DE69317035T2 - Herstellungsverfahren eines Kunststoffformkörpers mit elektromagnetischer Abschirmung - Google Patents
Herstellungsverfahren eines Kunststoffformkörpers mit elektromagnetischer AbschirmungInfo
- Publication number
- DE69317035T2 DE69317035T2 DE69317035T DE69317035T DE69317035T2 DE 69317035 T2 DE69317035 T2 DE 69317035T2 DE 69317035 T DE69317035 T DE 69317035T DE 69317035 T DE69317035 T DE 69317035T DE 69317035 T2 DE69317035 T2 DE 69317035T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- electromagnetic shielding
- molded plastic
- plastic body
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4298940A JP2561992B2 (ja) | 1992-11-09 | 1992-11-09 | 電磁波シールドプラスチック成形品 |
JP4317380A JP2561993B2 (ja) | 1992-11-26 | 1992-11-26 | 電磁波シールドプラスチック成形品 |
JP2921593A JPH06240034A (ja) | 1993-02-18 | 1993-02-18 | 電磁波シールドプラスチック成形品 |
JP2921793A JPH06240035A (ja) | 1993-02-18 | 1993-02-18 | 電磁波シールドプラスチック成形品 |
JP5029216A JPH06240027A (ja) | 1993-02-18 | 1993-02-18 | 電磁波シールドプラスチック成形品 |
JP22263893A JPH0770345A (ja) | 1993-09-07 | 1993-09-07 | 電磁波シールドプラスチック成形品 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69317035D1 DE69317035D1 (de) | 1998-03-26 |
DE69317035T2 true DE69317035T2 (de) | 1998-06-10 |
Family
ID=27549444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69317035T Expired - Lifetime DE69317035T2 (de) | 1992-11-09 | 1993-11-09 | Herstellungsverfahren eines Kunststoffformkörpers mit elektromagnetischer Abschirmung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5462771A (de) |
EP (1) | EP0597670B1 (de) |
DE (1) | DE69317035T2 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5385785A (en) * | 1993-08-27 | 1995-01-31 | Tapeswitch Corporation Of America | Apparatus and method for providing high temperature conductive-resistant coating, medium and articles |
DE19617656A1 (de) * | 1996-05-03 | 1997-11-06 | Siegfried Schaal Metallveredel | Abschirm-Formteil für elektronische Bauelemente |
US5989720A (en) * | 1996-12-25 | 1999-11-23 | Taniyama & Co., Ltd. | Electromagnetic wave shield material composition and electromagnetic wave shield product including such material composition |
NL1008197C2 (nl) * | 1998-02-04 | 1999-08-05 | Stork Screens Bv | Werkwijze voor het vervaardigen van een drager met een afscherming voor stoorstraling, alsmede afschermingsmateriaal. |
JP3456473B2 (ja) | 2000-11-16 | 2003-10-14 | 日本電気株式会社 | 携帯電話機筐体 |
US6562414B2 (en) | 2001-10-10 | 2003-05-13 | Sport Court, Inc. | Method of coating polyolefin floor tile |
US20040058089A1 (en) * | 2001-10-10 | 2004-03-25 | Sport Court, Inc. | Floor tile coating method and system |
TWI276397B (en) * | 2003-03-21 | 2007-03-11 | Hon Hai Prec Ind Co Ltd | EMI-shielding assembly and method for the manufacture of same |
US7748177B2 (en) | 2004-02-25 | 2010-07-06 | Connor Sport Court International, Inc. | Modular tile with controlled deflection |
US7849642B2 (en) | 2004-03-12 | 2010-12-14 | Connor Sport Court International, Inc. | Tile with wide coupling configuration and method for the same |
US8407951B2 (en) | 2004-10-06 | 2013-04-02 | Connor Sport Court International, Llc | Modular synthetic floor tile configured for enhanced performance |
