DE69203144D1 - Verfahren zur Lokalpassivierung eines Substrates mit einer amorphen wasserstoffhaltigen Kohlenstoffschicht und Verfahren zur Herstellung von Dünnschicht-Transistoren auf diesem passivierten Substrat. - Google Patents
Verfahren zur Lokalpassivierung eines Substrates mit einer amorphen wasserstoffhaltigen Kohlenstoffschicht und Verfahren zur Herstellung von Dünnschicht-Transistoren auf diesem passivierten Substrat.Info
- Publication number
- DE69203144D1 DE69203144D1 DE69203144T DE69203144T DE69203144D1 DE 69203144 D1 DE69203144 D1 DE 69203144D1 DE 69203144 T DE69203144 T DE 69203144T DE 69203144 T DE69203144 T DE 69203144T DE 69203144 D1 DE69203144 D1 DE 69203144D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- passivating
- locally
- film transistors
- carbon layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title 1
- 229910052799 carbon Inorganic materials 0.000 title 1
- 229910052739 hydrogen Inorganic materials 0.000 title 1
- 239000001257 hydrogen Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78636—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with supplementary region or layer for improving the flatness of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02115—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/10—Lift-off masking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/15—Silicon on sapphire SOS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/958—Passivation layer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9104994A FR2675947A1 (fr) | 1991-04-23 | 1991-04-23 | Procede de passivation locale d'un substrat par une couche de carbone amorphe hydrogene et procede de fabrication de transistors en couches minces sur ce substrat passive. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69203144D1 true DE69203144D1 (de) | 1995-08-03 |
DE69203144T2 DE69203144T2 (de) | 1996-02-15 |
Family
ID=9412160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69203144T Expired - Fee Related DE69203144T2 (de) | 1991-04-23 | 1992-04-22 | Verfahren zur Lokalpassivierung eines Substrates mit einer amorphen wasserstoffhaltigen Kohlenstoffschicht und Verfahren zur Herstellung von Dünnschicht-Transistoren auf diesem passivierten Substrat. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5250451A (de) |
EP (1) | EP0511096B1 (de) |
JP (1) | JPH07183524A (de) |
DE (1) | DE69203144T2 (de) |
FR (1) | FR2675947A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5536193A (en) | 1991-11-07 | 1996-07-16 | Microelectronics And Computer Technology Corporation | Method of making wide band gap field emitter |
US5600200A (en) | 1992-03-16 | 1997-02-04 | Microelectronics And Computer Technology Corporation | Wire-mesh cathode |
US5543684A (en) | 1992-03-16 | 1996-08-06 | Microelectronics And Computer Technology Corporation | Flat panel display based on diamond thin films |
US5763997A (en) | 1992-03-16 | 1998-06-09 | Si Diamond Technology, Inc. | Field emission display device |
US5679043A (en) | 1992-03-16 | 1997-10-21 | Microelectronics And Computer Technology Corporation | Method of making a field emitter |
US5675216A (en) | 1992-03-16 | 1997-10-07 | Microelectronics And Computer Technololgy Corp. | Amorphic diamond film flat field emission cathode |
US5449970A (en) | 1992-03-16 | 1995-09-12 | Microelectronics And Computer Technology Corporation | Diode structure flat panel display |
US6127773A (en) | 1992-03-16 | 2000-10-03 | Si Diamond Technology, Inc. | Amorphic diamond film flat field emission cathode |
WO1995012835A1 (en) | 1993-11-04 | 1995-05-11 | Microelectronics And Computer Technology Corporation | Methods for fabricating flat panel display systems and components |
FR2719416B1 (fr) * | 1994-04-29 | 1996-07-05 | Thomson Lcd | Procédé de passivation des flancs d'un composant semiconducteur à couches minces. |
US6204834B1 (en) | 1994-08-17 | 2001-03-20 | Si Diamond Technology, Inc. | System and method for achieving uniform screen brightness within a matrix display |
US5531880A (en) * | 1994-09-13 | 1996-07-02 | Microelectronics And Computer Technology Corporation | Method for producing thin, uniform powder phosphor for display screens |
JPH08160405A (ja) * | 1994-12-09 | 1996-06-21 | Seiko Instr Inc | 表示装置及びその製造方法 |
US6296740B1 (en) | 1995-04-24 | 2001-10-02 | Si Diamond Technology, Inc. | Pretreatment process for a surface texturing process |
US5628659A (en) * | 1995-04-24 | 1997-05-13 | Microelectronics And Computer Corporation | Method of making a field emission electron source with random micro-tip structures |
US5736448A (en) * | 1995-12-04 | 1998-04-07 | General Electric Company | Fabrication method for thin film capacitors |
JPH10268360A (ja) | 1997-03-26 | 1998-10-09 | Semiconductor Energy Lab Co Ltd | 表示装置 |
US6927826B2 (en) * | 1997-03-26 | 2005-08-09 | Semiconductor Energy Labaratory Co., