DE69421248D1 - Polierteil und Wafer-Poliervorrichtung - Google Patents

Polierteil und Wafer-Poliervorrichtung

Info

Publication number: DE69421248D1
Authority: DE; Germany
Prior art keywords: polishing; wafer; polishing device; wafer polishing; polishing part
Prior art date: 1993-12-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69421248T

Other languages

English (en)

Other versions

DE69421248T2 (de

Inventor

Kouichi Tanaka

Hiromasa Hashimoto

Fumio Suzuki

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shin Etsu Handotai Co Ltd

Original Assignee

Shin Etsu Handotai Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-12-14

Filing date

1994-12-13

Publication date

1999-11-25

1993-12-14 Priority claimed from JP34294093A external-priority patent/JP2900777B2/ja

1993-12-14 Priority claimed from JP34294193A external-priority patent/JP2891083B2/ja

1994-12-13 Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd

1999-11-25 Application granted granted Critical

1999-11-25 Publication of DE69421248D1 publication Critical patent/DE69421248D1/de

2000-05-11 Publication of DE69421248T2 publication Critical patent/DE69421248T2/de

2014-12-14 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

DE69421248T 1993-12-14 1994-12-13 Polierteil und Wafer-Poliervorrichtung Expired - Lifetime DE69421248T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP34294093A JP2900777B2 (ja)	1993-12-14	1993-12-14	研磨部材およびウエーハ研磨装置
JP34294193A JP2891083B2 (ja)	1993-12-14	1993-12-14	シート状研磨部材およびウエーハ研磨装置

Publications (2)

Publication Number	Publication Date
DE69421248D1 true DE69421248D1 (de)	1999-11-25
DE69421248T2 DE69421248T2 (de)	2000-05-11

Family

ID=26577386

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69421248T Expired - Lifetime DE69421248T2 (de)	1993-12-14	1994-12-13	Polierteil und Wafer-Poliervorrichtung

Country Status (3)

Country	Link
US (1)	US5564965A (de)
EP (1)	EP0658401B1 (de)
DE (1)	DE69421248T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3960635B2 (ja) *	1995-01-25	2007-08-15	株式会社荏原製作所	ポリッシング装置
USRE39262E1 (en) *	1995-01-25	2006-09-05	Ebara Corporation	Polishing apparatus including turntable with polishing surface of different heights
US6074287A (en) *	1996-04-12	2000-06-13	Nikon Corporation	Semiconductor wafer polishing apparatus
FR2750354B1 (fr) *	1996-06-28	1998-08-07	Lam Plan Sa	Support de disque de polissage et procede de polissage
US5692950A (en) *	1996-08-08	1997-12-02	Minnesota Mining And Manufacturing Company	Abrasive construction for semiconductor wafer modification
US5702292A (en) *	1996-10-31	1997-12-30	Micron Technology, Inc.	Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine
JP2738392B1 (ja) *	1996-11-05	1998-04-08	日本電気株式会社	半導体装置の研磨装置及び研磨方法
JPH10156705A (ja) *	1996-11-29	1998-06-16	Sumitomo Metal Ind Ltd	研磨装置および研磨方法
JP3865444B2 (ja) *	1997-01-06	2007-01-10	スリーエムカンパニー	手工具
US6056632A (en) *	1997-02-13	2000-05-02	Speedfam-Ipec Corp.	Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5851140A (en) *	1997-02-13	1998-12-22	Integrated Process Equipment Corp.	Semiconductor wafer polishing apparatus with a flexible carrier plate
US7018282B1 (en) *	1997-03-27	2006-03-28	Koninklijke Philips Electronics N.V.	Customized polishing pad for selective process performance during chemical mechanical polishing
US6110025A (en) *	1997-05-07	2000-08-29	Obsidian, Inc.	Containment ring for substrate carrier apparatus
JP2842865B1 (ja) *	1997-08-22	1999-01-06	九州日本電気株式会社	研磨装置
JPH11156699A (ja) *	1997-11-25	1999-06-15	Speedfam Co Ltd	平面研磨用パッド
US6106662A (en) *	1998-06-08	2000-08-22	Speedfam-Ipec Corporation	Method and apparatus for endpoint detection for chemical mechanical polishing
DE69932945T2 (de) *	1998-11-09	2007-03-15	Toray Industries, Inc.	Polierkissen und poliervorrichtung
US6491570B1 (en)	1999-02-25	2002-12-10	Applied Materials, Inc.	Polishing media stabilizer
JP3697963B2 (ja) *	1999-08-30	2005-09-21	富士電機デバイステクノロジー株式会社	研磨布および平面研磨加工方法
US6267659B1 (en) *	2000-05-04	2001-07-31	International Business Machines Corporation	Stacked polish pad
US6666751B1 (en) *	2000-07-17	2003-12-23	Micron Technology, Inc.	Deformable pad for chemical mechanical polishing
US6561884B1 (en)	2000-08-29	2003-05-13	Applied Materials, Inc.	Web lift system for chemical mechanical planarization
US6592439B1 (en)	2000-11-10	2003-07-15	Applied Materials, Inc.	Platen for retaining polishing material
US6632129B2 (en) *	2001-02-15	2003-10-14	3M Innovative Properties Company	Fixed abrasive article for use in modifying a semiconductor wafer
WO2003009362A1 (fr) *	2001-07-19	2003-01-30	Nikon Corporation	Element de polissage, dispositif de polissage mecano-chimique (cmp) et procede de production de dispositif a semi-conducteur
US6503131B1 (en)	2001-08-16	2003-01-07	Applied Materials, Inc.	Integrated platen assembly for a chemical mechanical planarization system
KR100877383B1 (ko) *	2001-11-13	2009-01-07	도요 고무 고교 가부시키가이샤	연마 패드 및 그 제조 방법
JP2004023009A (ja) *	2002-06-20	2004-01-22	Nikon Corp	研磨体、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP3754436B2 (ja) *	2004-02-23	2006-03-15	東洋ゴム工業株式会社	研磨パッドおよびそれを使用する半導体デバイスの製造方法
US7226345B1 (en)	2005-12-09	2007-06-05	The Regents Of The University Of California	CMP pad with designed surface features
FR2962453B1 (fr) *	2010-05-20	2012-09-21	Michelin Soc Tech	Cable metallique a trois couches, gomme in situ par un elastomere thermoplastique insature
FR2962455B1 (fr) *	2010-05-20	2012-09-21	Soc Tech Michelin	Cable metallique multicouches gomme in situ par un elastomere thermoplastique insature
CN104968472A (zh) *	2013-01-31	2015-10-07	株式会社荏原制作所	研磨装置、研磨垫的贴附方法及研磨垫的更换方法
JP5538601B1 (ja) *	2013-08-22	2014-07-02	ミクロ技研株式会社	研磨ヘッド及び研磨処理装置
US20150056895A1 (en) *	2013-08-22	2015-02-26	Cabot Microelectronics Corporation	Ultra high void volume polishing pad with closed pore structure
CN103551992B (zh) *	2013-11-08	2016-11-23	谢泽	一种含纤维绳和发泡剂的抛光轮
USD834075S1 (en)	2016-08-05	2018-11-20	Ebara Corporation	Pressing member for substrate polishing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5922329A (ja) *	1982-07-29	1984-02-04	Nec Corp	半導体ウエハの研摩用ポリシヤ
JPS62156365A (ja) *	1985-12-27	1987-07-11	Kanebo Ltd	スエード様シート材からなる研磨布の製造方法
JPH02208931A (ja) *	1989-02-08	1990-08-20	Hitachi Cable Ltd	化合物半導体基板の研磨方法
US5257478A (en) *	1990-03-22	1993-11-02	Rodel, Inc.	Apparatus for interlayer planarization of semiconductor material
DD301305A7 (de) *	1990-06-14	1992-11-26	Kuehlanlagenbau Horst Decker	Toilettenanlage zur Lagerung und umweltfreundlichen Entsorgung vonFäkalien
DE69122441T2 (de) *	1990-06-29	1997-04-24	Nat Semiconductor Corp	Polierscheibe mit eingestellter Schmiegsamkeit
US5212910A (en) *	1991-07-09	1993-05-25	Intel Corporation	Composite polishing pad for semiconductor process

