DE69416107T2 - Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper - Google Patents

Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper

Info

Publication number
DE69416107T2
DE69416107T2 DE69416107T DE69416107T DE69416107T2 DE 69416107 T2 DE69416107 T2 DE 69416107T2 DE 69416107 T DE69416107 T DE 69416107T DE 69416107 T DE69416107 T DE 69416107T DE 69416107 T2 DE69416107 T2 DE 69416107T2
Authority
DE
Germany
Prior art keywords
integrated circuit
heat sink
flat heat
circuit housing
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69416107T
Other languages
English (en)
Other versions
DE69416107D1 (de
Inventor
Michael J Hundt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
STMicroelectronics lnc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics lnc USA filed Critical STMicroelectronics lnc USA
Publication of DE69416107D1 publication Critical patent/DE69416107D1/de
Application granted granted Critical
Publication of DE69416107T2 publication Critical patent/DE69416107T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
DE69416107T 1994-03-31 1994-11-30 Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper Expired - Fee Related DE69416107T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/220,783 US5461257A (en) 1994-03-31 1994-03-31 Integrated circuit package with flat-topped heat sink

Publications (2)

Publication Number Publication Date
DE69416107D1 DE69416107D1 (de) 1999-03-04
DE69416107T2 true DE69416107T2 (de) 1999-06-02

Family

ID=22824956

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416107T Expired - Fee Related DE69416107T2 (de) 1994-03-31 1994-11-30 Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper

Country Status (4)

Country Link
US (2) US5461257A (de)
EP (1) EP0675538B1 (de)
JP (1) JP3415699B2 (de)
DE (1) DE69416107T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
GB2320132A (en) * 1996-12-04 1998-06-10 Ibm Handling electronic modules
JP3885197B2 (ja) * 1997-04-11 2007-02-21 株式会社アルファ 基板部に長孔を有する熱交換部品並びにその製造方法
US6844253B2 (en) * 1999-02-19 2005-01-18 Micron Technology, Inc. Selective deposition of solder ball contacts
US6219238B1 (en) 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
US6208519B1 (en) * 1999-08-31 2001-03-27 Micron Technology, Inc. Thermally enhanced semiconductor package
JP3760065B2 (ja) * 1999-09-30 2006-03-29 山洋電気株式会社 冷却ファン装着型ヒートシンクの製造方法
US6435396B1 (en) * 2000-04-10 2002-08-20 Micron Technology, Inc. Print head for ejecting liquid droplets
US6878396B2 (en) * 2000-04-10 2005-04-12 Micron Technology, Inc. Micro C-4 semiconductor die and method for depositing connection sites thereon
US6998721B2 (en) 2002-11-08 2006-02-14 Stmicroelectronics, Inc. Stacking and encapsulation of multiple interconnected integrated circuits
US6870735B2 (en) * 2003-03-25 2005-03-22 Jds Uniphase Corporation Heat sink with visible logo
US7347349B2 (en) * 2003-06-24 2008-03-25 Micron Technology, Inc. Apparatus and method for printing micro metal structures
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US20090027859A1 (en) * 2007-07-26 2009-01-29 Giacoma Lawrence M Surface mounted heat sink and electromagnetic shield
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips
DE102012105110A1 (de) * 2012-06-13 2013-12-19 Osram Opto Semiconductors Gmbh Montageträger und Verfahren zur Montage eines Montageträgers auf einem Anschlussträger
US9508653B2 (en) * 2013-09-18 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Die-tracing in integrated circuit manufacturing and packaging
WO2020087253A1 (en) * 2018-10-30 2020-05-07 Yangtze Memory Technologies Co., Ltd. Ic package
WO2022070479A1 (en) * 2020-09-30 2022-04-07 Hapsmobile Inc. Methods and systems for bonding a heat sink to a stator of an electric motor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4607277A (en) * 1982-03-16 1986-08-19 International Business Machines Corporation Semiconductor assembly employing noneutectic alloy for heat dissipation
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS62213691A (ja) * 1986-03-14 1987-09-19 Komatsu Ltd 熱交換フイン
US5083373A (en) * 1986-04-25 1992-01-28 Hamburgen William R Method for providing a thermal transfer device for the removal of heat from packaged elements
JPH063831B2 (ja) * 1987-04-08 1994-01-12 株式会社日立製作所 冷却装置及びそれを用いた半導体装置
US4765400A (en) * 1987-04-14 1988-08-23 International Business Machines Corp. Circuit module with pins conducting heat from floating plate contacting heat producing device
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5113315A (en) * 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
GB9212674D0 (en) * 1992-06-15 1992-07-29 Rank Brimar Ltd Multipin structures

Also Published As

Publication number Publication date
EP0675538A2 (de) 1995-10-04
DE69416107D1 (de) 1999-03-04
US5461257A (en) 1995-10-24
EP0675538B1 (de) 1999-01-20
JP3415699B2 (ja) 2003-06-09
US5711069A (en) 1998-01-27
EP0675538A3 (de) 1995-12-13
JPH07297332A (ja) 1995-11-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee