DE69222448T2 - Backfilling Verfahren zum Herstellen einer Mikrostruktur mit Membran - Google Patents

Backfilling Verfahren zum Herstellen einer Mikrostruktur mit Membran

Info

Publication number
DE69222448T2
DE69222448T2 DE69222448T DE69222448T DE69222448T2 DE 69222448 T2 DE69222448 T2 DE 69222448T2 DE 69222448 T DE69222448 T DE 69222448T DE 69222448 T DE69222448 T DE 69222448T DE 69222448 T2 DE69222448 T2 DE 69222448T2
Authority
DE
Germany
Prior art keywords
microstructure
membrane
producing
backfilling process
backfilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69222448T
Other languages
English (en)
Other versions
DE69222448D1 (de
Inventor
Benjamin G Hocker
Akintunde I Ikinwande
David W Burns
Robert D Horning
Amir R Mirza
Diedrich J Saathoff
Thomas G Stratton
James K Carney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of DE69222448D1 publication Critical patent/DE69222448D1/de
Application granted granted Critical
Publication of DE69222448T2 publication Critical patent/DE69222448T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
DE69222448T 1991-02-07 1992-02-06 Backfilling Verfahren zum Herstellen einer Mikrostruktur mit Membran Expired - Fee Related DE69222448T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/652,148 US5295395A (en) 1991-02-07 1991-02-07 Diaphragm-based-sensors

Publications (2)

Publication Number Publication Date
DE69222448D1 DE69222448D1 (de) 1997-11-06
DE69222448T2 true DE69222448T2 (de) 1998-02-26

Family

ID=24615695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69222448T Expired - Fee Related DE69222448T2 (de) 1991-02-07 1992-02-06 Backfilling Verfahren zum Herstellen einer Mikrostruktur mit Membran

Country Status (4)

Country Link
US (3) US5295395A (de)
EP (4) EP1107294A3 (de)
JP (4) JP3277467B2 (de)
DE (1) DE69222448T2 (de)

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Also Published As

Publication number Publication date
EP0756164A2 (de) 1997-01-29
EP0500234B1 (de) 1997-10-01
EP1107294A3 (de) 2001-11-14
JP2001223368A (ja) 2001-08-17
JP3277467B2 (ja) 2002-04-22
JP3462488B2 (ja) 2003-11-05
EP1098181A3 (de) 2001-08-01
EP0756164A3 (de) 1997-06-04
JP3464657B2 (ja) 2003-11-10
JP2002185014A (ja) 2002-06-28
US5318652A (en) 1994-06-07
US5295395A (en) 1994-03-22
JPH0626961A (ja) 1994-02-04
DE69222448D1 (de) 1997-11-06
US5683594A (en) 1997-11-04
EP0500234A3 (en) 1993-03-24
EP1107294A2 (de) 2001-06-13
JP3418611B2 (ja) 2003-06-23
EP1098181A2 (de) 2001-05-09
JP2002198540A (ja) 2002-07-12
EP0500234A2 (de) 1992-08-26

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