DE69302561D1 - Anordnung zur Erwärmung von elektronischen Platten - Google Patents

Anordnung zur Erwärmung von elektronischen Platten

Info

Publication number
DE69302561D1
DE69302561D1 DE69302561T DE69302561T DE69302561D1 DE 69302561 D1 DE69302561 D1 DE 69302561D1 DE 69302561 T DE69302561 T DE 69302561T DE 69302561 T DE69302561 T DE 69302561T DE 69302561 D1 DE69302561 D1 DE 69302561D1
Authority
DE
Germany
Prior art keywords
arrangement
heating electronic
electronic plates
plates
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69302561T
Other languages
English (en)
Other versions
DE69302561T2 (de
Inventor
Pierre Dagnac
Michel Leviandier
Jean-Philippe Tigneres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of DE69302561D1 publication Critical patent/DE69302561D1/de
Application granted granted Critical
Publication of DE69302561T2 publication Critical patent/DE69302561T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
DE69302561T 1992-10-29 1993-10-29 Anordnung zur Erwärmung von elektronischen Platten Expired - Fee Related DE69302561T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9212950A FR2697717B1 (fr) 1992-10-29 1992-10-29 Dispositif de réchauffage de cartes électroniques.

Publications (2)

Publication Number Publication Date
DE69302561D1 true DE69302561D1 (de) 1996-06-13
DE69302561T2 DE69302561T2 (de) 1996-09-19

Family

ID=9434987

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69302561T Expired - Fee Related DE69302561T2 (de) 1992-10-29 1993-10-29 Anordnung zur Erwärmung von elektronischen Platten

Country Status (5)

Country Link
US (1) US5486681A (de)
EP (1) EP0599678B1 (de)
DE (1) DE69302561T2 (de)
FR (1) FR2697717B1 (de)
WO (1) WO2004075614A1 (de)

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KR100209018B1 (ko) * 1996-09-16 1999-07-15 윤종용 보조기억장치 테스트용 오븐
US6097001A (en) * 1997-06-30 2000-08-01 Alcatel Portable heating tent and method for testing telecommunications equipment
EP0912078B1 (de) * 1997-10-21 2004-08-11 Lucent Technologies Inc. Heizelement
TW453621U (en) * 1999-06-08 2001-09-01 Hon Hai Prec Ind Co Ltd Structure for combining stopping sheet and carrying seat
US6493224B1 (en) * 2000-08-08 2002-12-10 Lucent Technologies Inc. Method and apparatus to increase convection heat transfer in an electrical system and a method of manufacturing the same
US6639795B1 (en) * 2002-02-15 2003-10-28 Steve Cooper Flow through butterfly backpane
US7233159B2 (en) * 2004-06-02 2007-06-19 Emc Corporation Ergonomic, rotatable electronic component testing apparatus
US7996174B2 (en) * 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US20090153993A1 (en) * 2007-12-18 2009-06-18 Teradyne, Inc. Disk Drive Testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US20110123301A1 (en) * 2008-04-17 2011-05-26 Scott Noble Bulk feeding storage devices to storage device testing systems
US8095234B2 (en) * 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8238099B2 (en) * 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8102173B2 (en) * 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US7848106B2 (en) * 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8305751B2 (en) * 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8041449B2 (en) * 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US7945424B2 (en) * 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US20090262455A1 (en) * 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8160739B2 (en) * 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8086343B2 (en) * 2008-06-03 2011-12-27 Teradyne, Inc. Processing storage devices
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US7920380B2 (en) * 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8547123B2 (en) * 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
US9263659B2 (en) * 2011-06-10 2016-02-16 Perpetua Power Source Technologies, Inc. System and method for thermal protection of an electronics module of an energy harvester
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11224098B2 (en) * 2018-11-01 2022-01-11 General Electric Company Systems and methods for passive heating of temperature-sensitive electronic components
US11382178B2 (en) * 2019-06-27 2022-07-05 General Electric Company System and method for heating an electrical bus in an electrical cabinet for cold startup and condensation/frost control
US11428479B2 (en) * 2020-04-15 2022-08-30 Baidu Usa Llc Compact thermal control plate
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1196620A (en) * 1967-12-01 1970-07-01 Smiths Industries Ltd Improvements in or relating to Electric Heating Assemblies
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
DE3107683A1 (de) * 1981-02-28 1982-09-16 Brown, Boveri & Cie Ag, 6800 Mannheim Schrank zur aufnahme von elektrischen und/oder elektronischen bauelementen
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
BE1002726A3 (fr) * 1989-01-04 1991-05-21 Asturienne Mines Comp Royale Element de chauffage.
US4985803A (en) * 1989-03-17 1991-01-15 Square D Company Housing for a multi-board electronic module for a programmable controller system
JPH0397299A (ja) * 1989-09-11 1991-04-23 Mitsubishi Electric Corp 空気調和機のリモートコントローラ
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.

Also Published As

Publication number Publication date
EP0599678A1 (de) 1994-06-01
FR2697717B1 (fr) 1994-12-16
US5486681A (en) 1996-01-23
DE69302561T2 (de) 1996-09-19
EP0599678B1 (de) 1996-05-08
FR2697717A1 (fr) 1994-05-06
WO2004075614A1 (fr) 2004-09-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee