DE69222957D1 - Plattierter nachgiebiger leiter - Google Patents
Plattierter nachgiebiger leiterInfo
- Publication number
- DE69222957D1 DE69222957D1 DE69222957T DE69222957T DE69222957D1 DE 69222957 D1 DE69222957 D1 DE 69222957D1 DE 69222957 T DE69222957 T DE 69222957T DE 69222957 T DE69222957 T DE 69222957T DE 69222957 D1 DE69222957 D1 DE 69222957D1
- Authority
- DE
- Germany
- Prior art keywords
- flexible ladder
- plated flexible
- plated
- ladder
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76750091A | 1991-09-30 | 1991-09-30 | |
PCT/US1992/008320 WO1993007657A1 (en) | 1991-09-30 | 1992-09-30 | Plated compliant lead |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69222957D1 true DE69222957D1 (de) | 1997-12-04 |
Family
ID=25079696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69222957T Expired - Lifetime DE69222957D1 (de) | 1991-09-30 | 1992-09-30 | Plattierter nachgiebiger leiter |
Country Status (7)
Country | Link |
---|---|
US (2) | US5294039A (de) |
EP (1) | EP0678232B1 (de) |
JP (1) | JPH07502141A (de) |
AU (1) | AU661867B2 (de) |
CA (1) | CA2115553C (de) |
DE (1) | DE69222957D1 (de) |
WO (1) | WO1993007657A1 (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US6330164B1 (en) * | 1985-10-18 | 2001-12-11 | Formfactor, Inc. | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US7084656B1 (en) | 1993-11-16 | 2006-08-01 | Formfactor, Inc. | Probe for semiconductor devices |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
WO1996015458A1 (en) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6836962B2 (en) | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
US6336269B1 (en) * | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US7579269B2 (en) * | 1993-11-16 | 2009-08-25 | Formfactor, Inc. | Microelectronic spring contact elements |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US20030199179A1 (en) * | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
US20070228110A1 (en) * | 1993-11-16 | 2007-10-04 | Formfactor, Inc. | Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US7200930B2 (en) * | 1994-11-15 | 2007-04-10 | Formfactor, Inc. | Probe for semiconductor devices |
US6727580B1 (en) * | 1993-11-16 | 2004-04-27 | Formfactor, Inc. | Microelectronic spring contact elements |
US6442831B1 (en) | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US6835898B2 (en) * | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US6023103A (en) * | 1994-11-15 | 2000-02-08 | Formfactor, Inc. | Chip-scale carrier for semiconductor devices including mounted spring contacts |
US5572407A (en) * | 1994-07-22 | 1996-11-05 | Hughes Aircraft Company | Apparatus for interconnecting an integrated circuit device to a multilayer printed wiring board |
DE9417299U1 (de) * | 1994-10-27 | 1995-03-02 | Siemens Ag | Stromversorgungsmodul zur Bestückung einer Baugruppenleiterplatte |
US6727579B1 (en) | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
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AU5964096A (en) * | 1995-05-26 | 1996-12-11 | Formfactor, Inc. | Ribbon-like core interconnection elements |
JP3157005B2 (ja) * | 1995-05-26 | 2001-04-16 | フォームファクター,インコーポレイテッド | ばね要素を成形するための方法及び装置 |
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US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
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JP2980046B2 (ja) * | 1997-02-03 | 1999-11-22 | 日本電気株式会社 | 半導体装置の実装構造および実装方法 |
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US6724203B1 (en) | 1997-10-30 | 2004-04-20 | International Business Machines Corporation | Full wafer test configuration using memory metals |
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FR2805671B1 (fr) * | 2000-02-25 | 2002-07-26 | Sagem | Connecteur pour cartes a puce |
DE10029418A1 (de) | 2000-06-15 | 2001-12-20 | Siemens Ag | Überstromschutzschaltung |
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US6296496B1 (en) * | 2000-08-16 | 2001-10-02 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and method for attaching the same to a printed circuit board |
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US6627980B2 (en) | 2001-04-12 | 2003-09-30 | Formfactor, Inc. | Stacked semiconductor device assembly with microelectronic spring contacts |
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US20030054583A1 (en) * | 2001-09-20 | 2003-03-20 | Eastman Kodak Company | Method for producing an image sensor assembly |
US6657866B2 (en) * | 2002-03-15 | 2003-12-02 | Robert C. Morelock | Electronics assembly with improved heatsink configuration |
KR100722096B1 (ko) * | 2005-11-23 | 2007-05-25 | 삼성에스디아이 주식회사 | 휴대용 표시장치 |
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US8196291B2 (en) * | 2006-11-06 | 2012-06-12 | General Dynamics Advanced Information Systems, Inc. | Method for manufacturing leads |
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US20090250506A1 (en) * | 2008-02-28 | 2009-10-08 | General Dynamics Advanced Information Systems | Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards |
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US8780571B2 (en) | 2010-07-28 | 2014-07-15 | General Dynamics Advanced Information Systems, Inc. | Interposer lead |
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KR101474396B1 (ko) | 2012-11-13 | 2014-12-18 | 주식회사 엘지화학 | 인쇄 회로 기판, 인쇄 회로 기판 연결 구조 및 인쇄 회로 기판 연결 방법 |
KR101474395B1 (ko) | 2012-11-15 | 2014-12-18 | 주식회사 엘지화학 | 인쇄 회로 기판, 인쇄 회로 기판 연결 구조 및 인쇄 회로 기판 연결 방법 |
US20140262498A1 (en) * | 2013-03-13 | 2014-09-18 | U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration | Interconnect Device and Assemblies Made Therewith |
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CN106710836B (zh) * | 2017-01-10 | 2019-02-01 | 苏州品翔电通有限公司 | 一种变压器骨架 |
CN114554724A (zh) * | 2022-02-25 | 2022-05-27 | 西安微电子技术研究所 | 一种针对密封smd器件的缓释片及其应用方法 |
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US4755146A (en) * | 1987-06-04 | 1988-07-05 | Molex Incorporated | Heat-dissipating socket connector for leaded modules |
US4827611A (en) * | 1988-03-28 | 1989-05-09 | Control Data Corporation | Compliant S-leads for chip carriers |
EP0448266B1 (de) * | 1990-03-23 | 1996-06-05 | Motorola, Inc. | Oberflächenmontierbare Halbleitervorrichtung mit selbstbeladenen Lötverbindungen |
US5210939A (en) * | 1992-04-17 | 1993-05-18 | Intel Corporation | Lead grid array integrated circuit |
DE4235798A1 (de) * | 1992-10-23 | 1994-04-28 | Basf Ag | Verwendung von Vinylpyrrolidon- und Vinylimidazol-Copolymerisaten als Waschmitteladditiv, neue Polymerisate des Vinylpyrrolidons und des Vinylimidazols und Verfahren zu ihrer Herstellung |
-
1992
- 1992-09-30 JP JP5507025A patent/JPH07502141A/ja active Pending
- 1992-09-30 WO PCT/US1992/008320 patent/WO1993007657A1/en active IP Right Grant
- 1992-09-30 AU AU27761/92A patent/AU661867B2/en not_active Ceased
- 1992-09-30 CA CA002115553A patent/CA2115553C/en not_active Expired - Fee Related
- 1992-09-30 EP EP92921977A patent/EP0678232B1/de not_active Expired - Lifetime
- 1992-09-30 DE DE69222957T patent/DE69222957D1/de not_active Expired - Lifetime
-
1993
- 1993-05-14 US US08/061,842 patent/US5294039A/en not_active Expired - Lifetime
- 1993-10-01 US US08/130,532 patent/US5317479A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1993007657A1 (en) | 1993-04-15 |
EP0678232A1 (de) | 1995-10-25 |
JPH07502141A (ja) | 1995-03-02 |
CA2115553A1 (en) | 1993-04-15 |
EP0678232B1 (de) | 1997-10-29 |
US5294039A (en) | 1994-03-15 |
CA2115553C (en) | 2002-08-20 |
US5317479A (en) | 1994-05-31 |
AU661867B2 (en) | 1995-08-10 |
EP0678232A4 (de) | 1994-10-25 |
AU2776192A (en) | 1993-05-03 |
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