DE69309123D1 - Verfahren und Vorrichtung zur Herstellung eines Druckwandlers mit einem laminierten Substrat - Google Patents

Verfahren und Vorrichtung zur Herstellung eines Druckwandlers mit einem laminierten Substrat

Info

Publication number
DE69309123D1
DE69309123D1 DE69309123T DE69309123T DE69309123D1 DE 69309123 D1 DE69309123 D1 DE 69309123D1 DE 69309123 T DE69309123 T DE 69309123T DE 69309123 T DE69309123 T DE 69309123T DE 69309123 D1 DE69309123 D1 DE 69309123D1
Authority
DE
Germany
Prior art keywords
producing
pressure transducer
laminated substrate
laminated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69309123T
Other languages
English (en)
Other versions
DE69309123T2 (de
Inventor
Edward F Koen
Robert D Vernon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Electric Systems USA Inc
Original Assignee
Foxboro Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxboro Co filed Critical Foxboro Co
Publication of DE69309123D1 publication Critical patent/DE69309123D1/de
Application granted granted Critical
Publication of DE69309123T2 publication Critical patent/DE69309123T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
    • G01L27/007—Malfunction diagnosis, i.e. diagnosing a sensor defect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making
DE69309123T 1992-01-24 1993-01-22 Verfahren und Vorrichtung zur Herstellung eines Druckwandlers mit einem laminierten Substrat Expired - Lifetime DE69309123T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/825,620 US5285690A (en) 1992-01-24 1992-01-24 Pressure sensor having a laminated substrate

Publications (2)

Publication Number Publication Date
DE69309123D1 true DE69309123D1 (de) 1997-04-30
DE69309123T2 DE69309123T2 (de) 1997-10-30

Family

ID=25244498

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69309123T Expired - Lifetime DE69309123T2 (de) 1992-01-24 1993-01-22 Verfahren und Vorrichtung zur Herstellung eines Druckwandlers mit einem laminierten Substrat

Country Status (4)

Country Link
US (2) US5285690A (de)
EP (1) EP0553725B1 (de)
JP (1) JP3208512B2 (de)
DE (1) DE69309123T2 (de)

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Also Published As

Publication number Publication date
US5285690A (en) 1994-02-15
JP3208512B2 (ja) 2001-09-17
EP0553725B1 (de) 1997-03-26
EP0553725A2 (de) 1993-08-04
EP0553725A3 (en) 1993-10-20
US5407501A (en) 1995-04-18
DE69309123T2 (de) 1997-10-30
JPH06258163A (ja) 1994-09-16

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