1994
- 1994-12-09 US US08/355,212 patent/US5564965A/en not_active Expired - Lifetime
- 1994-12-13 EP EP94309298A patent/EP0658401B1/de not_active Expired - Lifetime
- 1994-12-13 DE DE69421248T patent/DE69421248T2/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US5564965A (en)	1996-10-15
DE69421248T2 (de)	2000-05-11
EP0658401B1 (de)	1999-10-20
EP0658401A1 (de)	1995-06-21

Legal Events

Date	Code	Title	Description
2000-11-09	8364	No opposition during term of opposition

Publication	Publication Date	Title
DE69421248T2 (de)	2000-05-11	Polierteil und Wafer-Poliervorrichtung
DE69419012D1 (de)	1999-07-15	Halbleiterscheibe polierverfahren und -vorrichtung
DE69404414D1 (de)	1997-09-04	Reinigungsverfahren und Reinigungsgerät
DE69419469T2 (de)	2000-03-16	Halbleiterbauelement und Halbleiterspeichervorrichtung
DE69430511D1 (de)	2002-06-06	Halbleiteranordnung und Herstellungverfahren
KR0136684B1 (en)	1998-04-29	Semiconductor device and manufacture thereof
DE69435205D1 (de)	2009-05-28	Dünne Halbleitervorrichtung und Herstellungsverfahren
DE69413602T2 (de)	1999-04-22	Halbleiteranordnung und Herstellungsverfahren
DE69414208T2 (de)	1999-03-25	Optischer Halbleitervorrichtung und Herstellungsverfahren
DE69424728D1 (de)	2000-07-06	Halbleiteranordnung und zugehörige Herstellungsmethode
FI940870A0 (fi)	1994-02-24	Puhdistusmenetelmä ja -laite
DE69521107T2 (de)	2001-10-31	Ausrichtverfahren und Halbleiterbelichtungsverfahren
DE69400694D1 (de)	1996-11-14	Halbleitervorrichtung
DE69325343T2 (de)	2000-02-03	Halbleiteranordnung und Herstellungsverfahren dafür
KR940024375U (ko)	1994-11-16	연마장치
DE69534483D1 (de)	2006-02-09	Leiterrahmen und Halbleiterbauelement
DE69422700D1 (de)	2000-02-24	Waferhalteplatte und hebevorrichtung
DE69424477D1 (de)	2000-06-21	Keramik-Halbleiterbauelement
DE69515779T2 (de)	2000-07-06	Schleifvorrichtung
DE69412819T2 (de)	1999-03-18	Schleif- und poliervorrichtung
DE4496282T1 (de)	1995-09-21	Halbleiter-Einrichtung
NO973577L (no)	1997-10-01	Slipekopp og holdeanordning
NO954863D0 (no)	1995-11-30	Halvlederanordning
EP0715343A4 (de)	1997-06-04	Halbleiteranordnung und herstellungsverfahren
DE69333124D1 (de)	2003-09-04	Halbleiteranordnung und Schaltung