DE69210818T2 - Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattieren - Google Patents
Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattierenInfo
- Publication number
- DE69210818T2 DE69210818T2 DE69210818T DE69210818T DE69210818T2 DE 69210818 T2 DE69210818 T2 DE 69210818T2 DE 69210818 T DE69210818 T DE 69210818T DE 69210818 T DE69210818 T DE 69210818T DE 69210818 T2 DE69210818 T2 DE 69210818T2
- Authority
- DE
- Germany
- Prior art keywords
- electroplating
- improved method
- conductive substrates
- preparing non
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69451791A | 1991-05-01 | 1991-05-01 | |
US07/747,066 US5139642A (en) | 1991-05-01 | 1991-08-19 | Process for preparing a nonconductive substrate for electroplating |
PCT/US1992/002063 WO1992019794A1 (en) | 1991-05-01 | 1992-03-16 | Improved process for preparing a nonconductive substrate for electroplating |
Publications (3)
Publication Number | Publication Date |
---|---|
DE69210818D1 DE69210818D1 (de) | 1996-06-20 |
DE69210818T2 true DE69210818T2 (de) | 1996-10-31 |
DE69210818T3 DE69210818T3 (de) | 2000-11-16 |
Family
ID=27105399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69210818T Expired - Lifetime DE69210818T3 (de) | 1991-05-01 | 1992-03-16 | Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattieren |
Country Status (7)
Country | Link |
---|---|
US (2) | US5139642A (de) |
EP (1) | EP0583426B2 (de) |
JP (1) | JP3135124B2 (de) |
AU (1) | AU2001692A (de) |
CA (1) | CA2103137A1 (de) |
DE (1) | DE69210818T3 (de) |
WO (1) | WO1992019794A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW222313B (en) * | 1993-01-29 | 1994-04-11 | Mekku Kk | Electroplating method |
US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
US6303181B1 (en) * | 1993-05-17 | 2001-10-16 | Electrochemicals Inc. | Direct metallization process employing a cationic conditioner and a binder |
US5690805A (en) * | 1993-05-17 | 1997-11-25 | Electrochemicals Inc. | Direct metallization process |
US6171468B1 (en) | 1993-05-17 | 2001-01-09 | Electrochemicals Inc. | Direct metallization process |
US5725807A (en) | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
US6710259B2 (en) * | 1993-05-17 | 2004-03-23 | Electrochemicals, Inc. | Printed wiring boards and methods for making them |
US5389270A (en) * | 1993-05-17 | 1995-02-14 | Electrochemicals, Inc. | Composition and process for preparing a non-conductive substrate for electroplating |
US5536386A (en) * | 1995-02-10 | 1996-07-16 | Macdermid, Incorporated | Process for preparing a non-conductive substrate for electroplating |
US6195883B1 (en) * | 1998-03-25 | 2001-03-06 | International Business Machines Corporation | Full additive process with filled plated through holes |
US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
KR100505173B1 (ko) * | 1996-01-29 | 2005-10-24 | 일렉트로케미칼스 인코퍼레이티드 | 인쇄배선판에서기포의형성을감소시키기위한인쇄배전판의비전도성관통구멍표면처리공정 |
US5674372A (en) * | 1996-09-24 | 1997-10-07 | Mac Dermid, Incorporated | Process for preparing a non-conductive substrate for electroplating |
WO1998040538A2 (de) * | 1997-03-13 | 1998-09-17 | Besenhard Juergen Otto | Verfahren zum elektrolytischen abscheiden einer metallschicht mit glatter oberfläche auf einem substrat unter verwendung ener graphitdispersion |
DE19731186C2 (de) | 1997-07-10 | 2000-08-03 | Atotech Deutschland Gmbh | Feststofffreie Vorbehandlungslösung für elektrisch nichtleitende Oberflächen sowie Verfahren zur Herstellung der Lösung und deren Verwendung |
GB2332209A (en) * | 1997-12-09 | 1999-06-16 | Devex Sa | Electroplating involving the use of a preliminary coating |
US6440331B1 (en) | 1999-06-03 | 2002-08-27 | Electrochemicals Inc. | Aqueous carbon composition and method for coating a non conductive substrate |
US6212769B1 (en) * | 1999-06-29 | 2001-04-10 | International Business Machines Corporation | Process for manufacturing a printed wiring board |
WO2001032964A1 (fr) * | 1999-11-01 | 2001-05-10 | Jsr Corporation | Dispersion aqueuse pour former une couche conductrice, couche conductrice, composant electronique, carte de circuit imprime et son procede de fabrication, et carte a circuit imprime multicouche et son procede de fabrication |
US6375731B1 (en) * | 2000-01-06 | 2002-04-23 | Electrochemicals Inc. | Conditioning of through holes and glass |
US6623787B2 (en) * | 2001-07-26 | 2003-09-23 | Electrochemicals Inc. | Method to improve the stability of dispersions of carbon |
US7029529B2 (en) | 2002-09-19 | 2006-04-18 | Applied Materials, Inc. | Method and apparatus for metallization of large area substrates |
DE602004010444T2 (de) * | 2003-02-20 | 2008-04-30 | Jsr Corp. | Elektrodenpastenzusammensetzung |
US7063800B2 (en) * | 2003-11-10 | 2006-06-20 | Ying Ding | Methods of cleaning copper surfaces in the manufacture of printed circuit boards |
US7211204B2 (en) * | 2003-12-12 | 2007-05-01 | Electrochemicals, Inc. | Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA) |
FR2866329B1 (fr) | 2004-02-12 | 2006-06-02 | Saint Gobain Vetrotex | Fils de verre conducteurs de l'electricite et structures comprenant de tels fils. |
US7128820B2 (en) * | 2004-03-11 | 2006-10-31 | Hyunjung Lee | Process for preparing a non-conductive substrate for electroplating |
JP4783954B2 (ja) * | 2004-06-21 | 2011-09-28 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
US20060035016A1 (en) * | 2004-08-11 | 2006-02-16 | Chandra Tiwari | Electroless metal deposition methods |
US7214304B2 (en) * | 2004-10-13 | 2007-05-08 | Hyunjung Lee | Process for preparing a non-conductive substrate for electroplating |
JP4806808B2 (ja) * | 2005-07-05 | 2011-11-02 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
TWI298520B (en) * | 2005-09-12 | 2008-07-01 | Ind Tech Res Inst | Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes |
CN100431106C (zh) * | 2005-09-26 | 2008-11-05 | 财团法人工业技术研究院 | 形成纳米碳管与金属复合材料的电镀互连导线的方法 |
US7694416B2 (en) * | 2006-12-08 | 2010-04-13 | Nitto Denko Corporation | Producing method of wired circuit board |
US20100034965A1 (en) * | 2008-08-06 | 2010-02-11 | Retallick Richard C | Direct Metallization Process |
KR101537638B1 (ko) * | 2010-05-18 | 2015-07-17 | 삼성전자 주식회사 | 그라펜 박막을 이용한 수지의 도금 방법 |
JP5648588B2 (ja) * | 2011-06-03 | 2015-01-07 | 住友電気工業株式会社 | アルミニウム構造体の製造方法およびアルミニウム構造体 |
EP2634293B1 (de) * | 2012-03-02 | 2018-07-18 | Rohm and Haas Electronic Materials, L.L.C. | Verbundstoffe aus russschwarz und metall |
JP2015532665A (ja) | 2012-08-13 | 2015-11-12 | ロックウール インターナショナル アー/エス | 黒鉛被覆繊維 |
US10986738B2 (en) | 2018-05-08 | 2021-04-20 | Macdermid Enthone Inc. | Carbon-based direct plating process |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US409096A (en) * | 1889-08-13 | Water-proof and fire-proof material for roofing | ||
US1037469A (en) * | 1911-08-02 | 1912-09-03 | Hyman Eli Goldberg | Process of metallizing electrotype-molds. |
US1352331A (en) * | 1917-11-21 | 1920-09-07 | Unno Umikichi | Process of electroplating non-conducting substances with copper |
GB493485A (en) * | 1937-01-13 | 1938-10-10 | Langbein Pfanhauser Werke Ag | Process for the electrolytic production of metal coatings on objects with a non-conducting surface |
US3163588A (en) * | 1955-02-14 | 1964-12-29 | Technograph Printed Electronic | Method of interconnecting pathway patterns of printed circuit products |
US3099608A (en) * | 1959-12-30 | 1963-07-30 | Ibm | Method of electroplating on a dielectric base |
US4035265A (en) * | 1969-04-18 | 1977-07-12 | The Research Association Of British, Paint, Colour & Varnish Manufacturers | Paint compositions |
US3715265A (en) * | 1969-09-03 | 1973-02-06 | Mc Donnell Douglas Corp | Composite thermal insulation |
US4090984A (en) * | 1977-02-28 | 1978-05-23 | Owens-Corning Fiberglas Corporation | Semi-conductive coating for glass fibers |
US4239794A (en) * | 1978-08-04 | 1980-12-16 | Ludlow Corporation | Process of dispersing electro-conductive carbon black and web product made thereby |
US4276278A (en) * | 1979-01-29 | 1981-06-30 | Union Carbide Corporation | Spin size and thermosetting aid for pitch fibers |
US4205974A (en) † | 1979-05-09 | 1980-06-03 | Ppg Industries, Inc. | Glass welding using aqueous colloidal graphite with improved wetting properties |
US4581301A (en) * | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
US4619714A (en) * | 1984-08-06 | 1986-10-28 | The Regents Of The University Of California | Controlled rolling process for dual phase steels and application to rod, wire, sheet and other shapes |
US4619741A (en) † | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
US4631117A (en) * | 1985-05-06 | 1986-12-23 | Olin Hunt Specialty Products Inc. | Electroless plating process |
US4684560A (en) * | 1985-11-29 | 1987-08-04 | Olin Hunt Specialty Products, Inc. | Printed wiring board having carbon black-coated through holes |
US4724005A (en) * | 1985-11-29 | 1988-02-09 | Olin Hunt Specialty Products Inc. | Liquid carbon black dispersion |
US4622107A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4718993A (en) * | 1987-05-29 | 1988-01-12 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4897167A (en) * | 1988-08-19 | 1990-01-30 | Gas Research Institute | Electrochemical reduction of CO2 to CH4 and C2 H4 |
US5155798A (en) * | 1989-02-21 | 1992-10-13 | Glenro, Inc. | Quick-response quartz tube infra-red heater |
US4874477A (en) * | 1989-04-21 | 1989-10-17 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4897164A (en) * | 1989-04-24 | 1990-01-30 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
US4994153A (en) * | 1990-06-28 | 1991-02-19 | Olin Corporation | Process for preparing nonconductive substrates |
EP0581816A1 (de) | 1991-04-22 | 1994-02-09 | ATOTECH Deutschland GmbH | Verfahren zur selektiven beschichtung von nichtleitern mit kohlenstoff-partikeln und die verwendung von kupferhaltigen lösungen im verfahren |
-
1991
- 1991-08-19 US US07/747,066 patent/US5139642A/en not_active Ceased
-
1992
- 1992-03-16 DE DE69210818T patent/DE69210818T3/de not_active Expired - Lifetime
- 1992-03-16 CA CA002103137A patent/CA2103137A1/en not_active Abandoned
- 1992-03-16 AU AU20016/92A patent/AU2001692A/en not_active Abandoned
- 1992-03-16 WO PCT/US1992/002063 patent/WO1992019794A1/en active IP Right Grant
- 1992-03-16 JP JP04511806A patent/JP3135124B2/ja not_active Expired - Lifetime
- 1992-03-16 EP EP92915309A patent/EP0583426B2/de not_active Expired - Lifetime
-
1999
- 1999-02-22 US US09/255,491 patent/USRE37765E1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU2001692A (en) | 1992-12-21 |
EP0583426A4 (de) | 1994-10-12 |
EP0583426A1 (de) | 1994-02-23 |
DE69210818T3 (de) | 2000-11-16 |
DE69210818D1 (de) | 1996-06-20 |
EP0583426B2 (de) | 2000-03-29 |
JPH06507449A (ja) | 1994-08-25 |
USRE37765E1 (en) | 2002-06-25 |
EP0583426B1 (de) | 1996-05-15 |
JP3135124B2 (ja) | 2001-02-13 |
US5139642A (en) | 1992-08-18 |
CA2103137A1 (en) | 1992-11-02 |
WO1992019794A1 (en) | 1992-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings |