DE69210818D1 - Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattieren - Google Patents

Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattieren

Info

Publication number
DE69210818D1
DE69210818D1 DE69210818T DE69210818T DE69210818D1 DE 69210818 D1 DE69210818 D1 DE 69210818D1 DE 69210818 T DE69210818 T DE 69210818T DE 69210818 T DE69210818 T DE 69210818T DE 69210818 D1 DE69210818 D1 DE 69210818D1
Authority
DE
Germany
Prior art keywords
electroplating
improved method
conductive substrates
preparing non
preparing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69210818T
Other languages
English (en)
Other versions
DE69210818T3 (de
DE69210818T2 (de
Inventor
Catherine Randolph
Barry Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27105399&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69210818(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of DE69210818D1 publication Critical patent/DE69210818D1/de
Application granted granted Critical
Publication of DE69210818T2 publication Critical patent/DE69210818T2/de
Publication of DE69210818T3 publication Critical patent/DE69210818T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
DE69210818T 1991-05-01 1992-03-16 Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattieren Expired - Lifetime DE69210818T3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US69451791A 1991-05-01 1991-05-01
US07/747,066 US5139642A (en) 1991-05-01 1991-08-19 Process for preparing a nonconductive substrate for electroplating
PCT/US1992/002063 WO1992019794A1 (en) 1991-05-01 1992-03-16 Improved process for preparing a nonconductive substrate for electroplating

Publications (3)

Publication Number Publication Date
DE69210818D1 true DE69210818D1 (de) 1996-06-20
DE69210818T2 DE69210818T2 (de) 1996-10-31
DE69210818T3 DE69210818T3 (de) 2000-11-16

Family

ID=27105399

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210818T Expired - Lifetime DE69210818T3 (de) 1991-05-01 1992-03-16 Verbessertes verfahren zur vorbereitung nichtleitender substrate für das elektroplattieren

Country Status (7)

Country Link
US (2) US5139642A (de)
EP (1) EP0583426B2 (de)
JP (1) JP3135124B2 (de)
AU (1) AU2001692A (de)
CA (1) CA2103137A1 (de)
DE (1) DE69210818T3 (de)
WO (1) WO1992019794A1 (de)

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US5725807A (en) 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
US6171468B1 (en) 1993-05-17 2001-01-09 Electrochemicals Inc. Direct metallization process
US5389270A (en) * 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating
US5690805A (en) * 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
US6303181B1 (en) * 1993-05-17 2001-10-16 Electrochemicals Inc. Direct metallization process employing a cationic conditioner and a binder
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5536386A (en) * 1995-02-10 1996-07-16 Macdermid, Incorporated Process for preparing a non-conductive substrate for electroplating
US6195883B1 (en) * 1998-03-25 2001-03-06 International Business Machines Corporation Full additive process with filled plated through holes
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
DE69732521T2 (de) * 1996-01-29 2006-01-12 Electrochemicals Inc., Maple Plain Ultraschallverwendung zum mischen von behandlungszusammensetzungen für durchgehenden löcher
US5674372A (en) * 1996-09-24 1997-10-07 Mac Dermid, Incorporated Process for preparing a non-conductive substrate for electroplating
WO1998040538A2 (de) * 1997-03-13 1998-09-17 Besenhard Juergen Otto Verfahren zum elektrolytischen abscheiden einer metallschicht mit glatter oberfläche auf einem substrat unter verwendung ener graphitdispersion
DE19731186C2 (de) * 1997-07-10 2000-08-03 Atotech Deutschland Gmbh Feststofffreie Vorbehandlungslösung für elektrisch nichtleitende Oberflächen sowie Verfahren zur Herstellung der Lösung und deren Verwendung
GB2332209A (en) * 1997-12-09 1999-06-16 Devex Sa Electroplating involving the use of a preliminary coating
US6440331B1 (en) 1999-06-03 2002-08-27 Electrochemicals Inc. Aqueous carbon composition and method for coating a non conductive substrate
US6212769B1 (en) * 1999-06-29 2001-04-10 International Business Machines Corporation Process for manufacturing a printed wiring board
WO2001032964A1 (fr) * 1999-11-01 2001-05-10 Jsr Corporation Dispersion aqueuse pour former une couche conductrice, couche conductrice, composant electronique, carte de circuit imprime et son procede de fabrication, et carte a circuit imprime multicouche et son procede de fabrication
US6375731B1 (en) 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
US6623787B2 (en) 2001-07-26 2003-09-23 Electrochemicals Inc. Method to improve the stability of dispersions of carbon
US7029529B2 (en) 2002-09-19 2006-04-18 Applied Materials, Inc. Method and apparatus for metallization of large area substrates
EP1450424B1 (de) * 2003-02-20 2007-12-05 JSR Corporation Elektrodenpastenzusammensetzung
US7063800B2 (en) * 2003-11-10 2006-06-20 Ying Ding Methods of cleaning copper surfaces in the manufacture of printed circuit boards
US7211204B2 (en) * 2003-12-12 2007-05-01 Electrochemicals, Inc. Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
FR2866329B1 (fr) 2004-02-12 2006-06-02 Saint Gobain Vetrotex Fils de verre conducteurs de l'electricite et structures comprenant de tels fils.
US7128820B2 (en) * 2004-03-11 2006-10-31 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
JP4783954B2 (ja) * 2004-06-21 2011-09-28 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
US20060035016A1 (en) * 2004-08-11 2006-02-16 Chandra Tiwari Electroless metal deposition methods
US7214304B2 (en) * 2004-10-13 2007-05-08 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
JP4806808B2 (ja) * 2005-07-05 2011-11-02 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
TWI298520B (en) * 2005-09-12 2008-07-01 Ind Tech Res Inst Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes
CN100431106C (zh) * 2005-09-26 2008-11-05 财团法人工业技术研究院 形成纳米碳管与金属复合材料的电镀互连导线的方法
US7694416B2 (en) * 2006-12-08 2010-04-13 Nitto Denko Corporation Producing method of wired circuit board
US20100034965A1 (en) * 2008-08-06 2010-02-11 Retallick Richard C Direct Metallization Process
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법
JP5648588B2 (ja) * 2011-06-03 2015-01-07 住友電気工業株式会社 アルミニウム構造体の製造方法およびアルミニウム構造体
EP2634293B1 (de) * 2012-03-02 2018-07-18 Rohm and Haas Electronic Materials, L.L.C. Verbundstoffe aus russschwarz und metall
KR20150044908A (ko) 2012-08-13 2015-04-27 락울 인터내셔날 에이/에스 그래파이트가 코팅된 섬유
US10986738B2 (en) 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

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US409096A (en) * 1889-08-13 Water-proof and fire-proof material for roofing
US1037469A (en) * 1911-08-02 1912-09-03 Hyman Eli Goldberg Process of metallizing electrotype-molds.
US1352331A (en) * 1917-11-21 1920-09-07 Unno Umikichi Process of electroplating non-conducting substances with copper
GB493485A (en) * 1937-01-13 1938-10-10 Langbein Pfanhauser Werke Ag Process for the electrolytic production of metal coatings on objects with a non-conducting surface
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US4035265A (en) * 1969-04-18 1977-07-12 The Research Association Of British, Paint, Colour & Varnish Manufacturers Paint compositions
US3715265A (en) * 1969-09-03 1973-02-06 Mc Donnell Douglas Corp Composite thermal insulation
US4090984A (en) * 1977-02-28 1978-05-23 Owens-Corning Fiberglas Corporation Semi-conductive coating for glass fibers
US4239794A (en) * 1978-08-04 1980-12-16 Ludlow Corporation Process of dispersing electro-conductive carbon black and web product made thereby
US4276278A (en) * 1979-01-29 1981-06-30 Union Carbide Corporation Spin size and thermosetting aid for pitch fibers
US4205974A (en) † 1979-05-09 1980-06-03 Ppg Industries, Inc. Glass welding using aqueous colloidal graphite with improved wetting properties
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
US4619714A (en) * 1984-08-06 1986-10-28 The Regents Of The University Of California Controlled rolling process for dual phase steels and application to rod, wire, sheet and other shapes
US4619741A (en) † 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4631117A (en) * 1985-05-06 1986-12-23 Olin Hunt Specialty Products Inc. Electroless plating process
US4684560A (en) * 1985-11-29 1987-08-04 Olin Hunt Specialty Products, Inc. Printed wiring board having carbon black-coated through holes
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4622107A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4622108A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products, Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4718993A (en) * 1987-05-29 1988-01-12 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4897167A (en) * 1988-08-19 1990-01-30 Gas Research Institute Electrochemical reduction of CO2 to CH4 and C2 H4
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US4874477A (en) * 1989-04-21 1989-10-17 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
US4994153A (en) * 1990-06-28 1991-02-19 Olin Corporation Process for preparing nonconductive substrates
WO1992019092A1 (de) 1991-04-22 1992-10-29 Atotech Deutschland Gmbh Verfahren zur selektiven beschichtung von nichtleitern mit kohlenstoff-partikeln und die verwendung von kupferhaltigen lösungen im verfahren

Also Published As

Publication number Publication date
EP0583426B2 (de) 2000-03-29
WO1992019794A1 (en) 1992-11-12
EP0583426B1 (de) 1996-05-15
JPH06507449A (ja) 1994-08-25
EP0583426A1 (de) 1994-02-23
EP0583426A4 (de) 1994-10-12
DE69210818T3 (de) 2000-11-16
US5139642A (en) 1992-08-18
USRE37765E1 (en) 2002-06-25
DE69210818T2 (de) 1996-10-31
JP3135124B2 (ja) 2001-02-13
CA2103137A1 (en) 1992-11-02
AU2001692A (en) 1992-12-21

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings