DE69228044D1 - Verfahren zur Strukturierung von Wolframschichten - Google Patents
Verfahren zur Strukturierung von WolframschichtenInfo
- Publication number
- DE69228044D1 DE69228044D1 DE69228044T DE69228044T DE69228044D1 DE 69228044 D1 DE69228044 D1 DE 69228044D1 DE 69228044 T DE69228044 T DE 69228044T DE 69228044 T DE69228044 T DE 69228044T DE 69228044 D1 DE69228044 D1 DE 69228044D1
- Authority
- DE
- Germany
- Prior art keywords
- structuring
- tungsten layers
- tungsten
- layers
- structuring tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/783,647 US5176792A (en) | 1991-10-28 | 1991-10-28 | Method for forming patterned tungsten layers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69228044D1 true DE69228044D1 (de) | 1999-02-11 |
DE69228044T2 DE69228044T2 (de) | 1999-08-19 |
Family
ID=25129969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69228044T Expired - Fee Related DE69228044T2 (de) | 1991-10-28 | 1992-10-21 | Verfahren zur Strukturierung von Wolframschichten |
Country Status (4)
Country | Link |
---|---|
US (1) | US5176792A (de) |
EP (1) | EP0540230B1 (de) |
JP (1) | JPH06291089A (de) |
DE (1) | DE69228044T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3179212B2 (ja) * | 1992-10-27 | 2001-06-25 | 日本電気株式会社 | 半導体装置の製造方法 |
US5338702A (en) * | 1993-01-27 | 1994-08-16 | International Business Machines Corporation | Method for fabricating tungsten local interconnections in high density CMOS |
US5882992A (en) * | 1994-08-25 | 1999-03-16 | International Business Machines Corporation | Method for fabricating Tungsten local interconnections in high density CMOS circuits |
JPH08186120A (ja) * | 1994-12-28 | 1996-07-16 | Nec Corp | 半導体装置の製造方法 |
KR100322696B1 (ko) * | 1995-03-29 | 2002-06-20 | 김순택 | 전계효과전자방출용마이크로-팁및그제조방법 |
US5843289A (en) | 1996-01-22 | 1998-12-01 | Etex Corporation | Surface modification of medical implants |
US6033582A (en) | 1996-01-22 | 2000-03-07 | Etex Corporation | Surface modification of medical implants |
US5681486A (en) * | 1996-02-23 | 1997-10-28 | The Boeing Company | Plasma descaling of titanium and titanium alloys |
US5866483A (en) * | 1997-04-04 | 1999-02-02 | Applied Materials, Inc. | Method for anisotropically etching tungsten using SF6, CHF3, and N2 |
KR100397860B1 (ko) | 1997-09-22 | 2003-12-18 | 카가쿠기쥬쯔죠 킨조쿠자이료 기쥬쯔켄큐죠 | 반응성이온에칭법및그장치 |
US6872322B1 (en) | 1997-11-12 | 2005-03-29 | Applied Materials, Inc. | Multiple stage process for cleaning process chambers |
US6136211A (en) * | 1997-11-12 | 2000-10-24 | Applied Materials, Inc. | Self-cleaning etch process |
US6322714B1 (en) | 1997-11-12 | 2001-11-27 | Applied Materials Inc. | Process for etching silicon-containing material on substrates |
US6797188B1 (en) | 1997-11-12 | 2004-09-28 | Meihua Shen | Self-cleaning process for etching silicon-containing material |
JP3576783B2 (ja) * | 1997-12-26 | 2004-10-13 | Tdk株式会社 | 薄膜磁気ヘッドの製造方法 |
US6958295B1 (en) * | 1998-01-20 | 2005-10-25 | Tegal Corporation | Method for using a hard mask for critical dimension growth containment |
US6527968B1 (en) * | 2000-03-27 | 2003-03-04 | Applied Materials Inc. | Two-stage self-cleaning silicon etch process |
SE517275C2 (sv) * | 2000-09-20 | 2002-05-21 | Obducat Ab | Sätt vid våtetsning av ett substrat |