US8397466B2 (en) | 2004-10-06 | 2013-03-19 | Connor Sport Court International, Llc | Tile with multiple-level surface |
USD656250S1 (en) | 2005-03-11 | 2012-03-20 | Connor Sport Court International, Llc | Tile with wide mouth coupling |
KR100761435B1 (ko) * | 2006-12-19 | 2007-09-27 | 구자은 | 수분산 폴리우레탄을 이용한 진공증착용 전자파 차폐 층 |
US7812731B2 (en) * | 2006-12-22 | 2010-10-12 | Vigilan, Incorporated | Sensors and systems for detecting environmental conditions or changes |
US8502684B2 (en) | 2006-12-22 | 2013-08-06 | Geoffrey J. Bunza | Sensors and systems for detecting environmental conditions or changes |
CN101262748B (zh) * | 2007-03-07 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | 嵌件成型品及其制备方法 |
ITGE20070053A1 (it) * | 2007-06-15 | 2008-12-16 | Nantech S R L | Canale portachiavi o simili, e metodo per la sua fabbricazione |
KR101375956B1 (ko) * | 2012-07-05 | 2014-03-18 | 엘에스산전 주식회사 | 자동차용 전장부품 박스 |
CN111441018A (zh) * | 2015-10-10 | 2020-07-24 | 江苏新思达电子有限公司 | 一种在塑胶上电镀电磁防辐射层的方法 |
JP2017212274A (ja) * | 2016-05-24 | 2017-11-30 | タツタ電線株式会社 | 電磁波シールドフィルム、およびそれを備えたシールドプリント配線板 |
KR102617428B1 (ko) * | 2023-03-17 | 2023-12-27 | 주식회사 크레토즈 | 플라스틱 기반 물품의 제조방법, 플라스틱 기반 물품 제조용 사출금형, 플라스틱 기반 물품 제조용 사출금형 세트 및 플라스틱 기반 물품 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4605565A (en) * | 1982-12-09 | 1986-08-12 | Energy Conversion Devices, Inc. | Method of depositing a highly conductive, highly transmissive film |
US4544571A (en) | 1984-02-13 | 1985-10-01 | Pennwalt Corporation | Method of manufacture of EMI/RFI vapor deposited composite shielding panel |
US4534921A (en) * | 1984-03-06 | 1985-08-13 | Asm Fico Tooling, B.V. | Method and apparatus for mold cleaning by reverse sputtering |
DE3510982A1 (de) | 1985-03-22 | 1986-09-25 | Schering AG, Berlin und Bergkamen, 1000 Berlin | Herstellung metallischer strukturen auf nichtleitern |
DE3744062A1 (de) | 1987-12-22 | 1989-07-13 | Schering Ag | Verfahren zur herstellung fest haftender metallischer strukturen auf fluor-polymeren und thermoplastischen kunststoffen |
FR2682688B1 (fr) * | 1991-10-22 | 1994-01-14 | Thomson Csf | Procede pour la metallisation de la surface de pieces en materiau plastique et pieces a usage electronique ainsi obtenues. |
-
1993
- 1993-11-09 EP EP93308934A patent/EP0597670B1/de not_active Expired - Lifetime
- 1993-11-09 US US08/149,533 patent/US5462771A/en not_active Expired - Lifetime
- 1993-11-09 DE DE69317035T patent/DE69317035T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69317035D1 (de) | 1998-03-26 |
EP0597670A1 (de) | 1994-05-18 |
US5462771A (en) | 1995-10-31 |
EP0597670B1 (de) | 1998-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: CBC INGS CO., LTD., TOKIO/TOKYO, JP MURAYAMA, YOIC |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: CBC CO.,LTD., TOKIO/TOKYO, JP Owner name: MURAYAMA, YOICHI, TOKIO/TOKYO, JP |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: PFENNING MEINIG & PARTNER GBR, 80339 MUENCHEN |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: MAIWALD PATENTANWALTSGESELLSCHAFT MBH, 80335 MUENC |