DE69421699D1 - Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten - Google Patents
Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichtenInfo
- Publication number
- DE69421699D1 DE69421699D1 DE69421699T DE69421699T DE69421699D1 DE 69421699 D1 DE69421699 D1 DE 69421699D1 DE 69421699 T DE69421699 T DE 69421699T DE 69421699 T DE69421699 T DE 69421699T DE 69421699 D1 DE69421699 D1 DE 69421699D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive substrates
- preparing non
- electrochemical coating
- carbon compositions
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/062,943 US5389270A (en) | 1993-05-17 | 1993-05-17 | Composition and process for preparing a non-conductive substrate for electroplating |
US08/232,574 US5476580A (en) | 1993-05-17 | 1994-05-03 | Processes for preparing a non-conductive substrate for electroplating |
PCT/US1994/005267 WO1994026958A1 (en) | 1993-05-17 | 1994-05-12 | Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69421699D1 true DE69421699D1 (de) | 1999-12-23 |
DE69421699T2 DE69421699T2 (de) | 2000-07-06 |
Family
ID=26742894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69421699T Expired - Lifetime DE69421699T2 (de) | 1993-05-17 | 1994-05-12 | Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten |
Country Status (11)
Country | Link |
---|---|
US (1) | US5476580A (de) |
EP (1) | EP0698132B1 (de) |
JP (1) | JP3335176B2 (de) |
AU (1) | AU6831794A (de) |
CA (1) | CA2162905A1 (de) |
DE (1) | DE69421699T2 (de) |
FI (1) | FI955542A (de) |
HK (1) | HK1005414A1 (de) |
NO (1) | NO954637L (de) |
PL (1) | PL311705A1 (de) |
WO (1) | WO1994026958A1 (de) |
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US6623787B2 (en) * | 2001-07-26 | 2003-09-23 | Electrochemicals Inc. | Method to improve the stability of dispersions of carbon |
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US8974869B2 (en) * | 2010-01-26 | 2015-03-10 | Robert Hamilton | Method for improving plating on non-conductive substrates |
CN104080956A (zh) | 2011-12-02 | 2014-10-01 | 阿尔塔纳股份公司 | 在非导电衬底上制造的导电结构及其制造方法 |
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US10986738B2 (en) * | 2018-05-08 | 2021-04-20 | Macdermid Enthone Inc. | Carbon-based direct plating process |
CN111382487A (zh) * | 2018-12-28 | 2020-07-07 | 健鼎(湖北)电子有限公司 | 一种提高电路板镀层厚度精确度的方法 |
CN111647901B (zh) * | 2020-05-15 | 2023-08-25 | 湖北省哈福生物化学有限公司 | 一种黑孔液及其制备方法和使用方法 |
CN112105173B (zh) * | 2020-09-21 | 2022-01-18 | 广东硕成科技有限公司 | 一种用于软板孔金属化的碳纳米组合物及其制备方法 |
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US5032235A (en) * | 1988-07-27 | 1991-07-16 | The Boeing Company | Method and apparatus for plating through holes in graphite composites |
CA1329802C (en) * | 1988-08-30 | 1994-05-24 | Nippon Kokan Kabushiki Kaisha | Lubricant for the production of seamless steel pipes |
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-
1994
- 1994-05-03 US US08/232,574 patent/US5476580A/en not_active Expired - Lifetime
- 1994-05-12 PL PL94311705A patent/PL311705A1/xx unknown
- 1994-05-12 CA CA002162905A patent/CA2162905A1/en not_active Abandoned
- 1994-05-12 AU AU68317/94A patent/AU6831794A/en not_active Abandoned
- 1994-05-12 WO PCT/US1994/005267 patent/WO1994026958A1/en active IP Right Grant
- 1994-05-12 JP JP52568894A patent/JP3335176B2/ja not_active Expired - Lifetime
- 1994-05-12 EP EP94916744A patent/EP0698132B1/de not_active Expired - Lifetime
- 1994-05-12 DE DE69421699T patent/DE69421699T2/de not_active Expired - Lifetime
-
1995
- 1995-11-16 FI FI955542A patent/FI955542A/fi not_active Application Discontinuation
- 1995-11-16 NO NO954637A patent/NO954637L/no unknown
-
1998
- 1998-06-05 HK HK98102570A patent/HK1005414A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0698132A4 (de) | 1996-01-15 |
EP0698132A1 (de) | 1996-02-28 |
CA2162905A1 (en) | 1994-11-24 |
HK1005414A1 (en) | 1999-01-08 |
PL311705A1 (en) | 1996-03-04 |
DE69421699T2 (de) | 2000-07-06 |
NO954637L (no) | 1996-01-16 |
EP0698132B1 (de) | 1999-11-17 |
WO1994026958A1 (en) | 1994-11-24 |
US5476580A (en) | 1995-12-19 |
JP3335176B2 (ja) | 2002-10-15 |
FI955542A0 (fi) | 1995-11-16 |
JPH09500419A (ja) | 1997-01-14 |
NO954637D0 (no) | 1995-11-16 |
FI955542A (fi) | 1996-01-16 |
AU6831794A (en) | 1994-12-12 |
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Legal Events
Date | Code | Title | Description |
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8327 | Change in the person/name/address of the patent owner |
Owner name: OMG ELECTRONIC CHEMICALS, INC., SOUTH PLAINFIE, US |
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8327 | Change in the person/name/address of the patent owner |
Owner name: OMG ELECTRONIC CHEMICALS, LLC (N. D. GES.D. ST, US |