DE69405342T2 - Poliervorrichtung für Halbleiterscheibe - Google Patents

Poliervorrichtung für Halbleiterscheibe

Info

Publication number
DE69405342T2
DE69405342T2 DE69405342T DE69405342T DE69405342T2 DE 69405342 T2 DE69405342 T2 DE 69405342T2 DE 69405342 T DE69405342 T DE 69405342T DE 69405342 T DE69405342 T DE 69405342T DE 69405342 T2 DE69405342 T2 DE 69405342T2
Authority
DE
Germany
Prior art keywords
semiconductor wafers
polishing device
polishing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69405342T
Other languages
English (en)
Other versions
DE69405342D1 (de
Inventor
Hiroyuki Ohashi
Naoto Miyashita
Ichiro Katakabe
Tetsuya Tsukihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69405342D1 publication Critical patent/DE69405342D1/de
Application granted granted Critical
Publication of DE69405342T2 publication Critical patent/DE69405342T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
DE69405342T 1993-10-28 1994-10-28 Poliervorrichtung für Halbleiterscheibe Expired - Fee Related DE69405342T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27065493A JP3311116B2 (ja) 1993-10-28 1993-10-28 半導体製造装置

Publications (2)

Publication Number Publication Date
DE69405342D1 DE69405342D1 (de) 1997-10-09
DE69405342T2 true DE69405342T2 (de) 1998-01-29

Family

ID=17489104

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69405342T Expired - Fee Related DE69405342T2 (de) 1993-10-28 1994-10-28 Poliervorrichtung für Halbleiterscheibe

Country Status (5)

Country Link
US (1) US5605488A (de)
EP (1) EP0650806B1 (de)
JP (1) JP3311116B2 (de)
KR (1) KR0147451B1 (de)
DE (1) DE69405342T2 (de)

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US5762539A (en) 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
USRE38854E1 (en) 1996-02-27 2005-10-25 Ebara Corporation Apparatus for and method for polishing workpiece
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
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US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
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US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
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JP3982890B2 (ja) * 1997-08-06 2007-09-26 富士通株式会社 研磨装置、この装置に用いられる研磨治具、及び、この研磨治具に取り付けられる被研磨物取付部材
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
US5975998A (en) * 1997-09-26 1999-11-02 Memc Electronic Materials , Inc. Wafer processing apparatus
US5957750A (en) * 1997-12-18 1999-09-28 Micron Technology, Inc. Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
US6121144A (en) * 1997-12-29 2000-09-19 Intel Corporation Low temperature chemical mechanical polishing of dielectric materials
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US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6336853B1 (en) 2000-03-31 2002-01-08 Speedfam-Ipec Corporation Carrier having pistons for distributing a pressing force on the back surface of a workpiece
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Also Published As

Publication number Publication date
KR950012624A (ko) 1995-05-16
EP0650806B1 (de) 1997-09-03
DE69405342D1 (de) 1997-10-09
KR0147451B1 (ko) 1998-11-02
EP0650806A1 (de) 1995-05-03
JP3311116B2 (ja) 2002-08-05
US5605488A (en) 1997-02-25
JPH07122523A (ja) 1995-05-12

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