DE69308241T2 - Verfahren zur Herstellung eines leitenden Endbereichs einer flexiblen Leiterplatte - Google Patents
Verfahren zur Herstellung eines leitenden Endbereichs einer flexiblen LeiterplatteInfo
- Publication number
- DE69308241T2 DE69308241T2 DE69308241T DE69308241T DE69308241T2 DE 69308241 T2 DE69308241 T2 DE 69308241T2 DE 69308241 T DE69308241 T DE 69308241T DE 69308241 T DE69308241 T DE 69308241T DE 69308241 T2 DE69308241 T2 DE 69308241T2
- Authority
- DE
- Germany
- Prior art keywords
- producing
- circuit board
- printed circuit
- flexible printed
- end region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/901,054 US5237743A (en) | 1992-06-19 | 1992-06-19 | Method of forming a conductive end portion on a flexible circuit member |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69308241D1 DE69308241D1 (de) | 1997-04-03 |
DE69308241T2 true DE69308241T2 (de) | 1997-08-14 |
Family
ID=25413530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69308241T Expired - Fee Related DE69308241T2 (de) | 1992-06-19 | 1993-05-17 | Verfahren zur Herstellung eines leitenden Endbereichs einer flexiblen Leiterplatte |
Country Status (4)
Country | Link |
---|---|
US (1) | US5237743A (de) |
EP (1) | EP0574715B1 (de) |
JP (1) | JP2500992B2 (de) |
DE (1) | DE69308241T2 (de) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5374344A (en) * | 1993-07-27 | 1994-12-20 | International Business Machines, Inc. | Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate |
US5384690A (en) * | 1993-07-27 | 1995-01-24 | International Business Machines Corporation | Flex laminate package for a parallel processor |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US7084656B1 (en) | 1993-11-16 | 2006-08-01 | Formfactor, Inc. | Probe for semiconductor devices |
US7200930B2 (en) * | 1994-11-15 | 2007-04-10 | Formfactor, Inc. | Probe for semiconductor devices |
US5399101A (en) * | 1993-12-16 | 1995-03-21 | International Business Machines Corporation | Electrical connector with preloaded contact |
TW381328B (en) * | 1994-03-07 | 2000-02-01 | Ibm | Dual substrate package assembly for being electrically coupled to a conducting member |
US5467779A (en) * | 1994-07-18 | 1995-11-21 | General Electric Company | Multiplanar probe for ultrasonic imaging |
AU4159896A (en) * | 1994-11-15 | 1996-06-06 | Formfactor, Inc. | Mounting electronic components to a circuit board |
US5937515A (en) * | 1995-04-25 | 1999-08-17 | Johnson; Morgan T. | Reconfigurable circuit fabrication method |
US5691041A (en) * | 1995-09-29 | 1997-11-25 | International Business Machines Corporation | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US5791912A (en) * | 1995-12-01 | 1998-08-11 | Riechelmann; Bernd | Contactor with multiple redundant connecting paths |
EP0789427B1 (de) * | 1996-02-12 | 2003-10-22 | Tyco Electronics Logistics AG | Leiterplattenverbinder |
US5808875A (en) * | 1996-03-29 | 1998-09-15 | Intel Corporation | Integrated circuit solder-rack interconnect module |
US5813876A (en) * | 1996-06-13 | 1998-09-29 | Intel Corporation | Pressure actuated zero insertion force circuit board edge connector socket |
US5984690A (en) * | 1996-11-12 | 1999-11-16 | Riechelmann; Bernd | Contactor with multiple redundant connecting paths |
US6204065B1 (en) * | 1997-03-27 | 2001-03-20 | Ngk Insulators, Ltd. | Conduction assist member and manufacturing method of the same |
US6137299A (en) * | 1997-06-27 | 2000-10-24 | International Business Machines Corporation | Method and apparatus for testing integrated circuit chips |
US6024579A (en) * | 1998-05-29 | 2000-02-15 | The Whitaker Corporation | Electrical connector having buckling beam contacts |
JP3323449B2 (ja) | 1998-11-18 | 2002-09-09 | 日本碍子株式会社 | 半導体用ソケット |
US6221459B1 (en) | 1998-11-30 | 2001-04-24 | Intel Corporation | Controlling the heat expansion of electrical couplings |
US6846184B2 (en) * | 2003-01-24 | 2005-01-25 | High Connection Density Inc. | Low inductance electrical contacts and LGA connector system |
US7278855B2 (en) * | 2004-02-09 | 2007-10-09 | Silicon Pipe, Inc | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture |
USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US7659739B2 (en) | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US6923661B1 (en) * | 2004-06-17 | 2005-08-02 | Molex Incorporated | Power connector for mounting on a circuit board |
NL1027450C2 (nl) * | 2004-11-09 | 2006-05-10 | Shin Etsu Polymer Europ B V | Doorverbindingsconnector, frame omvattende een dergelijke connector, elektrische meet- en testinrichting en contacteringswerkwijze met behulp van een dergelijke connector. |
US7649367B2 (en) | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
US7312617B2 (en) | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
US8179693B2 (en) * | 2007-03-30 | 2012-05-15 | International Business Machines Corporation | Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements |
US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
KR101460839B1 (ko) * | 2008-01-17 | 2014-11-11 | 암페놀 코포레이션 | 인터포저 조립체 및 방법 |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
US8079849B2 (en) * | 2010-05-11 | 2011-12-20 | Tyco Electronics Corporation | Socket connector assembly with compressive contacts |
US9172161B2 (en) * | 2012-12-12 | 2015-10-27 | Amphenol InterCon Systems, Inc. | Impedance controlled LGA interposer assembly |
US9484699B2 (en) * | 2014-03-13 | 2016-11-01 | Apple Inc. | Elastomeric connectors |
JP2015210886A (ja) | 2014-04-24 | 2015-11-24 | 富士通コンポーネント株式会社 | コネクタ、及び、コンタクト |
US10103478B1 (en) * | 2017-06-23 | 2018-10-16 | Amazon Technologies, Inc. | Water resistant connectors with conductive elements |
CN111403937A (zh) * | 2020-03-24 | 2020-07-10 | 东莞立德精密工业有限公司 | 金属端子及其制作方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3679940A (en) * | 1971-01-21 | 1972-07-25 | Voltronics Corp | Trimmer capacitor |
US3941442A (en) * | 1973-10-09 | 1976-03-02 | E. I. Du Pont De Nemours And Company | Daughter board contact |
US3960424A (en) * | 1974-10-02 | 1976-06-01 | Amp Incorporated | Multi-contact spring connector for board to board connections |
US3960423A (en) * | 1974-10-02 | 1976-06-01 | Amp Incorporated | Multi-contact connector for substrate-to-board connections |
US4027935A (en) * | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
FR2387529A1 (fr) * | 1977-04-15 | 1978-11-10 | Ibm | Contacts et connexions electriques a dendrites |
IT1112620B (it) * | 1977-04-15 | 1986-01-20 | Ibm | Connettore elettrico perfezionato |
JPS5555985U (de) * | 1978-10-12 | 1980-04-16 | ||
US4505529A (en) * | 1983-11-01 | 1985-03-19 | Amp Incorporated | Electrical connector for use between circuit boards |
US4634199A (en) * | 1985-01-22 | 1987-01-06 | Itt Corporation | Connector assembly for making multiple connections in a thin space |
US4636018A (en) * | 1985-06-05 | 1987-01-13 | Amp Incorporated | Elastomeric electrical connector |
US4655519A (en) * | 1985-10-16 | 1987-04-07 | Amp Incorporated | Electrical connector for interconnecting arrays of conductive areas |
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4764848A (en) * | 1986-11-24 | 1988-08-16 | International Business Machines Corporation | Surface mounted array strain relief device |
JPH0455421Y2 (de) * | 1986-11-28 | 1992-12-25 | ||
US4818634A (en) * | 1986-12-24 | 1989-04-04 | Texas Instruments Incorporated | Composite metal spring material, method of making, and spring members formed therefrom |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
US4875863A (en) * | 1988-04-11 | 1989-10-24 | Amp Incorporated | Electrical device having improved leads for surface mounting on a circuit board |
DE68913823T2 (de) * | 1988-06-21 | 1994-09-22 | Ibm | Lösbare elektrische Verbindung. |
US5137461A (en) * | 1988-06-21 | 1992-08-11 | International Business Machines Corporation | Separable electrical connection technology |
US5037311A (en) * | 1989-05-05 | 1991-08-06 | International Business Machines Corporation | High density interconnect strip |
US4943242A (en) * | 1989-05-05 | 1990-07-24 | International Business Machines Corporation | Zero insertion force high density connector system |
US4998886A (en) * | 1989-07-07 | 1991-03-12 | Teledyne Kinetics | High density stacking connector |
US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
US5049084A (en) * | 1989-12-05 | 1991-09-17 | Rogers Corporation | Electrical circuit board interconnect |
US5061192A (en) * | 1990-12-17 | 1991-10-29 | International Business Machines Corporation | High density connector |
-
1992
- 1992-06-19 US US07/901,054 patent/US5237743A/en not_active Expired - Fee Related
-
1993
- 1993-05-17 DE DE69308241T patent/DE69308241T2/de not_active Expired - Fee Related
- 1993-05-17 EP EP93107999A patent/EP0574715B1/de not_active Expired - Lifetime
- 1993-05-18 JP JP5140003A patent/JP2500992B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0574715A1 (de) | 1993-12-22 |
US5237743A (en) | 1993-08-24 |
JP2500992B2 (ja) | 1996-05-29 |
DE69308241D1 (de) | 1997-04-03 |
EP0574715B1 (de) | 1997-02-26 |
JPH0636848A (ja) | 1994-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |