DE69426237T2 - Herstellungsverfahren einer musterordnung gleichförmiger metallkugeln - Google Patents
Herstellungsverfahren einer musterordnung gleichförmiger metallkugelnInfo
- Publication number
- DE69426237T2 DE69426237T2 DE69426237T DE69426237T DE69426237T2 DE 69426237 T2 DE69426237 T2 DE 69426237T2 DE 69426237 T DE69426237 T DE 69426237T DE 69426237 T DE69426237 T DE 69426237T DE 69426237 T2 DE69426237 T2 DE 69426237T2
- Authority
- DE
- Germany
- Prior art keywords
- producing
- same
- shaped metal
- metal balls
- pattern order
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- H—ELECTRICITY
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/129,668 US5366140A (en) | 1993-09-30 | 1993-09-30 | Patterned array of uniform metal microbeads |
PCT/US1994/009507 WO1995009436A1 (en) | 1993-09-30 | 1994-08-24 | Patterned array of uniform metal microbeads |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69426237D1 DE69426237D1 (de) | 2000-12-07 |
DE69426237T2 true DE69426237T2 (de) | 2001-06-13 |
Family
ID=22441046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69426237T Expired - Fee Related DE69426237T2 (de) | 1993-09-30 | 1994-08-24 | Herstellungsverfahren einer musterordnung gleichförmiger metallkugeln |
Country Status (8)
Country | Link |
---|---|
US (2) | US5366140A (de) |
EP (1) | EP0721659B1 (de) |
JP (1) | JPH09503100A (de) |
KR (1) | KR960705352A (de) |
CN (1) | CN1132570A (de) |
CA (1) | CA2171190A1 (de) |
DE (1) | DE69426237T2 (de) |
WO (1) | WO1995009436A1 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5769996A (en) * | 1994-01-27 | 1998-06-23 | Loctite (Ireland) Limited | Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US6099935A (en) * | 1995-12-15 | 2000-08-08 | International Business Machines Corporation | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
JPH09320345A (ja) * | 1996-05-31 | 1997-12-12 | Whitaker Corp:The | 異方導電性フィルム |
EP0862791B1 (de) * | 1996-07-26 | 2002-09-18 | Koninklijke Philips Electronics N.V. | Verfahren zur herstellung und zum transferieren metallischer tropfen |
US6977025B2 (en) * | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
US6180226B1 (en) | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
JP2002515044A (ja) | 1996-08-21 | 2002-05-21 | スミスクライン・ビーチャム・コーポレイション | ビーズ−ベースのコンビナトリアルライブラリーを配列し合成する迅速方法 |
US6000603A (en) * | 1997-05-23 | 1999-12-14 | 3M Innovative Properties Company | Patterned array of metal balls and methods of making |
JP3335896B2 (ja) * | 1997-12-26 | 2002-10-21 | 株式会社東芝 | ハンダ材及びハンダ材の製造方法 |
DE19809540A1 (de) | 1998-03-05 | 1999-09-09 | Basf Ag | Wasserabsorbierende, schaumförmige, vernetzte Polymerisate, Verfahren zu ihrer Herstellung und ihre Verwendung |
US6569494B1 (en) * | 2000-05-09 | 2003-05-27 | 3M Innovative Properties Company | Method and apparatus for making particle-embedded webs |
US20020119255A1 (en) * | 2000-05-09 | 2002-08-29 | Ranjith Divigalpitiya | Method and apparatus for making particle-embedded webs |
DE10392199T5 (de) * | 2002-01-18 | 2005-01-05 | Avery Dennison Corp., Pasadena | Folie mit Mikroarchitektur |
WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
US7344903B2 (en) * | 2003-09-17 | 2008-03-18 | Luminus Devices, Inc. | Light emitting device processes |
US7274458B2 (en) | 2005-03-07 | 2007-09-25 | 3M Innovative Properties Company | Thermoplastic film having metallic nanoparticle coating |
US7666494B2 (en) * | 2005-05-04 | 2010-02-23 | 3M Innovative Properties Company | Microporous article having metallic nanoparticle coating |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US8802214B2 (en) * | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US7923488B2 (en) * | 2006-10-16 | 2011-04-12 | Trillion Science, Inc. | Epoxy compositions |
US8110425B2 (en) | 2007-03-20 | 2012-02-07 | Luminus Devices, Inc. | Laser liftoff structure and related methods |
WO2009134448A1 (en) * | 2008-05-01 | 2009-11-05 | Maxim Seleznev | Continuous or discrete metallization layer on a ceramic substrate |
TWI383055B (zh) * | 2009-02-17 | 2013-01-21 | Univ Nat Chunghsing | The Method of Making Metal Material Pattern |
US8061578B2 (en) * | 2010-02-03 | 2011-11-22 | Indium Corporation | Solder preform |
US8878055B2 (en) | 2010-08-09 | 2014-11-04 | International Business Machines Corporation | Efficient nanoscale solar cell and fabrication method |
US9231133B2 (en) | 2010-09-10 | 2016-01-05 | International Business Machines Corporation | Nanowires formed by employing solder nanodots |
WO2012051002A2 (en) | 2010-10-15 | 2012-04-19 | 3M Innovative Properties Company | Abrasive articles |
US8628996B2 (en) | 2011-06-15 | 2014-01-14 | International Business Machines Corporation | Uniformly distributed self-assembled cone-shaped pillars for high efficiency solar cells |
US8685858B2 (en) * | 2011-08-30 | 2014-04-01 | International Business Machines Corporation | Formation of metal nanospheres and microspheres |
US9102851B2 (en) | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
JP5665234B2 (ja) * | 2011-11-04 | 2015-02-04 | 三恵技研工業株式会社 | 電磁波透過用金属被膜及び車載用レーダ装置用のレドーム |
US8889456B2 (en) | 2012-08-29 | 2014-11-18 | International Business Machines Corporation | Method of fabricating uniformly distributed self-assembled solder dot formation for high efficiency solar cells |
JP6645730B2 (ja) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
CN104528629B (zh) * | 2014-12-17 | 2016-07-06 | 天津大学 | 一种均一性优异的Janus微球阵列及其制备方法 |
KR20180054558A (ko) | 2015-06-25 | 2018-05-24 | 로스웰 바이오테크놀로지스 인코포레이티드 | 생체분자 센서들 및 방법들 |
CN105489511B (zh) * | 2015-11-30 | 2019-01-25 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
CN108541239B (zh) * | 2015-12-18 | 2023-06-16 | 3M创新有限公司 | 特征在于微观周期性图案的装饰性制品及其制备方法 |
US10712334B2 (en) | 2016-01-28 | 2020-07-14 | Roswell Biotechnologies, Inc. | Massively parallel DNA sequencing apparatus |
EP3408220A4 (de) | 2016-01-28 | 2019-09-04 | Roswell Biotechnologies, Inc | Verfahren und vorrichtung zum messen von analyten unter verwendung von grossskaligen molekularelektronischen sensorarrays |
JP6854532B2 (ja) | 2016-02-09 | 2021-04-07 | ロズウェル バイオテクノロジーズ,インコーポレイテッド | 電子的、標識フリーのdnaおよびゲノムシークエンシング |
US10597767B2 (en) * | 2016-02-22 | 2020-03-24 | Roswell Biotechnologies, Inc. | Nanoparticle fabrication |
WO2017191772A1 (ja) * | 2016-05-05 | 2017-11-09 | デクセリアルズ株式会社 | フィラー配置フィルム |
US9829456B1 (en) | 2016-07-26 | 2017-11-28 | Roswell Biotechnologies, Inc. | Method of making a multi-electrode structure usable in molecular sensing devices |
CN106298450B (zh) * | 2016-08-10 | 2019-04-30 | 华东师范大学 | 一种纳米级图形化蓝宝石衬底及其制备方法和应用 |
DE102016121462A1 (de) * | 2016-11-09 | 2018-05-09 | Aixtron Se | Strukturierte Keimschicht |
US20210072255A1 (en) | 2016-12-16 | 2021-03-11 | The Brigham And Women's Hospital, Inc. | System and method for protein corona sensor array for early detection of diseases |
KR102622275B1 (ko) | 2017-01-10 | 2024-01-05 | 로스웰 바이오테크놀로지스 인코포레이티드 | Dna 데이터 저장을 위한 방법들 및 시스템들 |
KR20230158636A (ko) | 2017-01-19 | 2023-11-20 | 로스웰 바이오테크놀로지스 인코포레이티드 | 2차원 레이어 재료를 포함하는 솔리드 스테이트 시퀀싱 디바이스들 |
KR20200002897A (ko) | 2017-04-25 | 2020-01-08 | 로스웰 바이오테크놀로지스 인코포레이티드 | 분자 센서들을 위한 효소 회로들 |
US10508296B2 (en) | 2017-04-25 | 2019-12-17 | Roswell Biotechnologies, Inc. | Enzymatic circuits for molecular sensors |
EP4023764A3 (de) | 2017-05-09 | 2022-09-21 | Roswell Biotechnologies, Inc. | Bindungssondenschaltungen für molekulare sensoren |
CN111373049A (zh) | 2017-08-30 | 2020-07-03 | 罗斯威尔生命技术公司 | 用于dna数据存储的进行性酶分子电子传感器 |
KR20200067871A (ko) | 2017-10-10 | 2020-06-12 | 로스웰 바이오테크놀로지스 인코포레이티드 | 무증폭 dna 데이터 저장을 위한 방법, 장치 및 시스템 |
CN110060973B (zh) * | 2019-04-24 | 2021-07-30 | 深圳第三代半导体研究院 | 一种纳米金属膜模块制备方法及其基板制备方法 |
WO2021026172A1 (en) | 2019-08-05 | 2021-02-11 | Seer, Inc. | Systems and methods for sample preparation, data generation, and protein corona analysis |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2822509A (en) * | 1953-05-06 | 1958-02-04 | David R M Harvey | Adhesive plaster |
US4267261A (en) * | 1971-07-15 | 1981-05-12 | Energy Conversion Devices, Inc. | Method for full format imaging |
US4000334A (en) * | 1971-07-15 | 1976-12-28 | Energy Conversion Devices, Inc. | Thermal imaging involving imagewise melting to form spaced apart globules |
JPS5535238B2 (de) * | 1975-01-24 | 1980-09-12 | ||
US4415512A (en) * | 1979-07-20 | 1983-11-15 | Torobin Leonard B | Method and apparatus for producing hollow metal microspheres and microspheroids |
US4242439A (en) * | 1979-09-27 | 1980-12-30 | Energy Conversion Devices, Inc. | Dispersion imaging utilizing plural layers of different metal components |
US4273859A (en) * | 1979-12-31 | 1981-06-16 | Honeywell Information Systems Inc. | Method of forming solder bump terminals on semiconductor elements |
US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
JPS63249393A (ja) * | 1987-04-03 | 1988-10-17 | シャープ株式会社 | 電子部品の接続方法 |
AU612771B2 (en) * | 1988-02-26 | 1991-07-18 | Minnesota Mining And Manufacturing Company | Electrically conductive pressure-sensitive adhesive tape |
US5240761A (en) * | 1988-08-29 | 1993-08-31 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US5185178A (en) * | 1988-08-29 | 1993-02-09 | Minnesota Mining And Manufacturing Company | Method of forming an array of densely packed discrete metal microspheres |
US5026599A (en) * | 1988-08-29 | 1991-06-25 | Minnesota Mining & Manufacturing | Array of densely packed discrete metal microspheres coated on a substrate |
US5293072A (en) * | 1990-06-25 | 1994-03-08 | Fujitsu Limited | Semiconductor device having spherical terminals attached to the lead frame embedded within the package body |
EP0469216B1 (de) * | 1990-07-31 | 1994-12-07 | International Business Machines Corporation | Verfahren zur Bildung metallischer Kontaktflächen und Anschlüsse auf Halbleiterchips |
US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
JPH04262895A (ja) * | 1991-02-15 | 1992-09-18 | Tanaka Kikinzoku Kogyo Kk | 金属極微小球の製造方法 |
US5162257A (en) * | 1991-09-13 | 1992-11-10 | Mcnc | Solder bump fabrication method |
US5345056A (en) * | 1991-12-12 | 1994-09-06 | Motorola, Inc. | Plasma based soldering by indirect heating |
-
1993
- 1993-09-30 US US08/129,668 patent/US5366140A/en not_active Expired - Fee Related
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1994
- 1994-08-19 US US08/292,890 patent/US5486427A/en not_active Expired - Fee Related
- 1994-08-24 JP JP7510302A patent/JPH09503100A/ja active Pending
- 1994-08-24 EP EP94926565A patent/EP0721659B1/de not_active Expired - Lifetime
- 1994-08-24 KR KR1019960701602A patent/KR960705352A/ko not_active Application Discontinuation
- 1994-08-24 CN CN94193577A patent/CN1132570A/zh active Pending
- 1994-08-24 WO PCT/US1994/009507 patent/WO1995009436A1/en active IP Right Grant
- 1994-08-24 CA CA002171190A patent/CA2171190A1/en not_active Abandoned
- 1994-08-24 DE DE69426237T patent/DE69426237T2/de not_active Expired - Fee Related
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EP0721659A1 (de) | 1996-07-17 |
US5366140A (en) | 1994-11-22 |
US5486427A (en) | 1996-01-23 |
EP0721659B1 (de) | 2000-11-02 |
JPH09503100A (ja) | 1997-03-25 |
CN1132570A (zh) | 1996-10-02 |
WO1995009436A1 (en) | 1995-04-06 |
KR960705352A (ko) | 1996-10-09 |
DE69426237D1 (de) | 2000-12-07 |
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