DE69206579T2 - Verfahren zur Herstellung einer elektrischen Verbindung für eine integrierte Schaltung. - Google Patents
Verfahren zur Herstellung einer elektrischen Verbindung für eine integrierte Schaltung.Info
- Publication number
- DE69206579T2 DE69206579T2 DE69206579T DE69206579T DE69206579T2 DE 69206579 T2 DE69206579 T2 DE 69206579T2 DE 69206579 T DE69206579 T DE 69206579T DE 69206579 T DE69206579 T DE 69206579T DE 69206579 T2 DE69206579 T2 DE 69206579T2
- Authority
- DE
- Germany
- Prior art keywords
- making
- integrated circuit
- electrical connection
- electrical
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01044—Ruthenium [Ru]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/783,468 US5281772A (en) | 1991-10-28 | 1991-10-28 | Electrical connector having energy-formed solder stops and methods of making and using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69206579D1 DE69206579D1 (de) | 1996-01-18 |
DE69206579T2 true DE69206579T2 (de) | 1996-05-02 |
Family
ID=25129343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69206579T Expired - Lifetime DE69206579T2 (de) | 1991-10-28 | 1992-09-15 | Verfahren zur Herstellung einer elektrischen Verbindung für eine integrierte Schaltung. |
Country Status (3)
Country | Link |
---|---|
US (2) | US5281772A (de) |
EP (1) | EP0540070B1 (de) |
DE (1) | DE69206579T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3007497B2 (ja) * | 1992-11-11 | 2000-02-07 | 三菱電機株式会社 | 半導体集積回路装置、その製造方法、及びその実装方法 |
US5400950A (en) * | 1994-02-22 | 1995-03-28 | Delco Electronics Corporation | Method for controlling solder bump height for flip chip integrated circuit devices |
TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US20020033411A1 (en) * | 2000-09-20 | 2002-03-21 | Peterson Michael J. | Method and apparatus for flex circuit reflow attachment |
US6437669B1 (en) * | 2000-09-29 | 2002-08-20 | Applied Micro Circuits Corporation | Microwave to millimeter wave frequency substrate interface |
SE0202288D0 (sv) * | 2002-07-22 | 2002-07-22 | St Jude Medical | A heart stimulator |
TWI221343B (en) * | 2003-10-21 | 2004-09-21 | Advanced Semiconductor Eng | Wafer structure for preventing contamination of bond pads during SMT process and process for the same |
US7172438B2 (en) * | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
US20060196857A1 (en) * | 2005-03-03 | 2006-09-07 | Samtec, Inc. | Methods of manufacturing electrical contacts having solder stops |
JP5145729B2 (ja) * | 2007-02-26 | 2013-02-20 | 富士電機株式会社 | 半田接合方法およびそれを用いた半導体装置の製造方法 |
JP5017472B1 (ja) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | 電子機器 |
JP5479406B2 (ja) * | 2011-06-30 | 2014-04-23 | 日本航空電子工業株式会社 | コネクタ |
US10076800B2 (en) | 2015-11-30 | 2018-09-18 | Cree Fayetteville, Inc. | Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly |
US20230010770A1 (en) * | 2021-07-09 | 2023-01-12 | Cree, Inc. | High Performance Semiconductor Device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3405224A (en) * | 1966-04-20 | 1968-10-08 | Nippon Electric Co | Sealed enclosure for electronic device |
US3801366A (en) * | 1971-02-16 | 1974-04-02 | J Lemelson | Method of making an electrical circuit |
US4554732A (en) * | 1982-02-16 | 1985-11-26 | General Electric Company | High reliability electrical components |
JPS58207699A (ja) * | 1982-05-28 | 1983-12-03 | 株式会社日立製作所 | 配線回路基板の製造方法 |
JPS59106140A (ja) * | 1982-12-10 | 1984-06-19 | Matsushita Electronics Corp | 半導体装置 |
AT389793B (de) * | 1986-03-25 | 1990-01-25 | Philips Nv | Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten |
JPH0698506B2 (ja) * | 1986-12-08 | 1994-12-07 | トヨタ自動車株式会社 | 金属基体上への分散合金層の形成方法 |
US4779339A (en) * | 1987-05-06 | 1988-10-25 | Nippon Cmk Corporation | Method of producing printed circuit boards |
US4931323A (en) * | 1987-12-10 | 1990-06-05 | Texas Instruments Incorporated | Thick film copper conductor patterning by laser |
JPH0728128B2 (ja) * | 1988-03-11 | 1995-03-29 | 松下電器産業株式会社 | セラミック多層配線基板とその製造方法 |
US4847003A (en) * | 1988-04-04 | 1989-07-11 | Delco Electronics Corporation | Electrical conductors |
US4859808A (en) * | 1988-06-28 | 1989-08-22 | Delco Electronics Corporation | Electrical conductor having unique solder dam configuration |
US4959751A (en) * | 1988-08-16 | 1990-09-25 | Delco Electronics Corporation | Ceramic hybrid integrated circuit having surface mount device solder stress reduction |
JPH02187045A (ja) * | 1989-01-13 | 1990-07-23 | Sharp Corp | フェイスダウンボンディング用パッドの形成方法 |
JPH02228050A (ja) * | 1989-02-28 | 1990-09-11 | Hitachi Ltd | 回路基板とその製法および該基板を用いた電子回路装置 |
US5041901A (en) * | 1989-05-10 | 1991-08-20 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
IT1233008B (it) * | 1989-09-21 | 1992-03-14 | Sgs Thomson Microelectronics | Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici |
JP2678804B2 (ja) * | 1990-04-06 | 1997-11-19 | トヨタ自動車株式会社 | 鉄合金基材上に純Cu肉盛層を形成する方法 |
US5178658A (en) * | 1991-09-17 | 1993-01-12 | The Charles Stark Draper Laboratory, Inc. | Method for forming an optical waveguide by selective volatization |
US5281684A (en) * | 1992-04-30 | 1994-01-25 | Motorola, Inc. | Solder bumping of integrated circuit die |
-
1991
- 1991-10-28 US US07/783,468 patent/US5281772A/en not_active Expired - Lifetime
-
1992
- 1992-09-15 EP EP92202815A patent/EP0540070B1/de not_active Expired - Lifetime
- 1992-09-15 DE DE69206579T patent/DE69206579T2/de not_active Expired - Lifetime
-
1993
- 1993-02-05 US US08/013,851 patent/US5334422A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0540070A1 (de) | 1993-05-05 |
EP0540070B1 (de) | 1995-12-06 |
DE69206579D1 (de) | 1996-01-18 |
US5334422A (en) | 1994-08-02 |
US5281772A (en) | 1994-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: DELPHI TECHNOLOGIES, INC., TROY, MICH., US |