DE69417346D1 - Bildaufnehmer und Herstellungsverfahren - Google Patents

Bildaufnehmer und Herstellungsverfahren

Info

Publication number
DE69417346D1
DE69417346D1 DE69417346T DE69417346T DE69417346D1 DE 69417346 D1 DE69417346 D1 DE 69417346D1 DE 69417346 T DE69417346 T DE 69417346T DE 69417346 T DE69417346 T DE 69417346T DE 69417346 D1 DE69417346 D1 DE 69417346D1
Authority
DE
Germany
Prior art keywords
imager
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69417346T
Other languages
English (en)
Other versions
DE69417346T2 (de
Inventor
Ching-Yeu Nmn Wei
Robert Forrest Kwasnick
Brian William Giambattista
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE69417346D1 publication Critical patent/DE69417346D1/de
Application granted granted Critical
Publication of DE69417346T2 publication Critical patent/DE69417346T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
DE69417346T 1993-11-10 1994-10-19 Bildaufnehmer und Herstellungsverfahren Expired - Fee Related DE69417346T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/149,888 US5399884A (en) 1993-11-10 1993-11-10 Radiation imager with single passivation dielectric for transistor and diode

Publications (2)

Publication Number Publication Date
DE69417346D1 true DE69417346D1 (de) 1999-04-29
DE69417346T2 DE69417346T2 (de) 1999-10-14

Family

ID=22532222

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417346T Expired - Fee Related DE69417346T2 (de) 1993-11-10 1994-10-19 Bildaufnehmer und Herstellungsverfahren

Country Status (4)

Country Link
US (2) US5399884A (de)
EP (1) EP0652596B1 (de)
JP (1) JP3863923B2 (de)
DE (1) DE69417346T2 (de)

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US5435608A (en) * 1994-06-17 1995-07-25 General Electric Company Radiation imager with common passivation dielectric for gate electrode and photosensor
US5619033A (en) * 1995-06-07 1997-04-08 Xerox Corporation Layered solid state photodiode sensor array
US5693567A (en) * 1995-06-07 1997-12-02 Xerox Corporation Separately etching insulating layer for contacts within array and for peripheral pads
US5648674A (en) * 1995-06-07 1997-07-15 Xerox Corporation Array circuitry with conductive lines, contact leads, and storage capacitor electrode all formed in layer that includes highly conductive metal
GB9520791D0 (en) * 1995-10-13 1995-12-13 Philips Electronics Nv Image sensor
US5663577A (en) * 1996-03-01 1997-09-02 General Electric Company Solid state imager array with address line spacer structure
US6288764B1 (en) * 1996-06-25 2001-09-11 Semiconductor Energy Laboratory Co., Ltd. Display device or electronic device having liquid crystal display panel
US5959312A (en) * 1996-09-27 1999-09-28 Xerox Corporation Sensor with doped microcrystalline silicon channel leads with bubble formation protection means
US5814530A (en) * 1996-09-27 1998-09-29 Xerox Corporation Producing a sensor with doped microcrystalline silicon channel leads
US6337520B1 (en) 1997-02-26 2002-01-08 Samsung Electronics Co., Ltd. Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and manufacturing method thereof
US6445004B1 (en) * 1998-02-26 2002-09-03 Samsung Electronics Co., Ltd. Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof
US6037609A (en) 1997-01-17 2000-03-14 General Electric Company Corrosion resistant imager
JP3003998B2 (ja) * 1998-03-18 2000-01-31 インターナショナル・ビジネス・マシーンズ・コーポレイション ドライエッチング方法およびその方法を用いたｔｆｔの製造方法
JP2000131444A (ja) * 1998-10-28 2000-05-12 Canon Inc 放射線検出装置、放射線検出システム、及び放射線検出装置の製造方法
EP1113290A3 (de) * 1999-12-27 2001-07-18 General Electric Company Strahlungs-Bildaufnahmevorrichtung mit lichtabsorbierender Schicht
KR100630880B1 (ko) * 1999-12-31 2006-10-02 엘지.필립스 엘시디 주식회사 엑스레이 영상 감지소자 및 그 제조방법
US6465824B1 (en) * 2000-03-09 2002-10-15 General Electric Company Imager structure
US6724010B1 (en) 2000-08-03 2004-04-20 General Electric Company Solid state imager having gated photodiodes and method for making same
US6465286B2 (en) 2000-12-20 2002-10-15 General Electric Company Method of fabricating an imager array
US6566284B2 (en) * 2001-08-07 2003-05-20 Hrl Laboratories, Llc Method of manufacture for 80 nanometer diameter resonant tunneling diode with improved peak-to-valley ratio and resonant tunneling diode therefrom
US6740884B2 (en) 2002-04-03 2004-05-25 General Electric Company Imaging array and methods for fabricating same
US6777685B2 (en) * 2002-04-03 2004-08-17 General Electric Company Imaging array and methods for fabricating same
US6559506B1 (en) * 2002-04-03 2003-05-06 General Electric Company Imaging array and methods for fabricating same
US6784434B2 (en) * 2002-06-25 2004-08-31 General Electric Company Imaging array and method for manufacturing same
US7473903B2 (en) * 2003-02-12 2009-01-06 General Electric Company Method and apparatus for deposited hermetic cover for digital X-ray panel
KR101085451B1 (ko) * 2005-02-11 2011-11-21 삼성전자주식회사 표시장치용 박막트랜지스터 기판과 그 제조방법
US7615731B2 (en) * 2006-09-14 2009-11-10 Carestream Health, Inc. High fill-factor sensor with reduced coupling
JP5286691B2 (ja) 2007-05-14 2013-09-11 三菱電機株式会社 フォトセンサー
JP5366410B2 (ja) * 2008-01-30 2013-12-11 富士フイルム株式会社 電磁波検出素子の製造方法
US9031195B2 (en) 2011-05-20 2015-05-12 General Electric Company Imaging detector and methods for image detection
US9935152B2 (en) 2012-12-27 2018-04-03 General Electric Company X-ray detector having improved noise performance
US9917133B2 (en) 2013-12-12 2018-03-13 General Electric Company Optoelectronic device with flexible substrate
US9257480B2 (en) * 2013-12-30 2016-02-09 General Electric Company Method of manufacturing photodiode detectors
WO2015138329A1 (en) 2014-03-13 2015-09-17 General Electric Company Curved digital x-ray detector for weld inspection
CN108376688A (zh) * 2018-04-28 2018-08-07 京东方科技集团股份有限公司 一种感光组件及其制备方法、阵列基板、显示装置

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US4719498A (en) * 1984-05-18 1988-01-12 Fujitsu Limited Optoelectronic integrated circuit
JPH0783096B2 (ja) * 1985-12-17 1995-09-06 セイコーエプソン株式会社 固体撮像装置
JPS62293763A (ja) * 1986-06-13 1987-12-21 Seiko Epson Corp 固体撮像装置
JPS63158871A (ja) * 1986-12-22 1988-07-01 Nec Corp 光・電子集積回路
JPS63174361A (ja) * 1987-01-13 1988-07-18 Nec Corp 光・電子集積回路
JPS6465867A (en) * 1987-09-05 1989-03-13 Fuji Electric Co Ltd Semiconductor integrated circuit device
JPH03109770A (ja) * 1989-09-25 1991-05-09 Ricoh Co Ltd イメージセンサ
JPH0734467B2 (ja) * 1989-11-16 1995-04-12 富士ゼロックス株式会社 イメージセンサ製造方法
US5182625A (en) * 1990-04-26 1993-01-26 Fuji Xerox Co., Ltd. Image sensor and method of manufacturing the same
JPH0423470A (ja) * 1990-05-18 1992-01-27 Fuji Xerox Co Ltd イメージセンサ
US5153438A (en) * 1990-10-01 1992-10-06 General Electric Company Method of forming an x-ray imaging array and the array
US5187369A (en) * 1990-10-01 1993-02-16 General Electric Company High sensitivity, high resolution, solid state x-ray imaging device with barrier layer
CA2048785A1 (en) * 1990-10-05 1992-04-06 Robert F. Kwasnick Imager having improved thin film transistor and photosensitive device structures
US5198694A (en) * 1990-10-05 1993-03-30 General Electric Company Thin film transistor structure with improved source/drain contacts
JPH0787243B2 (ja) * 1990-10-18 1995-09-20 富士ゼロックス株式会社 半導体装置
EP0523784A1 (de) * 1991-07-15 1993-01-20 Philips Electronics Uk Limited Bildgebender Detektor und Methode seiner Herstellung
US5179284A (en) * 1991-08-21 1993-01-12 General Electric Company Solid state radiation imager having a reflective and protective coating
US5132539A (en) * 1991-08-29 1992-07-21 General Electric Company Planar X-ray imager having a moisture-resistant sealing structure
US5233181A (en) * 1992-06-01 1993-08-03 General Electric Company Photosensitive element with two layer passivation coating
US5401668A (en) * 1993-09-02 1995-03-28 General Electric Company Method for fabrication solid state radiation imager having improved scintillator adhesion
US5391507A (en) * 1993-09-03 1995-02-21 General Electric Company Lift-off fabrication method for self-aligned thin film transistors
US5384271A (en) * 1993-10-04 1995-01-24 General Electric Company Method for reduction of off-current in thin film transistors

Also Published As

Publication number Publication date
EP0652596A1 (de) 1995-05-10
JPH07221279A (ja) 1995-08-18
DE69417346T2 (de) 1999-10-14
JP3863923B2 (ja) 2006-12-27
US5399884A (en) 1995-03-21
EP0652596B1 (de) 1999-03-24
US5516712A (en) 1996-05-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: ROEGER UND KOLLEGEN, 73728 ESSLINGEN

8339 Ceased/non-payment of the annual fee