US6905800B1 (en) | 2000-11-21 | 2005-06-14 | Stephen Yuen | Etching a substrate in a process zone |
US6852242B2 (en) | 2001-02-23 | 2005-02-08 | Zhi-Wen Sun | Cleaning of multicompositional etchant residues |
US6863930B2 (en) | 2002-09-06 | 2005-03-08 | Delphi Technologies, Inc. | Refractory metal mask and methods for coating an article and forming a sensor |
US8118946B2 (en) * | 2007-11-30 | 2012-02-21 | Wesley George Lau | Cleaning process residues from substrate processing chamber components |
US8052776B2 (en) | 2009-05-29 | 2011-11-08 | Corning Incorporated | Poly(amino-alcohol)-silica hybrid compositions and membranes |
DE102011075888B4 (de) | 2011-05-16 | 2014-07-10 | Robert Bosch Gmbh | Halbleitervorrichtung mit mindestens einem Kontakt und Herstellungsverfahren für eine Halbleitervorrichtung mit mindestens einem Kontakt |
JP6422262B2 (ja) * | 2013-10-24 | 2018-11-14 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
DE102013226270B3 (de) | 2013-12-17 | 2015-04-02 | Forschungsverbund Berlin E.V. | Verfahren zum Ausbilden eines Metallkontakts auf einer Oberfläche eines Halbleiters und Vorrichtung mit einem Metallkontakt |
US9595448B2 (en) * | 2015-06-29 | 2017-03-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for cleaning plasma processing chamber and substrate |
GB202010407D0 (en) * | 2020-07-07 | 2020-08-19 | Univ Court Univ Of Glasgow | Micromachined mechcahnical part and methods of fabrication thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5032538A (en) * | 1979-08-10 | 1991-07-16 | Massachusetts Institute Of Technology | Semiconductor embedded layer technology utilizing selective epitaxial growth methods |
US4674174A (en) * | 1984-10-17 | 1987-06-23 | Kabushiki Kaisha Toshiba | Method for forming a conductor pattern using lift-off |
JPS6196765A (ja) * | 1984-10-17 | 1986-05-15 | Toshiba Corp | 金属パタ−ン形成方法 |
JPS6212502A (ja) * | 1986-07-04 | 1987-01-21 | Toshiba Seiki Kk | 電子部品の搬送装置 |
JPS6336547A (ja) * | 1986-07-31 | 1988-02-17 | Nec Corp | 半導体装置の製造方法 |
FR2613134B1 (fr) * | 1987-03-24 | 1990-03-09 | Labo Electronique Physique | Dispositif semiconducteur du type transistor a effet de champ |
JPS647621A (en) * | 1987-06-30 | 1989-01-11 | Yokogawa Electric Corp | Manufacture of mesfet |
JPH01236622A (ja) * | 1988-03-17 | 1989-09-21 | Toshiba Corp | X線マスク及びその製造方法 |
US4898804A (en) * | 1988-03-31 | 1990-02-06 | Cornell Research Foundation | Self-aligned, high resolution resonant dielectric lithography |
US4900398A (en) * | 1989-06-19 | 1990-02-13 | General Motors Corporation | Chemical milling of titanium |
JP3371143B2 (ja) * | 1991-06-03 | 2003-01-27 | ソニー株式会社 | ドライエッチング方法 |
-
1991
- 1991-10-28 US US07/783,647 patent/US5176792A/en not_active Expired - Lifetime
-
1992
- 1992-10-09 JP JP4296671A patent/JPH06291089A/ja active Pending
- 1992-10-21 DE DE69228044T patent/DE69228044T2/de not_active Expired - Fee Related
- 1992-10-21 EP EP92309607A patent/EP0540230B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH06291089A (ja) | 1994-10-18 |
EP0540230A2 (de) | 1993-05-05 |
EP0540230A3 (en) | 1993-08-25 |
EP0540230B1 (de) | 1998-12-30 |
US5176792A (en) | 1993-01-05 |
DE69228044T2 (de) | 1999-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |