DE69328687D1 - Wärmeleitende platte - Google Patents

Wärmeleitende platte

Info

Publication number
DE69328687D1
DE69328687D1 DE69328687T DE69328687T DE69328687D1 DE 69328687 D1 DE69328687 D1 DE 69328687D1 DE 69328687 T DE69328687 T DE 69328687T DE 69328687 T DE69328687 T DE 69328687T DE 69328687 D1 DE69328687 D1 DE 69328687D1
Authority
DE
Germany
Prior art keywords
heat
conducting plate
conducting
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69328687T
Other languages
English (en)
Inventor
Yoshinori Fujimori
Jun Momma
Tomiya Sasaki
Hideo Iwasaki
Toshiya Sakamoto
Hiroshi Endo
Katsumi Hisano
Naoyuki Sori
Kazumi Shimotori
Noriaki Yagi
Hiromi Shizu
Takashi Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69328687D1 publication Critical patent/DE69328687D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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EP0661916B1 (de) 2000-05-17
JP3305720B2 (ja) 2002-07-24
KR950703271A (ko) 1995-08-23
WO1995002313A1 (en) 1995-01-19
EP0661916A1 (de) 1995-07-05
EP0661916A4 (de) 1996-01-10

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