DE69426237D1 - Herstellungsverfahren einer musterordnung gleichförmiger metallkugeln - Google Patents
Herstellungsverfahren einer musterordnung gleichförmiger metallkugelnInfo
- Publication number
- DE69426237D1 DE69426237D1 DE69426237T DE69426237T DE69426237D1 DE 69426237 D1 DE69426237 D1 DE 69426237D1 DE 69426237 T DE69426237 T DE 69426237T DE 69426237 T DE69426237 T DE 69426237T DE 69426237 D1 DE69426237 D1 DE 69426237D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- same
- shaped metal
- metal balls
- pattern order
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/129,668 US5366140A (en) | 1993-09-30 | 1993-09-30 | Patterned array of uniform metal microbeads |
PCT/US1994/009507 WO1995009436A1 (en) | 1993-09-30 | 1994-08-24 | Patterned array of uniform metal microbeads |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69426237D1 true DE69426237D1 (de) | 2000-12-07 |
DE69426237T2 DE69426237T2 (de) | 2001-06-13 |
Family
ID=22441046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69426237T Expired - Fee Related DE69426237T2 (de) | 1993-09-30 | 1994-08-24 | Herstellungsverfahren einer musterordnung gleichförmiger metallkugeln |
Country Status (8)
Country | Link |
---|---|
US (2) | US5366140A (de) |
EP (1) | EP0721659B1 (de) |
JP (1) | JPH09503100A (de) |
KR (1) | KR960705352A (de) |
CN (1) | CN1132570A (de) |
CA (1) | CA2171190A1 (de) |
DE (1) | DE69426237T2 (de) |
WO (1) | WO1995009436A1 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100389743B1 (ko) * | 1994-01-27 | 2003-10-04 | 록타이트(아일랜드) 리미티드 | 두세트의전도체사이에이방성전도성경로및결합을제공하기위한조성물및방법 |
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US6099935A (en) * | 1995-12-15 | 2000-08-08 | International Business Machines Corporation | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
JPH09320345A (ja) * | 1996-05-31 | 1997-12-12 | Whitaker Corp:The | 異方導電性フィルム |
WO1998005068A1 (en) * | 1996-07-26 | 1998-02-05 | Philips Electronics N.V. | Method of manufacturing and transferring metallic droplets |
US6977025B2 (en) * | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
WO1998006007A1 (en) | 1996-08-01 | 1998-02-12 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
EP1007966A4 (de) * | 1996-08-21 | 2001-10-17 | Smithkline Beecham Corp | Schnellverfahren zum gruppieren und synthesieren von wulstbasierenden kombinatorischen bibliotheken |
US6000603A (en) * | 1997-05-23 | 1999-12-14 | 3M Innovative Properties Company | Patterned array of metal balls and methods of making |
JP3335896B2 (ja) * | 1997-12-26 | 2002-10-21 | 株式会社東芝 | ハンダ材及びハンダ材の製造方法 |
DE19809540A1 (de) | 1998-03-05 | 1999-09-09 | Basf Ag | Wasserabsorbierende, schaumförmige, vernetzte Polymerisate, Verfahren zu ihrer Herstellung und ihre Verwendung |
US20020119255A1 (en) * | 2000-05-09 | 2002-08-29 | Ranjith Divigalpitiya | Method and apparatus for making particle-embedded webs |
US6569494B1 (en) * | 2000-05-09 | 2003-05-27 | 3M Innovative Properties Company | Method and apparatus for making particle-embedded webs |
WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
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-
1993
- 1993-09-30 US US08/129,668 patent/US5366140A/en not_active Expired - Fee Related
-
1994
- 1994-08-19 US US08/292,890 patent/US5486427A/en not_active Expired - Fee Related
- 1994-08-24 WO PCT/US1994/009507 patent/WO1995009436A1/en active IP Right Grant
- 1994-08-24 CA CA002171190A patent/CA2171190A1/en not_active Abandoned
- 1994-08-24 KR KR1019960701602A patent/KR960705352A/ko not_active Application Discontinuation
- 1994-08-24 CN CN94193577A patent/CN1132570A/zh active Pending
- 1994-08-24 JP JP7510302A patent/JPH09503100A/ja active Pending
- 1994-08-24 DE DE69426237T patent/DE69426237T2/de not_active Expired - Fee Related
- 1994-08-24 EP EP94926565A patent/EP0721659B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0721659B1 (de) | 2000-11-02 |
EP0721659A1 (de) | 1996-07-17 |
WO1995009436A1 (en) | 1995-04-06 |
CN1132570A (zh) | 1996-10-02 |
US5366140A (en) | 1994-11-22 |
DE69426237T2 (de) | 2001-06-13 |
JPH09503100A (ja) | 1997-03-25 |
KR960705352A (ko) | 1996-10-09 |
US5486427A (en) | 1996-01-23 |
CA2171190A1 (en) | 1995-04-06 |
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