US6205654B1
(en)
*
|
1992-12-11 |
2001-03-27 |
Staktek Group L.P. |
Method of manufacturing a surface mount package
|
US5426072A
(en)
*
|
1993-01-21 |
1995-06-20 |
Hughes Aircraft Company |
Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate
|
US5644161A
(en)
*
|
1993-03-29 |
1997-07-01 |
Staktek Corporation |
Ultra-high density warp-resistant memory module
|
US5502667A
(en)
*
|
1993-09-13 |
1996-03-26 |
International Business Machines Corporation |
Integrated multichip memory module structure
|
WO1995025341A1
(en)
*
|
1994-03-15 |
1995-09-21 |
Irvine Sensors Corporation |
3d stack of ic chips having leads reached by vias through passivation covering access plane
|
CN1052345C
(zh)
*
|
1994-05-16 |
2000-05-10 |
时至准钟表股份有限公司 |
温差发电装置的制造方法
|
MY114888A
(en)
*
|
1994-08-22 |
2003-02-28 |
Ibm |
Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips
|
US5567653A
(en)
*
|
1994-09-14 |
1996-10-22 |
International Business Machines Corporation |
Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
|
US5609772A
(en)
*
|
1995-06-05 |
1997-03-11 |
International Business Machines Corporation |
Cube maskless lead open process using chemical mechanical polish/lead-tip expose process
|
US5712747A
(en)
*
|
1996-01-24 |
1998-01-27 |
International Business Machines Corporation |
Thin film slider with on-board multi-layer integrated circuit
|
US7166495B2
(en)
*
|
1996-02-20 |
2007-01-23 |
Micron Technology, Inc. |
Method of fabricating a multi-die semiconductor package assembly
|
US5696031A
(en)
*
|
1996-11-20 |
1997-12-09 |
Micron Technology, Inc. |
Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
|
US5903045A
(en)
*
|
1996-04-30 |
1999-05-11 |
International Business Machines Corporation |
Self-aligned connector for stacked chip module
|
US5778522A
(en)
*
|
1996-05-20 |
1998-07-14 |
Staktek Corporation |
Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief
|
US5772815A
(en)
*
|
1996-05-29 |
1998-06-30 |
International Business Machines Corporation |
Method for making laminated integrated circuit devices
|
US5892203A
(en)
*
|
1996-05-29 |
1999-04-06 |
International Business Machines Corporation |
Apparatus for making laminated integrated circuit devices
|
US5772835A
(en)
*
|
1996-05-29 |
1998-06-30 |
Ibm Corporation |
Vacuum oven chamber for making laminated integrated circuit devices
|
US5735196A
(en)
*
|
1996-05-29 |
1998-04-07 |
Ibm Corporation |
Apparatus for applying a force to laminated integrated circuit devices
|
US5813113A
(en)
*
|
1996-12-09 |
1998-09-29 |
International Business Machines Corporation |
Fixture for making laminated integrated circuit devices
|
US5903437A
(en)
*
|
1997-01-17 |
1999-05-11 |
International Business Machines Corporation |
High density edge mounting of chips
|
US5818107A
(en)
*
|
1997-01-17 |
1998-10-06 |
International Business Machines Corporation |
Chip stacking by edge metallization
|
KR100214562B1
(ko)
*
|
1997-03-24 |
1999-08-02 |
구본준 |
적층 반도체 칩 패키지 및 그 제조 방법
|
US5793103A
(en)
*
|
1997-05-08 |
1998-08-11 |
International Business Machines Corporation |
Insulated cube with exposed wire lead
|
US5904502A
(en)
*
|
1997-09-04 |
1999-05-18 |
International Business Machines Corporation |
Multiple 3-dimensional semiconductor device processing method and apparatus
|
US6572387B2
(en)
|
1999-09-24 |
2003-06-03 |
Staktek Group, L.P. |
Flexible circuit connector for stacked chip module
|
