の製造方法
US4727044A (en) 1984-05-18 1988-02-23 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor with laser recrystallized source and drain
US4727038A (en) 1984-08-22 1988-02-23 Mitsubishi Denki Kabushiki Kaisha Method of fabricating semiconductor device
JPS61224360A (ja) * 1985-03-28 1986-10-06 Sony Corp 電界効果トランジスタの製造方法
JPS61224459A (ja) 1985-03-29 1986-10-06 Toshiba Corp 半導体装置およびその製造方法
JPS6232653A (ja) 1985-08-05 1987-02-12 Nippon Telegr & Teleph Corp <Ntt> 薄膜トランジスタの製造方法
EP0222215B1 (de) * 1985-10-23 1991-10-16 Hitachi, Ltd. Polysilizium-MOS-Transistor und Verfahren zu seiner Herstellung
US4727004A (en) 1985-11-21 1988-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent device
US4701423A (en) 1985-12-20 1987-10-20 Ncr Corporation Totally self-aligned CMOS process
US4755865A (en) 1986-01-21 1988-07-05 Motorola Inc. Means for stabilizing polycrystalline semiconductor layers
US4690730A (en) 1986-03-07 1987-09-01 Texas Instruments Incorporated Oxide-capped titanium silicide formation
JPS62229873A (ja) 1986-03-29 1987-10-08 Hitachi Ltd 薄膜半導体装置の製造方法
JPH0777264B2 (ja) 1986-04-02 1995-08-16 三菱電機株式会社 薄膜トランジスタの製造方法
JPS6366969A (ja) 1986-09-08 1988-03-25 Nippon Telegr & Teleph Corp <Ntt> 高耐圧多結晶シリコン薄膜トランジスタ
US4728617A (en) * 1986-11-04 1988-03-01 Intel Corporation Method of fabricating a MOSFET with graded source and drain regions
US4753896A (en) 1986-11-21 1988-06-28 Texas Instruments Incorporated Sidewall channel stop process
JPH0828510B2 (ja) 1987-01-20 1996-03-21 富士通株式会社 薄膜トランジスタの形成方法
JPH0687503B2 (ja) 1987-03-11 1994-11-02 株式会社日立製作所 薄膜半導体装置
US5024960A (en) 1987-06-16 1991-06-18 Texas Instruments Incorporated Dual LDD submicron CMOS process for making low and high voltage transistors with common gate
JPS647567A (en) 1987-06-29 1989-01-11 Ricoh Kk Mos transistor
US4818715A (en) * 1987-07-09 1989-04-04 Industrial Technology Research Institute Method of fabricating a LDDFET with self-aligned silicide
JPS6421919A (en) 1987-07-16 1989-01-25 Nec Corp Manufacture of semiconductor device
JPH01114070A (ja) 1987-10-28 1989-05-02 Hitachi Ltd 半導体装置の製造方法
US5075674A (en) 1987-11-19 1991-12-24 Sharp Kabushiki Kaisha Active matrix substrate for liquid crystal display
US4855247A (en) * 1988-01-19 1989-08-08 Standard Microsystems Corporation Process for fabricating self-aligned silicide lightly doped drain MOS devices
JPH01183853A (ja) 1988-01-19 1989-07-21 Toshiba Corp 薄膜電界効果トランジスタとその製造方法
US4908326A (en) * 1988-01-19 1990-03-13 Standard Microsystems Corporation Process for fabricating self-aligned silicide lightly doped drain MOS devices
NL8800222A (nl) 1988-01-29 1989-08-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij op zelfregistrerende wijze metaalsilicide wordt aangebracht.
US5258319A (en) * 1988-02-19 1993-11-02 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a MOS type field effect transistor using an oblique ion implantation step
US5238859A (en) 1988-04-26 1993-08-24 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
JP2653099B2 (ja) * 1988-05-17 1997-09-10 セイコーエプソン株式会社 アクティブマトリクスパネル，投写型表示装置及びビューファインダー
US5274279A (en) * 1988-05-17 1993-12-28 Seiko Epson Corporation Thin film CMOS inverter
JPH01291467A (ja) 1988-05-19 1989-11-24 Toshiba Corp 薄膜トランジスタ
JP2752991B2 (ja) 1988-07-14 1998-05-18 株式会社東芝 半導体装置
JPH0242419A (ja) 1988-08-02 1990-02-13 Hitachi Ltd 半導体装置およびその製造方法
US5146291A (en) 1988-08-31 1992-09-08 Mitsubishi Denki Kabushiki Kaisha MIS device having lightly doped drain structure
US4978626A (en) 1988-09-02 1990-12-18 Motorola, Inc. LDD transistor process having doping sensitive endpoint etching
JP2934445B2 (ja) * 1988-12-14 1999-08-16 ソニー株式会社 薄膜トランジスタの形成方法
JPH02162738A (ja) * 1988-12-15 1990-06-22 Nec Corp Ｍｏｓ　ｆｅｔ　の製造方法
JPH02246277A (ja) * 1989-03-20 1990-10-02 Matsushita Electron Corp Ｍｏｓトランジスタおよびその製造方法
US5231038A (en) * 1989-04-04 1993-07-27 Mitsubishi Denki Kabushiki Kaisha Method of producing field effect transistor
JPH0783127B2 (ja) * 1989-04-20 1995-09-06 三菱電機株式会社 半導体装置
JPH0338755A (ja) * 1989-07-05 1991-02-19 Nec Corp ファイル転送システム
JPH03142418A (ja) * 1989-10-30 1991-06-18 Matsushita Electron Corp 画像表示装置およびその製造方法
JP2921889B2 (ja) * 1989-11-27 1999-07-19 株式会社東芝 半導体装置の製造方法
JP2890584B2 (ja) * 1989-12-29 1999-05-17 ソニー株式会社 半導体装置の製造方法
JPH0787189B2 (ja) 1990-01-19 1995-09-20 松下電器産業株式会社 半導体装置の製造方法
JPH03227068A (ja) * 1990-02-01 1991-10-08 Casio Comput Co Ltd 薄膜トランジスタおよびその製造方法
KR950000141B1 (ko) * 1990-04-03 1995-01-10 미쓰비시 뎅끼 가부시끼가이샤 반도체 장치 및 그 제조방법
DE69127395T2 (de) * 1990-05-11 1998-01-02 Asahi Glass Co Ltd Verfahren zum Herstellen eines Dünnfilm-Transistors mit polykristallinem Halbleiter
US5126283A (en) 1990-05-21 1992-06-30 Motorola, Inc. Process for the selective encapsulation of an electrically conductive structure in a semiconductor device
US5227321A (en) 1990-07-05 1993-07-13 Micron Technology, Inc. Method for forming MOS transistors
JP3163092B2 (ja) * 1990-08-09 2001-05-08 株式会社東芝 半導体装置の製造方法
JPH04121914A (ja) * 1990-09-11 1992-04-22 Nippon Light Metal Co Ltd 絶縁アルミニウム線材及びその製造方法
JP2940880B2 (ja) * 1990-10-09 1999-08-25 三菱電機株式会社 半導体装置およびその製造方法
JP2947654B2 (ja) * 1990-10-31 1999-09-13 キヤノン株式会社 Ｍｉｓ型トランジスタ
SG63578A1 (en) * 1990-11-16 1999-03-30 Seiko Epson Corp Thin film semiconductor device process for fabricating the same and silicon film
JP2660451B2 (ja) * 1990-11-19 1997-10-08 三菱電機株式会社 半導体装置およびその製造方法
US5514879A (en) 1990-11-20 1996-05-07 Semiconductor Energy Laboratory Co., Ltd. Gate insulated field effect transistors and method of manufacturing the same
JPH04196328A (ja) * 1990-11-28 1992-07-16 Casio Comput Co Ltd 電界効果型トランジスタ
JP2999271B2 (ja) 1990-12-10 2000-01-17 株式会社半導体エネルギー研究所 表示装置
US5097301A (en) 1990-12-19 1992-03-17 Intel Corporation Composite inverse T-gate metal oxide semiconductor device and method of fabrication
JPH0817236B2 (ja) * 1990-12-25 1996-02-21 株式会社半導体エネルギー研究所 半導体装置
DE69125260T2 (de) * 1990-12-28 1997-10-02 Sharp Kk Ein Verfahren zum Herstellen eines Dünnfilm-Transistors und eines Aktive-Matrix-Substrates für Flüssig-Kristall-Anzeige-Anordnungen
US5236865A (en) * 1991-01-16 1993-08-17 Micron Technology, Inc. Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer
JP2717234B2 (ja) * 1991-05-11 1998-02-18 株式会社 半導体エネルギー研究所 絶縁ゲイト型電界効果半導体装置およびその作製方法
US5289030A (en) * 1991-03-06 1994-02-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with oxide layer
EP0499979A3 (en) 1991-02-16 1993-06-09 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US5521107A (en) 1991-02-16 1996-05-28 Semiconductor Energy Laboratory Co., Ltd. Method for forming a field-effect transistor including anodic oxidation of the gate
NL9100334A (nl) * 1991-02-26 1992-09-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een zelfregistrerend kobalt- of nikkel-silicide gevormd wordt.
