DE69407726D1 - Elektroplattierte Kupferfolie und Verfahren zu deren Herstellung - Google Patents

Elektroplattierte Kupferfolie und Verfahren zu deren Herstellung

Info

Publication number
DE69407726D1
DE69407726D1 DE69407726T DE69407726T DE69407726D1 DE 69407726 D1 DE69407726 D1 DE 69407726D1 DE 69407726 T DE69407726 T DE 69407726T DE 69407726 T DE69407726 T DE 69407726T DE 69407726 D1 DE69407726 D1 DE 69407726D1
Authority
DE
Germany
Prior art keywords
foil
cathode
copper foil
copper
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69407726T
Other languages
English (en)
Other versions
DE69407726T2 (de
Inventor
Dino F Difranco
Shiuh-Kao Chiang
Craig J Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Gould Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Electronics Inc filed Critical Gould Electronics Inc
Application granted granted Critical
Publication of DE69407726D1 publication Critical patent/DE69407726D1/de
Publication of DE69407726T2 publication Critical patent/DE69407726T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
DE69407726T 1993-10-22 1994-10-07 Elektroplattierte Kupferfolie und Verfahren zu deren Herstellung Expired - Lifetime DE69407726T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/141,483 US5431803A (en) 1990-05-30 1993-10-22 Electrodeposited copper foil and process for making same

Publications (2)

Publication Number Publication Date
DE69407726D1 true DE69407726D1 (de) 1998-02-12
DE69407726T2 DE69407726T2 (de) 1998-04-16

Family

ID=22495882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69407726T Expired - Lifetime DE69407726T2 (de) 1993-10-22 1994-10-07 Elektroplattierte Kupferfolie und Verfahren zu deren Herstellung

Country Status (10)

Country Link
US (1) US5431803A (de)
EP (1) EP0649917B1 (de)
JP (2) JP3270637B2 (de)
KR (1) KR100364685B1 (de)
CN (1) CN1047411C (de)
AT (1) ATE161901T1 (de)
DE (1) DE69407726T2 (de)
MY (1) MY111485A (de)
RU (1) RU2122049C1 (de)
TW (1) TW373037B (de)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
JP2754157B2 (ja) * 1994-03-31 1998-05-20 三井金属鉱業株式会社 プリント配線板用電解銅箔の製造方法
TW289900B (de) * 1994-04-22 1996-11-01 Gould Electronics Inc
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
EP0857402B1 (de) * 1996-08-23 2007-12-19 Nikko Materials USA, Inc. Flexibles hochleistungslaminat
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
JPH10195689A (ja) * 1996-12-27 1998-07-28 Fukuda Metal Foil & Powder Co Ltd 微細孔明き金属箔の製造方法
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US6179988B1 (en) 1997-08-29 2001-01-30 Electrocopper Products Limited Process for making copper wire
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
WO1999040615A1 (en) 1998-02-04 1999-08-12 Semitool, Inc. Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
JP2000017476A (ja) * 1998-04-30 2000-01-18 Mitsui Mining & Smelting Co Ltd 分散強化型電解銅箔及びその製造方法
US6297154B1 (en) * 1998-08-28 2001-10-02 Agere System Guardian Corp. Process for semiconductor device fabrication having copper interconnects
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
ES2367838T3 (es) 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
WO2000015875A1 (en) * 1998-09-14 2000-03-23 Mitsui Mining & Smelting Co., Ltd. Porous copper foil, use thereof and method for preparation thereof
JP2000340911A (ja) 1999-05-25 2000-12-08 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔
US8298395B2 (en) * 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
JP3733070B2 (ja) 1999-10-22 2006-01-11 三洋電機株式会社 リチウム二次電池用電極及びリチウム二次電池
JP3250994B2 (ja) * 1999-12-28 2002-01-28 三井金属鉱業株式会社 電解銅箔
JP3521074B2 (ja) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 電解銅箔の物性検査方法
DE10005680B4 (de) * 2000-02-07 2005-03-31 Cis Solartechnik Gmbh Trägermaterial für eine flexible, bandförmige CIS-Solarzelle
US6780374B2 (en) 2000-12-08 2004-08-24 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
US6471913B1 (en) 2000-02-09 2002-10-29 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
AU2001282879A1 (en) 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
JP2002105699A (ja) * 2000-10-02 2002-04-10 Nikko Materials Co Ltd 銅張り積層板用電解銅箔及びその製造方法
US20050098262A1 (en) * 2001-07-03 2005-05-12 Chia-Pin Lin Method of laminating copper foil onto a printed circuit board
JP2003013156A (ja) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
US20040247865A1 (en) * 2001-07-27 2004-12-09 Federico Pavan Electrolytic process for depositing a layer of copper on a steel wire
JP2003041333A (ja) * 2001-08-01 2003-02-13 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP2003041334A (ja) * 2001-08-01 2003-02-13 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP2003041332A (ja) * 2001-08-01 2003-02-13 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP2003051673A (ja) * 2001-08-06 2003-02-21 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP2003055723A (ja) * 2001-08-10 2003-02-26 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
AU2002343330A1 (en) * 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
EP1444385A1 (de) * 2001-11-16 2004-08-11 Honeywell International, Inc. Anoden zur elektroplatierung und verfahren zur herstellung von werkstoffen auf halbleitersubstraten
US6676823B1 (en) 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
AU2003275517A1 (en) * 2002-11-01 2004-05-25 Institute Of Metal Research Chinese Academy Of Sciences A nano icrystals copper material with super high strength and conductivity and method of preparing thereof
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
US20040108211A1 (en) * 2002-12-06 2004-06-10 Industrial Technology Research Institute Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)
CN1314838C (zh) * 2002-12-11 2007-05-09 财团法人工业技术研究院 高高温伸长率电解铜箔的制造方法
JP5116943B2 (ja) * 2003-02-04 2013-01-09 古河電気工業株式会社 高周波回路用銅箔及びその製造方法
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
JP4273309B2 (ja) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
JP4376903B2 (ja) * 2005-01-25 2009-12-02 日鉱金属株式会社 特定骨格を有する化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP2006222185A (ja) * 2005-02-09 2006-08-24 Furukawa Circuit Foil Kk ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板
KR100694382B1 (ko) * 2005-05-02 2007-03-12 엘에스전선 주식회사 고강도를 갖는 저조도 전해동박의 제조방법, 이 방법에의해 제조된 전해동박, 및 이 전해동박을 사용하여 제작한전자 부품
US7655126B2 (en) * 2006-03-27 2010-02-02 Federal Mogul World Wide, Inc. Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
KR101154203B1 (ko) * 2006-04-28 2012-06-18 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법
TWI378540B (en) 2006-10-14 2012-12-01 Advanpack Solutions Pte Ltd Chip and manufacturing method thereof
JP4668232B2 (ja) * 2007-04-16 2011-04-13 株式会社フジクラ フレキシブルプリント基板
JP2008285727A (ja) * 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk 高抗張力電解銅箔及びその製造方法
US8303792B1 (en) 2007-08-29 2012-11-06 Magnecomp Corporation High strength electrodeposited suspension conductors
CN101770847B (zh) * 2009-01-05 2012-06-20 胜德国际研发股份有限公司 改良式电感器、电源保护器及电源插座
JP5275273B2 (ja) * 2010-02-23 2013-08-28 パンパシフィック・カッパー株式会社 銅の電解精製装置及びそれを用いた銅の電解精製方法
KR101642152B1 (ko) * 2010-08-20 2016-07-22 엘지전자 주식회사 태양전지 모듈
CN102400188B (zh) * 2010-09-10 2014-10-22 中国科学院金属研究所 一种<111>织构纳米孪晶Cu块体材料及制备方法
TWI432610B (zh) 2010-11-22 2014-04-01 Mitsui Mining & Smelting Co 表面處理銅箔
JP5650023B2 (ja) * 2011-03-03 2015-01-07 Jx日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
JP5074611B2 (ja) * 2011-03-30 2012-11-14 Ｊｘ日鉱日石金属株式会社 二次電池負極集電体用電解銅箔及びその製造方法
JP5666384B2 (ja) * 2011-05-31 2015-02-12 日本電解株式会社 支持体付極薄銅箔とその製造方法
US9966608B2 (en) 2011-06-30 2018-05-08 Furukawa Electric Co., Ltd. Electrolytic copper foil, method of producing electrolytic copper foil, lithium ion secondary cell using electrolytic copper foil as collector
WO2013008349A1 (ja) 2011-07-13 2013-01-17 Jx日鉱日石金属株式会社 強度が高く、かつ反りの少ない電解銅箔及びその製造方法
KR101669087B1 (ko) 2011-07-29 2016-10-25 후루카와 덴키 고교 가부시키가이샤 전해 동합금박, 그 제조 방법, 그것의 제조에 이용하는 전해액, 그것을 이용한 2차 전지용 음극 집전체, 2차 전지 및 그 전극
WO2013065699A1 (ja) 2011-10-31 2013-05-10 古河電気工業株式会社 高強度、高耐熱電解銅箔及びその製造方法
CN102383148A (zh) * 2011-11-18 2012-03-21 山东金宝电子股份有限公司 电解铜箔用混合添加剂、其配制方法以及用于制备超低轮廓电解铜箔的方法
JP5722813B2 (ja) * 2012-03-02 2015-05-27 Jx日鉱日石金属株式会社 電解銅箔及び二次電池用負極集電体
MX355999B (es) * 2012-04-19 2018-05-08 Dipsol Chem Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia.
JP5698196B2 (ja) * 2012-08-17 2015-04-08 Jx日鉱日石金属株式会社 電解銅箔、並びにこれを用いた二次電池集電体及び二次電池
US9673162B2 (en) 2012-09-13 2017-06-06 Nxp Usa, Inc. High power semiconductor package subsystems
US10266959B2 (en) * 2012-11-08 2019-04-23 Monnaie Royale Canadienne / Royal Canadian Mint Enhanced techniques for production of golden bronze by inter-diffusion of tin and copper under controlled conditions
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
KR101660201B1 (ko) 2013-01-24 2016-09-26 후루카와 덴키 고교 가부시키가이샤 전해 구리박과 그 제조 방법
TWI533496B (zh) 2013-07-23 2016-05-11 Chang Chun Petrochemical Co Electrolytic copper foil
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
CN103510106B (zh) * 2013-09-22 2015-10-21 中南大学 一种铜电解添加剂及其使用方法
US10480090B2 (en) 2015-06-24 2019-11-19 Kcf Technologies Co., Ltd. Electrolytic copper foil, current collector comprising the same, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR101802949B1 (ko) * 2016-04-28 2017-11-29 일진머티리얼즈 주식회사 그래핀용 전해동박 및 그의 제조방법
WO2018057490A1 (en) * 2016-09-22 2018-03-29 Macdermid Enthone Inc. Copper plating method and composition for semiconductor substrates
TWI619850B (zh) * 2017-02-24 2018-04-01 南亞塑膠工業股份有限公司 電解液、電解銅箔及其製造方法
US10205170B1 (en) 2017-12-04 2019-02-12 Chang Chun Petrochemical Co., Ltd. Copper foil for current collector of lithium secondary battery
TWI646227B (zh) * 2017-12-08 2019-01-01 南亞塑膠工業股份有限公司 應用於信號傳輸的銅箔以及線路板組件的製造方法
WO2020092244A1 (en) * 2018-10-31 2020-05-07 Lam Research Corporation Electrodeposition of nanotwinned copper structures
CA3119028A1 (en) 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer
CN110760903A (zh) * 2019-10-10 2020-02-07 深圳先进电子材料国际创新研究院 一种铜薄膜材料及其电沉积制备方法
CN112301382B (zh) * 2020-09-07 2021-11-26 浙江花园新能源股份有限公司 一种高延展性低轮廓电解铜箔的制备方法
CN112176366B (zh) * 2020-09-07 2022-05-31 浙江花园新能源股份有限公司 一种高延展性电解铜箔的电解液与应用
CN113881980B (zh) * 2021-11-12 2023-06-06 山东金宝电子有限公司 一种剥离层处理液及可剥离的附载体超薄铜箔的制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2475974A (en) * 1945-08-28 1949-07-12 Rca Corp Electrodeposition of copper
US2482354A (en) * 1946-07-06 1949-09-20 Rca Corp Copper plating solution
US2876178A (en) * 1956-03-06 1959-03-03 Ewald H Mccoy Electrodepositing copper
US2859159A (en) * 1956-10-09 1958-11-04 Elechem Corp Bright copper plating bath containing mixtures of metal compounds
US3864227A (en) * 1973-06-20 1975-02-04 Amax Inc Method for the electrolytic refining of copper
JPS5233074A (en) * 1975-09-10 1977-03-12 Nippon Mining Co Surface treatment of printed circuit copper foil
JPS5853079B2 (ja) * 1976-03-15 1983-11-26 三井アナコンダ銅箔株式会社 銅箔の防錆方法
US4088544A (en) * 1976-04-19 1978-05-09 Hutkin Irving J Composite and method for making thin copper foil
JPS5438053A (en) * 1977-08-29 1979-03-22 Mitsubishi Electric Corp Safety device for elevator cage
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
JPS6152387A (ja) * 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法
ATE82333T1 (de) * 1985-07-05 1992-11-15 Mitsui Mining & Smelting Co Kupferfolie, durch elektrolytische abscheidung hergestellt.
JPH0639155B2 (ja) * 1986-02-21 1994-05-25 名幸電子工業株式会社 銅張積層板の製造方法
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
JPH0631461B2 (ja) * 1987-06-15 1994-04-27 日本電解株式会社 電解銅箔の製造方法
JPH0649958B2 (ja) * 1987-06-15 1994-06-29 日本電解株式会社 電解銅箔の製造方法
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
JP2993968B2 (ja) * 1989-01-10 1999-12-27 古河サーキットフォイル株式会社 電解銅箔の製造方法
US5181770A (en) * 1989-04-19 1993-01-26 Olin Corporation Surface topography optimization through control of chloride concentration in electroformed copper foil
EP0442187B1 (de) * 1990-02-16 1994-02-02 Furukawa Circuit Foil Co., Ltd. Verfahren zur elektrolytischen Herstellung von Kupferfolie
JPH0432155A (ja) * 1990-05-25 1992-02-04 Iwasaki Electric Co Ltd 金属蒸気放電灯点灯装置
KR100275899B1 (ko) * 1990-05-30 2000-12-15 마이클 에이. 센타니 전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법

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ATE161901T1 (de) 1998-01-15
KR950013331A (ko) 1995-05-17
CN1105398A (zh) 1995-07-19
RU2122049C1 (ru) 1998-11-20
US5431803A (en) 1995-07-11
CN1047411C (zh) 1999-12-15
JP2002129373A (ja) 2002-05-09
DE69407726T2 (de) 1998-04-16
JP3270637B2 (ja) 2002-04-02
EP0649917A1 (de) 1995-04-26
TW373037B (en) 1999-11-01
EP0649917B1 (de) 1998-01-07
MY111485A (en) 2000-06-30
KR100364685B1 (ko) 2003-04-16
RU94037962A (ru) 1997-02-27
JPH07188969A (ja) 1995-07-25

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