JP2001352035A
(ja)
*
|
2000-06-07 |
2001-12-21 |
Sony Corp |
多層半導体装置の組立治具及び多層半導体装置の製造方法
|
AU2001274890A1
(en)
*
|
2000-06-13 |
2001-12-24 |
Mcnc |
High density three dimensional chip package assembly systems and methods
|
US6608763B1
(en)
|
2000-09-15 |
2003-08-19 |
Staktek Group L.P. |
Stacking system and method
|
US6462408B1
(en)
|
2001-03-27 |
2002-10-08 |
Staktek Group, L.P. |
Contact member stacking system and method
|
US6734370B2
(en)
*
|
2001-09-07 |
2004-05-11 |
Irvine Sensors Corporation |
Multilayer modules with flexible substrates
|
EP1436834A4
(de)
*
|
2001-09-07 |
2009-12-02 |
Aprolase Dev Co Llc |
Stapeln mehrschichtiger module
|
US6717061B2
(en)
|
2001-09-07 |
2004-04-06 |
Irvine Sensors Corporation |
Stacking of multilayer modules
|
US6560109B2
(en)
|
2001-09-07 |
2003-05-06 |
Irvine Sensors Corporation |
Stack of multilayer modules with heat-focusing metal layer
|
US6620651B2
(en)
|
2001-10-23 |
2003-09-16 |
National Starch And Chemical Investment Holding Corporation |
Adhesive wafers for die attach application
|
WO2003063242A1
(en)
*
|
2002-01-16 |
2003-07-31 |
Alfred E. Mann Foundation For Scientific Research |
Space-saving packaging of electronic circuits
|
DE102005030465B4
(de)
*
|
2005-06-28 |
2007-12-20 |
Infineon Technologies Ag |
Halbleiterstapelblock mit Halbleiterchips und Verfahren zur Herstellung desselben
|
US7429785B2
(en)
*
|
2005-10-19 |
2008-09-30 |
Littelfuse, Inc. |
Stacked integrated circuit chip assembly
|
TW200924148A
(en)
*
|
2007-11-26 |
2009-06-01 |
Ind Tech Res Inst |
Structure of three-dimensional stacked dies with vertical electrical self-interconnections and method for manufacturing the same
|
US20090188105A1
(en)
*
|
2008-01-28 |
2009-07-30 |
Ming-Chin Chien |
Slim battery packaging method
|
US20110096511A1
(en)
*
|
2009-10-26 |
2011-04-28 |
Christian Krutzik |
Ultra-low profile multi-chip module
|
US9064977B2
(en)
|
2012-08-22 |
2015-06-23 |
Freescale Semiconductor Inc. |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
|
US9093457B2
(en)
|
2012-08-22 |
2015-07-28 |
Freescale Semiconductor Inc. |
Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof
|
US9190390B2
(en)
|
2012-08-22 |
2015-11-17 |
Freescale Semiconductor Inc. |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
|
US9299670B2
(en)
|
2013-03-14 |
2016-03-29 |
Freescale Semiconductor, Inc. |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
|
US9524950B2
(en)
|
2013-05-31 |
2016-12-20 |
Freescale Semiconductor, Inc. |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
|
US9036363B2
(en)
|
2013-09-30 |
2015-05-19 |
Freescale Semiconductor, Inc. |
Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication
|
US9025340B2
(en)
|
2013-09-30 |
2015-05-05 |
Freescale Semiconductor, Inc. |
Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication
|
US9305911B2
(en)
|
2013-12-05 |
2016-04-05 |
Freescale Semiconductor, Inc. |
Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication
|
US9263420B2
(en)
|
2013-12-05 |
2016-02-16 |
Freescale Semiconductor, Inc. |
Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
|
US20150168973A1
(en)
*
|
2013-12-18 |
2015-06-18 |
Hashfast LLC |
Stacked chips powered from shared voltage sources
|
US10388607B2
(en)
|
2014-12-17 |
2019-08-20 |
Nxp Usa, Inc. |
Microelectronic devices with multi-layer package surface conductors and methods of their fabrication
|