USRE36314E (en) 1991-03-06 1999-09-28 Semiconductor Energy Laboratory Co., Ltd. Insulated gate field effect semiconductor devices having a LDD region and an anodic oxide film of a gate electrode
JP2794678B2 (ja) * 1991-08-26 1998-09-10 株式会社 半導体エネルギー研究所 絶縁ゲイト型半導体装置およびその作製方法
US5468987A (en) 1991-03-06 1995-11-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
JPH04287025A (ja) * 1991-03-15 1992-10-12 Hitachi Ltd 薄膜トランジスタ基板およびその製造方法ならびに液晶表示パネルおよび液晶表示装置
JP2794499B2 (ja) 1991-03-26 1998-09-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH04305939A (ja) * 1991-04-02 1992-10-28 Seiko Epson Corp 薄膜トランジスタの製造方法
JP3277548B2 (ja) 1991-05-08 2002-04-22 セイコーエプソン株式会社 ディスプレイ基板
JP2717237B2 (ja) * 1991-05-16 1998-02-18 株式会社 半導体エネルギー研究所 絶縁ゲイト型半導体装置およびその作製方法
US5151374A (en) 1991-07-24 1992-09-29 Industrial Technology Research Institute Method of forming a thin film field effect transistor having a drain channel junction that is spaced from the gate electrode
TW476451U (en) 1991-08-23 2002-02-11 Semiconductor Energy Lab Semiconductor device
JP2845303B2 (ja) 1991-08-23 1999-01-13 株式会社 半導体エネルギー研究所 半導体装置とその作製方法
US5545571A (en) 1991-08-26 1996-08-13 Semiconductor Energy Laboratory Co., Ltd. Method of making TFT with anodic oxidation process using positive and negative voltages
US5650338A (en) 1991-08-26 1997-07-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming thin film transistor
JP3345756B2 (ja) * 1991-08-28 2002-11-18 セイコーエプソン株式会社 半導体装置の製造方法
US5182619A (en) * 1991-09-03 1993-01-26 Motorola, Inc. Semiconductor device having an MOS transistor with overlapped and elevated source and drain
JPH0793363B2 (ja) * 1991-09-25 1995-10-09 株式会社半導体エネルギー研究所 半導体集積回路およびその作製方法
US5495121A (en) 1991-09-30 1996-02-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2650543B2 (ja) * 1991-11-25 1997-09-03 カシオ計算機株式会社 マトリクス回路駆動装置
JP3092634B2 (ja) * 1991-11-29 2000-09-25 カシオ計算機株式会社 薄膜トランジスタの製造方法
JPH05152326A (ja) * 1991-12-02 1993-06-18 Matsushita Electric Ind Co Ltd 薄膜トランジスタの製造方法
JP2750380B2 (ja) * 1991-12-03 1998-05-13 株式会社 半導体エネルギー研究所 半導体装置の作製方法
JPH05175230A (ja) * 1991-12-20 1993-07-13 Toshiba Corp 薄膜トランジスタの製造方法
JP2564725B2 (ja) * 1991-12-24 1996-12-18 株式会社半導体エネルギー研究所 Ｍｏｓ型トランジスタの作製方法
JP3313432B2 (ja) 1991-12-27 2002-08-12 株式会社東芝 半導体装置及びその製造方法
US5485019A (en) 1992-02-05 1996-01-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
JPH05226364A (ja) * 1992-02-14 1993-09-03 Fujitsu Ltd Ｍｉｓ型電界効果トランジスタの製造方法
JP3186182B2 (ja) * 1992-03-25 2001-07-11 セイコーエプソン株式会社 薄膜半導体装置及びその製造方法
JPH05275449A (ja) * 1992-03-26 1993-10-22 Seiko Epson Corp 薄膜半導体装置及びその製造方法
JP3506445B2 (ja) * 1992-05-12 2004-03-15 沖電気工業株式会社 半導体装置の製造方法
US5241193A (en) 1992-05-19 1993-08-31 Motorola, Inc. Semiconductor device having a thin-film transistor and process
JPH06124962A (ja) * 1992-10-09 1994-05-06 Semiconductor Energy Lab Co Ltd 薄膜状半導体装置およびその作製方法
JP3252290B2 (ja) * 1992-06-26 2002-02-04 カシオ計算機株式会社 薄膜バイポーラトランジスタおよびそれを用いた薄膜半導体装置
US5252502A (en) * 1992-08-03 1993-10-12 Texas Instruments Incorporated Method of making MOS VLSI semiconductor device with metal gate
US5407837A (en) * 1992-08-31 1995-04-18 Texas Instruments Incorporated Method of making a thin film transistor
EP0589478B1 (de) * 1992-09-25 1999-11-17 Sony Corporation Flüssigkristall-Anzeigevorrichtung
TW232751B (en) 1992-10-09 1994-10-21 Semiconductor Energy Res Co Ltd Semiconductor device and method for forming the same
US5576556A (en) 1993-08-20 1996-11-19 Semiconductor Energy Laboratory Co., Ltd. Thin film semiconductor device with gate metal oxide and sidewall spacer
US5403762A (en) 1993-06-30 1995-04-04 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a TFT
JP3587537B2 (ja) 1992-12-09 2004-11-10 株式会社半導体エネルギー研究所 半導体装置
JP3437863B2 (ja) 1993-01-18 2003-08-18 株式会社半導体エネルギー研究所 Ｍｉｓ型半導体装置の作製方法
US5985741A (en) * 1993-02-15 1999-11-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
CN1542929B (zh) * 1993-03-12 2012-05-30 株式会社半导体能源研究所 半导体器件的制造方法
US5747355A (en) 1993-03-30 1998-05-05 Semiconductor Energy Laboratory Co., Ltd. Method for producing a transistor using anodic oxidation
JP3367618B2 (ja) * 1993-03-30 2003-01-14 株式会社半導体エネルギー研究所 薄膜トランジスタおよびその作製方法
US5572040A (en) 1993-07-12 1996-11-05 Peregrine Semiconductor Corporation High-frequency wireless communication system on a single ultrathin silicon on sapphire chip
JP2789293B2 (ja) * 1993-07-14 1998-08-20 株式会社半導体エネルギー研究所 半導体装置作製方法
US5492843A (en) 1993-07-31 1996-02-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating semiconductor device and method of processing substrate
JP2002033329A (ja) 1993-09-20 2002-01-31 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2002033328A (ja) 1993-09-20 2002-01-31 Semiconductor Energy Lab Co Ltd 半導体装置
TW297142B (de) 1993-09-20 1997-02-01 Handotai Energy Kenkyusho Kk
JP3212060B2 (ja) * 1993-09-20 2001-09-25 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP2805590B2 (ja) * 1993-09-20 1998-09-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6777763B1 (en) * 1993-10-01 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
US5719065A (en) 1993-10-01 1998-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with removable spacers
JP3030368B2 (ja) 1993-10-01 2000-04-10 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JPH07135323A (ja) 1993-10-20 1995-05-23 Semiconductor Energy Lab Co Ltd 薄膜状半導体集積回路およびその作製方法
KR970010685B1 (ko) 1993-10-30 1997-06-30 삼성전자 주식회사 누설전류가 감소된 박막 트랜지스터 및 그 제조방법
US5576231A (en) 1993-11-05 1996-11-19 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating an insulated gate field effect transistor with an anodic oxidized gate electrode
TW299897U (en) 1993-11-05 1997-03-01 Semiconductor Energy Lab A semiconductor integrated circuit
KR100275717B1 (ko) * 1993-12-28 2000-12-15 윤종용 다결정 실리콘 박막 트랜지스터 제조 방법
JP2873660B2 (ja) 1994-01-08 1999-03-24 株式会社半導体エネルギー研究所 半導体集積回路の作製方法
HU214588B (hu) 1994-07-01 1998-04-28 EGIS Gyógyszergyár Rt. Eljárás bicikloheptán-származékot tartalmazó, CCK-rendszer gátló hatású gyógyászati készítmények előállítására
JP3330736B2 (ja) 1994-07-14 2002-09-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
US5789762A (en) 1994-09-14 1998-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor active matrix circuit
JPH10135475A (ja) * 1996-10-31 1998-05-22 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US5888888A (en) * 1997-01-29 1999-03-30 Ultratech Stepper, Inc. Method for forming a silicide region on a silicon body
US6255214B1 (en) * 1999-02-24 2001-07-03 Advanced Micro Devices, Inc. Method of forming junction-leakage free metal silicide in a semiconductor wafer by amorphization of source and drain regions
US6572900B1 (en) * 2000-06-09 2003-06-03 Wm. Wrigley, Jr. Company Method for making coated chewing gum products including a high-intensity sweetener
KR100491141B1 (ko) * 2001-03-02 2005-05-24 삼성에스디아이 주식회사 박막 트랜지스터 및 그의 제조방법과 이를 이용한 액티브매트릭스형 표시소자 및 그의 제조방법
US6566213B2 (en) * 2001-04-02 2003-05-20 Advanced Micro Devices, Inc. Method of fabricating multi-thickness silicide device formed by disposable spacers
US6441433B1 (en) * 2001-04-02 2002-08-27 Advanced Micro Devices, Inc. Method of making a multi-thickness silicide SOI device
TW480735B (en) * 2001-04-24 2002-03-21 United Microelectronics Corp Structure and manufacturing method of polysilicon thin film transistor
US7112495B2 (en) * 2003-08-15 2006-09-26 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit
JP2006012991A (ja) * 2004-06-23 2006-01-12 Toshiba Corp 半導体記憶装置
US7575959B2 (en) * 2004-11-26 2009-08-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
EP1564800A2 (de) 2005-08-17
CN100502046C (zh) 2009-06-17
US20050153489A1 (en) 2005-07-14
CN1173388C (zh) 2004-10-27
US20090289254A1 (en) 2009-11-26
US7381599B2 (en) 2008-06-03
US20050142705A1 (en) 2005-06-30
CN1652352A (zh) 2005-08-10
TW297142B (de) 1997-02-01
EP1564800A3 (de) 2006-03-15
US8198683B2 (en) 2012-06-12
CN1109220A (zh) 1995-09-27
EP1564799A3 (de) 2005-12-28
US20030100152A1 (en) 2003-05-29
DE69435045T2 (de) 2008-10-02
US7569856B2 (en) 2009-08-04
CN100423290C (zh) 2008-10-01
US20110068339A1 (en) 2011-03-24
EP0645802A3 (de) 1998-03-11
EP0645802A2 (de) 1995-03-29
US6867431B2 (en) 2005-03-15
EP1564799A2 (de) 2005-08-17
CN1223465A (zh) 1999-07-21
US7525158B2 (en) 2009-04-28
US7847355B2 (en) 2010-12-07
EP0645802B1 (de) 2007-11-21
CN1652351A (zh) 2005-08-10
CN1652351B (zh) 2010-05-12
CN1571165A (zh) 2005-01-26
US6049092A (en) 2000-04-11
US20040256621A1 (en) 2004-12-23
KR100306829B1 (ko) 2001-12-15
CN1055790C (zh) 2000-08-23

Similar Documents

Publication Publication Date Title
DE69435045D1 (de) Halbleiter-Anordnung und Herstellungsverfahren dafür
DE69413602T2 (de) Halbleiteranordnung und Herstellungsverfahren
KR950034612A (ko) 반도체 구조물 및 그 제조 방법
DE69430511T2 (de) Halbleiteranordnung und Herstellungverfahren
DE69435205D1 (de) Dünne Halbleitervorrichtung und Herstellungsverfahren
DE69834561D1 (de) Halbleiteranordnung und herstellungsverfahren dafür
DE69424728T2 (de) Halbleiteranordnung und zugehörige Herstellungsmethode
DE69527330T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69414208D1 (de) Optischer Halbleitervorrichtung und Herstellungsverfahren
DE69323127T2 (de) Halbleitervorrichtung und Herstellungsverfahren
DE69733450D1 (de) Thermoelektrischer Halbleiter und Herstellungsverfahren dafür
KR960009110A (ko) 반도체 장치 및 그 제조방법
DE69721411D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69522514T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69526539D1 (de) Halbleiteranordnung und Herstellungsverfahren
DE69525795T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69429906T2 (de) Halbleiterstruktur und Herstellungsverfahren
DE69325343T2 (de) Halbleiteranordnung und Herstellungsverfahren dafür
KR960009107A (ko) 반도체장치와 그 제조방법
KR960015900A (ko) 반도체 장치 및 그 제조방법
DE69433337D1 (de) Halbleiterbauelement und dessen Herstellungsverfahren
DE69420944T2 (de) Halbleitervorrichtung und herstellungsverfahren
KR960012313A (ko) 반도체 장치 및 그 제조방법
DE69712541D1 (de) Halbleiterlaser und Herstellungsverfahren
DE69408248D1 (de) Bipolares Halbleiterbauelement und Herstellungsverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition