DE69313954T2 - Modifizierte Dicyanatesterharze mit erhöhter Bruchzähigkeit - Google Patents
Modifizierte Dicyanatesterharze mit erhöhter BruchzähigkeitInfo
- Publication number
- DE69313954T2 DE69313954T2 DE1993613954 DE69313954T DE69313954T2 DE 69313954 T2 DE69313954 T2 DE 69313954T2 DE 1993613954 DE1993613954 DE 1993613954 DE 69313954 T DE69313954 T DE 69313954T DE 69313954 T2 DE69313954 T2 DE 69313954T2
- Authority
- DE
- Germany
- Prior art keywords
- modified
- fracture toughness
- ester resins
- increased fracture
- dicyanate ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
- Y10T442/2893—Coated or impregnated polyamide fiber fabric
- Y10T442/2902—Aromatic polyamide fiber fabric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2926—Coated or impregnated inorganic fiber fabric
- Y10T442/2992—Coated or impregnated glass fiber fabric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
- Y10T442/3423—Plural metallic films or foils or sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
- Y10T442/3431—Plural fabric layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3472—Woven fabric including an additional woven fabric layer
- Y10T442/3528—Three or more fabric layers
- Y10T442/3569—Woven fabric layers impregnated with a thermosetting resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/654—Including a free metal or alloy constituent
- Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/659—Including an additional nonwoven fabric
- Y10T442/671—Multiple nonwoven fabric layers composed of the same polymeric strand or fiber material
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/923,723 US5548034A (en) | 1992-07-31 | 1992-07-31 | Modified dicyanate ester resins having enhanced fracture toughness |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69313954D1 DE69313954D1 (de) | 1997-10-23 |
DE69313954T2 true DE69313954T2 (de) | 1998-03-26 |
Family
ID=25449167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993613954 Expired - Lifetime DE69313954T2 (de) | 1992-07-31 | 1993-07-30 | Modifizierte Dicyanatesterharze mit erhöhter Bruchzähigkeit |
Country Status (4)
Country | Link |
---|---|
US (7) | US5548034A (de) |
EP (1) | EP0581314B1 (de) |
JP (1) | JP2501286B2 (de) |
DE (1) | DE69313954T2 (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5827907A (en) * | 1993-08-30 | 1998-10-27 | Ibm Corporation | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
US5677045A (en) * | 1993-09-14 | 1997-10-14 | Hitachi, Ltd. | Laminate and multilayer printed circuit board |
JP3648750B2 (ja) * | 1993-09-14 | 2005-05-18 | 株式会社日立製作所 | 積層板及び多層プリント回路板 |
US6960636B2 (en) | 1994-09-02 | 2005-11-01 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
US6852814B2 (en) | 1994-09-02 | 2005-02-08 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
US5789757A (en) * | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
US7645899B1 (en) | 1994-09-02 | 2010-01-12 | Henkel Corporation | Vinyl compounds |
DE4435992C2 (de) * | 1994-10-08 | 1997-06-12 | Fraunhofer Ges Forschung | Optische Elemente aus Kunststoff |
US6372534B1 (en) | 1995-06-06 | 2002-04-16 | Lg. Philips Lcd Co., Ltd | Method of making a TFT array with photo-imageable insulating layer over address lines |
US5994721A (en) | 1995-06-06 | 1999-11-30 | Ois Optical Imaging Systems, Inc. | High aperture LCD with insulating color filters overlapping bus lines on active substrate |
KR100294715B1 (ko) * | 1995-09-14 | 2001-09-17 | 포만 제프리 엘 | 경화된 감광성 폴리시아누레이트 레지스트,그로부터 제조된 구조체 및 그의 제조방법 |
US20030055121A1 (en) * | 1996-09-10 | 2003-03-20 | Dershem Stephen M. | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
US5847327A (en) | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
US5886134A (en) * | 1997-10-06 | 1999-03-23 | National Science Council Of Republic Of China | Bismaleimide-triazine resin and production method thereof |
US5945470A (en) * | 1997-10-15 | 1999-08-31 | Ali; Mir Akbar | Ceramic-polymer composite material and its use in microelectronics packaging |
JP3149837B2 (ja) * | 1997-12-08 | 2001-03-26 | 松下電器産業株式会社 | 回路形成基板の製造方法とその製造装置および回路形成基板用材料 |
JP3652488B2 (ja) * | 1997-12-18 | 2005-05-25 | Tdk株式会社 | 樹脂パッケージの製造方法 |
US6174800B1 (en) | 1998-09-08 | 2001-01-16 | Taiwan Semiconductor Manufacturing Company | Via formation in a poly(arylene ether) inter metal dielectric layer |
US6339120B1 (en) | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US6649325B1 (en) | 2001-05-25 | 2003-11-18 | The Bergquist Company | Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation |
JP2004515610A (ja) * | 2000-12-12 | 2004-05-27 | シュリ ディクシャ コーポレイション | 伝導性制約コアを含む軽量回路板 |
US6674172B2 (en) | 2001-05-08 | 2004-01-06 | International Business Machines Corporation | Flip-chip package with underfill having low density filler |
JP4552496B2 (ja) * | 2001-08-31 | 2010-09-29 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグ、積層板および半導体パッケージ |
EP1457515A4 (de) | 2001-08-31 | 2004-11-24 | Sumitomo Bakelite Co | Harzzusammensetzung, prepreg, laminatfolie und halbleiterbaustein |
CA2474693A1 (en) | 2002-02-06 | 2003-08-14 | Sekisui Chemical Co., Ltd. | Resin composition and products containing the same |
AU2003244466A1 (en) | 2002-02-06 | 2003-09-02 | Sekisui Chemical Co., Ltd. | Resin composition |
US20050028925A1 (en) * | 2002-09-04 | 2005-02-10 | Fernandes Karim B. | Method for making a prepreg |
US6737158B1 (en) * | 2002-10-30 | 2004-05-18 | Gore Enterprise Holdings, Inc. | Porous polymeric membrane toughened composites |
AU2002953570A0 (en) * | 2002-12-24 | 2003-01-16 | Robert Bosch Gmbh | Polymer compositions |
AU2003208142B2 (en) * | 2002-12-24 | 2005-04-07 | Robert Bosch Gmbh | Polymer compositions |
WO2005117508A2 (en) * | 2004-05-15 | 2005-12-08 | C-Core Technologies, Inc. | Printed wiring board with conductive constraining core including resin filled channels |
US20060104035A1 (en) * | 2004-08-24 | 2006-05-18 | Vasoya Kalu K | Edge plated printed wiring boards |
US7301105B2 (en) * | 2004-08-27 | 2007-11-27 | Stablcor, Inc. | Printed wiring boards possessing regions with different coefficients of thermal expansion |
KR20070112274A (ko) * | 2005-03-15 | 2007-11-22 | 씨-코어 테크놀로지즈, 인코포레이티드 | 인쇄배선기판 내에 억제 코어 재료를 구성하는 방법 |
EP1726581A1 (de) * | 2005-05-25 | 2006-11-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Synthese von neuen Monomeren die eine Tifluorvinylidengruppe und eine Cyanatogruppe enthalten und deren Polymere |
USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
US20070120270A1 (en) * | 2005-11-23 | 2007-05-31 | Kuroda Roger T | Flip chip hermetic seal using pre-formed material |
WO2007077066A1 (de) * | 2005-12-29 | 2007-07-12 | Continental Automotive Gmbh | Leiterplattenanordnung |
CN101401491B (zh) * | 2006-03-20 | 2011-04-13 | 住友电木株式会社 | 绝缘树脂层、带载体的绝缘树脂层和多层印刷布线板 |
EP1854827B1 (de) * | 2006-05-11 | 2015-04-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Harze mit verbesserten Eigenschaften |
DE102006022372A1 (de) | 2006-05-12 | 2007-11-15 | Airbus Deutschland Gmbh | Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Prepregharze für Honeycomb-Sandwichbauteile mit exzellenten Oberflächen |
US8168292B2 (en) * | 2006-06-15 | 2012-05-01 | Innegra Technologies, Llc | Composite materials including amorphous thermoplastic fibers |
US8203080B2 (en) * | 2006-07-14 | 2012-06-19 | Stablcor Technology, Inc. | Build-up printed wiring board substrate having a core layer that is part of a circuit |
EP2431420A1 (de) * | 2006-12-22 | 2012-03-21 | Mankiewicz Gebr. & Co. (GmbH & Co. KG) | Polymerfilm zur Oberflächenbeschichtung von Faser-Kunststoff-Verbundwerkstoffen |
US20080188153A1 (en) * | 2007-02-06 | 2008-08-07 | Innegrity, Llc | Method of Forming a Low Dielectric Loss Composite Material |
US7648758B2 (en) | 2007-02-06 | 2010-01-19 | Innegrity, Llc | Low dielectric loss composite material |
US8715843B2 (en) * | 2010-02-17 | 2014-05-06 | Doyle Manufacturing, Inc. | Vent cap including watering valve, float and fluid flow path that does not impinge float |
US8283408B2 (en) * | 2010-02-26 | 2012-10-09 | Hexcel Corporation | Thermoplastic-toughened cyanate ester resin composites with low heat release properties |
US9068040B2 (en) | 2010-10-12 | 2015-06-30 | Hexcel Corporation | Solvent resistant thermoplastic toughened epoxy |
JP6010871B2 (ja) * | 2011-05-27 | 2016-10-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、および積層板 |
US9879163B2 (en) | 2014-06-06 | 2018-01-30 | General Electric Company | Composition for bonding windings or core laminates in an electrical machine, and associated method |
US9911521B2 (en) | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
JP2015178627A (ja) * | 2015-05-22 | 2015-10-08 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂及び分散プロセスのための金属安定剤 |
GB201517273D0 (en) * | 2015-09-30 | 2015-11-11 | Univ Manchester | Resist composition |
CN106810862B (zh) * | 2015-11-30 | 2019-08-09 | 航天特种材料及工艺技术研究所 | 一种协同增韧的改性氰酸酯树脂及制备方法 |
US11596066B1 (en) * | 2022-03-22 | 2023-02-28 | Thintronics. Inc. | Materials for printed circuit boards |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4745215A (en) * | 1987-04-03 | 1988-05-17 | International Business Machines Corporation | Fluorine containing dicyanate resins |
US4902752A (en) * | 1987-10-05 | 1990-02-20 | Hi-Tek Polymers, Inc. | Polycyanate esters of polyhydric phenols blended with thermoplastic polymers |
DE69027295T2 (de) * | 1990-01-19 | 1997-01-23 | Minnesota Mining & Mfg | Wärmehärtbare Zusammensetzung |
US5126192A (en) * | 1990-01-26 | 1992-06-30 | International Business Machines Corporation | Flame retardant, low dielectric constant microsphere filled laminate |
JPH07103313B2 (ja) * | 1990-02-16 | 1995-11-08 | ソマール株式会社 | 硬化性樹脂成形品 |
JPH0799646B2 (ja) * | 1991-05-03 | 1995-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 分子的多孔性エーロゲルで充填された低誘電率複合積層品 |
-
1992
- 1992-07-31 US US07/923,723 patent/US5548034A/en not_active Expired - Lifetime
-
1993
- 1993-06-03 JP JP13321593A patent/JP2501286B2/ja not_active Expired - Fee Related
- 1993-07-30 DE DE1993613954 patent/DE69313954T2/de not_active Expired - Lifetime
- 1993-07-30 EP EP19930112282 patent/EP0581314B1/de not_active Expired - Lifetime
-
1994
- 1994-11-23 US US08/344,479 patent/US5599611A/en not_active Expired - Fee Related
- 1994-11-23 US US08/344,478 patent/US5527838A/en not_active Expired - Lifetime
- 1994-11-23 US US08/344,475 patent/US5523148A/en not_active Expired - Lifetime
- 1994-11-23 US US08/344,477 patent/US5527593A/en not_active Expired - Fee Related
- 1994-11-23 US US08/344,476 patent/US5529836A/en not_active Expired - Fee Related
- 1994-11-23 US US08/344,454 patent/US5527592A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69313954D1 (de) | 1997-10-23 |
US5548034A (en) | 1996-08-20 |
US5599611A (en) | 1997-02-04 |
EP0581314A3 (en) | 1994-09-07 |
EP0581314B1 (de) | 1997-09-17 |
EP0581314A2 (de) | 1994-02-02 |
JPH06107958A (ja) | 1994-04-19 |
JP2501286B2 (ja) | 1996-05-29 |
US5527838A (en) | 1996-06-18 |
US5527592A (en) | 1996-06-18 |
US5523148A (en) | 1996-06-04 |
US5527593A (en) | 1996-06-18 |
US5529836A (en) | 1996-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69313954T2 (de) | Modifizierte Dicyanatesterharze mit erhöhter Bruchzähigkeit | |
BR9203041A (pt) | Injetor | |
DE69317474T3 (de) | Abbaubarer Verbundstoff | |
BR9304747A (pt) | Injetor de medicamentos | |
DE69123606D1 (de) | Verbinder | |
DE69213569T2 (de) | Verbundstoff | |
FI914598A0 (fi) | Foerfarande i en med optisk princip fungerande ankomstkoppling. | |
ATE151296T1 (de) | Spritze | |
FI941166A0 (fi) | Trisyklinen heterosyklyyliyhdiste | |
DK0573636T3 (da) | Ballistiske materialer | |
FI914599A0 (fi) | Foerfarande i en med optisk princip fungerande ankomstkoppling. | |
DE69322735T2 (de) | Thermotrope Kunstharz-Zusammensetzung | |
DE69412400D1 (de) | Vorverstärkerschaltungsanordnungen | |
ITMI921618A1 (it) | Bersaglio apparente multispettrale | |
DE69406606T2 (de) | Polyimidharzzusammensetzung | |
DE69229694D1 (de) | Verbundwerkstoff | |
KR950003861U (ko) | 가드레일 | |
KR950016536U (ko) | 겉호청과 윗호청의 분리결합이 자재한 이불 | |
ATE135088T1 (de) | Befestigungsdübel | |
KR950001357U (ko) | 가드레일 | |
KR950002615U (ko) | 투척식주낙 | |
KR930021337U (ko) | 마그네트가 부착된 직각자 | |
KR940022032U (ko) | 수지침 | |
KR940022031U (ko) | 수지침 | |
KR930017798U (ko) | 수지침용 자침기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7 |