DE69426472T2 - Klebstoffe für stromlose Metallisierung und Leiterplatten - Google Patents

Klebstoffe für stromlose Metallisierung und Leiterplatten

Info

Publication number
DE69426472T2
DE69426472T2 DE1994626472 DE69426472T DE69426472T2 DE 69426472 T2 DE69426472 T2 DE 69426472T2 DE 1994626472 DE1994626472 DE 1994626472 DE 69426472 T DE69426472 T DE 69426472T DE 69426472 T2 DE69426472 T2 DE 69426472T2
Authority
DE
Germany
Prior art keywords
adhesives
printed circuit
circuit boards
electroless metallization
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1994626472
Other languages
English (en)
Other versions
DE69426472D1 (de
Inventor
Dong Dong Wang
Motoo Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69426472D1 publication Critical patent/DE69426472D1/de
Publication of DE69426472T2 publication Critical patent/DE69426472T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/005—Processes for mixing polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
DE1994626472 1993-05-19 1994-05-18 Klebstoffe für stromlose Metallisierung und Leiterplatten Expired - Lifetime DE69426472T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11690393 1993-05-19

Publications (2)

Publication Number Publication Date
DE69426472D1 DE69426472D1 (de) 2001-02-01
DE69426472T2 true DE69426472T2 (de) 2001-04-19

Family

ID=14698499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994626472 Expired - Lifetime DE69426472T2 (de) 1993-05-19 1994-05-18 Klebstoffe für stromlose Metallisierung und Leiterplatten

Country Status (3)

Country Link
US (1) US5519177A (de)
EP (1) EP0625537B1 (de)
DE (1) DE69426472T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69427665T2 (de) 1993-02-24 2001-10-31 Ibiden Co Ltd Harzzusammensetzungen und Verfahren für Ihre Herstellung
JP3400049B2 (ja) * 1993-11-26 2003-04-28 住友ベークライト株式会社 プリント配線板用接着剤及びこの接着剤を用いたプリント配線板の製造方法
WO1997017824A1 (fr) * 1995-11-10 1997-05-15 Ibiden Co., Ltd. Carte a circuits imprimes multicouche et sa fabrication
US6010768A (en) 1995-11-10 2000-01-04 Ibiden Co., Ltd. Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
WO1997024229A1 (fr) * 1995-12-26 1997-07-10 Ibiden Co., Ltd. Corps sur lequel est lie un film metallique, couche d'agent de liaison et agent de liaison
EP1802186B1 (de) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Leiterplatte
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
WO1998047329A1 (fr) * 1997-04-15 1998-10-22 Ibiden Co., Ltd. Adhesif utile pour effectuer le depot autocatalytique, composition de produit de depart utile pour preparer de l'adhesif pour depot catalytique et carte imprimee
CN1155303C (zh) 1997-04-15 2004-06-23 揖斐电株式会社 无电解电镀用粘接剂以及印刷布线板
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6197898B1 (en) * 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
ID22582A (id) * 1998-05-18 1999-11-18 Nippon Catalytic Chem Ind Katalis dehidrogenasi oksidasi alkana rendah dan proses untuk memproduksi olefin
MY144503A (en) 1998-09-14 2011-09-30 Ibiden Co Ltd Printed circuit board and method for its production
DE69942279D1 (de) * 1998-09-17 2010-06-02 Ibiden Co Ltd Vielschichtig aufgebaute leiterplatte
KR20000028796A (ko) 1998-10-07 2000-05-25 고사이 아끼오 빌드업 방법용 열경화성 수지 조성물
JP3635219B2 (ja) 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
US6717819B1 (en) * 1999-06-01 2004-04-06 Amerasia International Technology, Inc. Solderable flexible adhesive interposer as for an electronic package, and method for making same
MY121156A (en) 1999-07-02 2005-12-30 Sumitomo Chemical Co Thermosetting resin composition for build-up method
KR100928104B1 (ko) * 2000-02-15 2009-11-24 히다치 가세고교 가부시끼가이샤 접착 필름
JP2001251040A (ja) * 2000-03-06 2001-09-14 Stanley Electric Co Ltd 高周波用回路基板及びその製造方法
KR20010090778A (ko) * 2000-04-10 2001-10-19 마쯔모또 에이찌 복합시이트 및 그의 제조 방법
KR20020033190A (ko) * 2000-07-21 2002-05-04 후지다 히로미찌 다층 프린트 배선판용 절연성 수지 조성물, 이것을 이용한다층 프린트 배선판, 및 그 제조방법
US6809935B1 (en) * 2000-10-10 2004-10-26 Megic Corporation Thermally compliant PCB substrate for the application of chip scale packages
KR100912920B1 (ko) * 2001-09-05 2009-08-20 니폰 제온 가부시키가이샤 다층 회로 기판, 수지 기재 및 그의 제조 방법
US7666579B1 (en) * 2001-09-17 2010-02-23 Serenity Technologies, Inc. Method and apparatus for high density storage of analog data in a durable medium
JP4620303B2 (ja) * 2001-09-20 2011-01-26 株式会社東海理化電機製作所 半導体装置及びその製造方法
JP2003243807A (ja) * 2002-02-14 2003-08-29 Nec Kansai Ltd 配線基板及びその製造方法
JP2004051938A (ja) * 2002-05-30 2004-02-19 Sumitomo Chem Co Ltd エポキシ樹脂組成物およびその用途
EP1524331A1 (de) * 2003-10-17 2005-04-20 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO Verfahren zur Metallisierung eines aus unterschiedlichen nicht-metallischen Teilen bestehenden Elements
KR100557549B1 (ko) * 2003-12-29 2006-03-03 삼성전기주식회사 플립칩 범프 패드 형성 방법 및 그 구조
JP3979391B2 (ja) * 2004-01-26 2007-09-19 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造用材料
ATE553157T1 (de) * 2004-10-07 2012-04-15 Hitachi Chemical Co Ltd Harzzusammensetzung für optisches material, harzfilm für optisches material und lichtwellenleiter damit
MY169438A (en) * 2006-04-28 2019-04-10 Hitachi Chemical Co Ltd Resin composition, prepreg, laminate, and wiring board
US8425785B2 (en) * 2008-03-31 2013-04-23 Intel Corporation Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
US20120018198A1 (en) * 2010-03-30 2012-01-26 Ibiden Co., Ltd. Electronic component and printed wiring board
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進
CN105721749B (zh) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
JP6497487B2 (ja) * 2016-12-02 2019-04-10 株式会社村田製作所 多層配線基板

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4842454B1 (de) * 1970-12-28 1973-12-12
US4120913A (en) * 1976-12-10 1978-10-17 Westinghouse Electric Corp. Epoxy-amine adhesive compositions
JPS59226074A (ja) * 1983-06-07 1984-12-19 Mitsubishi Rayon Co Ltd 耐熱性の良好な感光性組成物
GB2164653B (en) * 1984-09-21 1988-07-13 Nippon Paint Co Ltd Composite film and preparation thereof
US4752499A (en) * 1985-05-16 1988-06-21 Ibiden Co. Ltd. Adhesive for electroless plating and method of preparation of circuit board using this adhesive
US4999238A (en) * 1986-07-09 1991-03-12 Hercules Incorporated Damage tolerant composites containing infusible particles
US4863787A (en) * 1986-07-09 1989-09-05 Hercules Incorporated Damage tolerant composites containing infusible particles
US4783506A (en) * 1986-07-09 1988-11-08 Hercules Incorporated Damage tolerant composites containing infusible particles
US5231150A (en) * 1987-10-05 1993-07-27 Imperial Chemical Industries Plc Polymer composition
ATE142676T1 (de) * 1987-10-05 1996-09-15 Ici Plc Polymermasse
US5002821A (en) * 1987-12-15 1991-03-26 The Dexter Corporation Toughened prepregs and formulations
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
JPH0651868B2 (ja) * 1988-05-30 1994-07-06 イビデン株式会社 無電解めっき時に用いられる接着剤のアンカー形成用耐熱性樹脂粒子とその製造方法
DE3833219A1 (de) * 1988-09-30 1990-04-05 Bayer Ag Verfahren zur herstellung feindisperser polymermischungen
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US4954195A (en) * 1989-02-13 1990-09-04 Lockheed Corporation Production of thermoset composites containing thermoplastic fillers
US5248711A (en) * 1989-02-16 1993-09-28 Hexcel Corporation Toughened resin systems for composite applications
JPH0670110B2 (ja) * 1989-10-13 1994-09-07 関西ペイント株式会社 重合体微粒子の分散液
US5106918A (en) * 1989-11-29 1992-04-21 The B. F. Goodrich Company Method for dispersing miscible polymeric components
EP0441047B1 (de) * 1990-01-19 1996-06-05 Minnesota Mining And Manufacturing Company Wärmehärtbare Zusammensetzung

Also Published As

Publication number Publication date
DE69426472D1 (de) 2001-02-01
US5519177A (en) 1996-05-21
EP0625537A1 (de) 1994-11-23
EP0625537B1 (de) 2000-12-27

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