DE69231409D1 - Oberflächenmontierbare Halbleiterpackung - Google Patents

Oberflächenmontierbare Halbleiterpackung

Info

Publication number
DE69231409D1
DE69231409D1 DE69231409T DE69231409T DE69231409D1 DE 69231409 D1 DE69231409 D1 DE 69231409D1 DE 69231409 T DE69231409 T DE 69231409T DE 69231409 T DE69231409 T DE 69231409T DE 69231409 D1 DE69231409 D1 DE 69231409D1
Authority
DE
Germany
Prior art keywords
semiconductor package
surface mount
mount semiconductor
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69231409T
Other languages
English (en)
Other versions
DE69231409T2 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69231409D1 publication Critical patent/DE69231409D1/de
Publication of DE69231409T2 publication Critical patent/DE69231409T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10469—Asymmetrically mounted component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69231409T 1991-06-17 1992-06-16 Oberflächenmontierbare Halbleiterpackung Expired - Fee Related DE69231409T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14489591 1991-06-17
JP17682191 1991-07-17
JP3255414A JP2971637B2 (ja) 1991-06-17 1991-10-02 半導体装置

Publications (2)

Publication Number Publication Date
DE69231409D1 true DE69231409D1 (de) 2000-10-05
DE69231409T2 DE69231409T2 (de) 2001-04-19

Family

ID=27318897

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69226824T Expired - Fee Related DE69226824T2 (de) 1991-06-17 1992-06-16 Halbleitervorrichtung montiert auf einem Substrat
DE69231409T Expired - Fee Related DE69231409T2 (de) 1991-06-17 1992-06-16 Oberflächenmontierbare Halbleiterpackung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69226824T Expired - Fee Related DE69226824T2 (de) 1991-06-17 1992-06-16 Halbleitervorrichtung montiert auf einem Substrat

Country Status (5)

Country Link
US (1) US5305179A (de)
EP (2) EP0767495B1 (de)
JP (1) JP2971637B2 (de)
KR (1) KR950013047B1 (de)
DE (2) DE69226824T2 (de)

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US5786985A (en) * 1991-05-31 1998-07-28 Fujitsu Limited Semiconductor device and semiconductor device unit
US5413970A (en) * 1993-10-08 1995-05-09 Texas Instruments Incorporated Process for manufacturing a semiconductor package having two rows of interdigitated leads
US5619012A (en) * 1993-12-10 1997-04-08 Philips Electronics North America Corporation Hinged circuit assembly with multi-conductor framework
EP0675363A3 (de) * 1994-03-31 1997-03-05 Delco Electronics Corp Beschleunigungsmessanordnung.
JPH0846104A (ja) * 1994-05-31 1996-02-16 Motorola Inc 表面実装電子素子およびその製造方法
KR0155843B1 (ko) * 1995-07-07 1998-12-01 이대원 반도체장치
JPH0951126A (ja) * 1995-08-09 1997-02-18 Saamobonitsuku:Kk 熱電変換装置
US5644081A (en) * 1995-09-28 1997-07-01 Delco Electronics Corp. Microaccelerometer package with integral support braces
KR100236016B1 (ko) * 1996-12-16 1999-12-15 구자홍 적층형 반도체 패키지 및 그의 어셈블리 방법
US5944199A (en) * 1997-11-25 1999-08-31 Micron Technology, Inc. Integrated circuit package support system
US6326687B1 (en) 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6236116B1 (en) * 1998-09-03 2001-05-22 Micron Technology, Inc. Semiconductor device having a built-in heat sink and process of manufacturing same
US6396133B1 (en) * 1998-09-03 2002-05-28 Micron Technology, Inc. Semiconductor device with heat-dissipating lead-frame and process of manufacturing same
US6535393B2 (en) * 1998-12-04 2003-03-18 Micron Technology, Inc. Electrical device allowing for increased device densities
US6061242A (en) * 1999-02-25 2000-05-09 Micron Technology, Inc. Die paddle heat sink with thermal posts
US6236567B1 (en) * 1999-12-03 2001-05-22 Caesar Technology Inc. Electronic device package with enhanced heat dissipation effect
JP2002171086A (ja) * 2000-11-29 2002-06-14 Pioneer Electronic Corp 部 品
JP4454181B2 (ja) 2001-05-15 2010-04-21 富士通マイクロエレクトロニクス株式会社 半導体装置
US6885562B2 (en) 2001-12-28 2005-04-26 Medtronic Physio-Control Manufacturing Corporation Circuit package and method for making the same
JP3867639B2 (ja) * 2002-07-31 2007-01-10 株式会社デンソー 混成集積回路装置
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
JP4641762B2 (ja) * 2003-10-16 2011-03-02 シャープ株式会社 光半導体装置
TWI259755B (en) * 2004-10-12 2006-08-01 Delta Electronics Inc Heat sink fixing device
CN100435324C (zh) * 2004-12-20 2008-11-19 半导体元件工业有限责任公司 具有增强散热性的半导体封装结构
TWI296750B (en) * 2005-12-20 2008-05-11 Asustek Comp Inc Heat-dissipating device coupled by a heat pipe
DE102008040488A1 (de) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Elektronische Baueinheit und Verfahren zu deren Herstellung
US8004080B2 (en) 2009-09-04 2011-08-23 Freescale Smeiconductor, Inc. Edge mounted integrated circuits with heat sink
EP3054534B1 (de) * 2013-10-02 2019-12-11 Hitachi Automotive Systems, Ltd. Elektronische steuerungsvorrichtung
CN104269385B (zh) * 2014-10-21 2017-12-19 矽力杰半导体技术(杭州)有限公司 封装组件及其制造方法
WO2018142864A1 (ja) * 2017-02-06 2018-08-09 富士電機株式会社 半導体モジュール、電気自動車およびパワーコントロールユニット
CN113727082B (zh) * 2021-08-20 2023-12-01 深圳亮仔光电科技有限公司 一种主动智能散热装置和投影机密封光机

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Publication number Priority date Publication date Assignee Title
US3899719A (en) * 1973-08-30 1975-08-12 Electronic Molding Corp Integrated circuit panel and dual in-line package for use therewith
US4012769A (en) * 1975-08-04 1977-03-15 Thermalloy Incorporated Heat sink with parallel flat faces
JPS6050346B2 (ja) * 1980-04-16 1985-11-08 日本電気株式会社 半導体装置の製造方法
US4546406A (en) * 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4387413A (en) * 1980-12-24 1983-06-07 Rca Corporation Semiconductor apparatus with integral heat sink tab
JPS59136956A (ja) * 1983-01-25 1984-08-06 Rohm Co Ltd 半導体装置
DE3305167C2 (de) * 1983-02-15 1994-05-05 Bosch Gmbh Robert Elektrische Schaltungsanordnung mit einer Leiterplatte
JPS6028256A (ja) * 1983-07-26 1985-02-13 Fujitsu Ltd 半導体装置
JPS6062140A (ja) * 1983-09-14 1985-04-10 Toshiba Corp 樹脂封止型半導体装置
JPS60164346A (ja) * 1984-02-06 1985-08-27 Hitachi Cable Ltd Ｉｃ用リ−ドフレ−ム
DE3421539A1 (de) * 1984-06-08 1985-12-19 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement fuer smd-technik
JPS6184841A (ja) * 1984-10-02 1986-04-30 Toshiba Corp 半導体装置の外囲器
US5126820A (en) * 1985-02-01 1992-06-30 Advanced Micro Devices, Inc. Thermal expansion compensated metal lead frame for integrated circuit package
JPS62263667A (ja) 1986-05-12 1987-11-16 Hitachi Tobu Semiconductor Ltd 電子装置
US4811166A (en) * 1986-07-02 1989-03-07 Texas Instruments Incorporated Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
JPS63129652A (ja) * 1986-11-20 1988-06-02 Toshiba Corp 半導体装置
JPS63181456A (ja) * 1987-01-23 1988-07-26 Matsushita Electronics Corp 半導体装置
US4975763A (en) 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
JPH084117B2 (ja) * 1988-03-30 1996-01-17 株式会社東芝 半導体装置の製造方法
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)

Also Published As

Publication number Publication date
EP0521335B1 (de) 1998-09-02
US5305179A (en) 1994-04-19
EP0767495A2 (de) 1997-04-09
KR950013047B1 (ko) 1995-10-24
EP0521335A1 (de) 1993-01-07
DE69226824T2 (de) 1999-01-14
DE69231409T2 (de) 2001-04-19
EP0767495A3 (de) 1997-05-21
DE69226824D1 (de) 1998-10-08
KR930001359A (ko) 1993-01-16
JP2971637B2 (ja) 1999-11-08
EP0767495B1 (de) 2000-08-30
JPH0574991A (ja) 1993-03-26

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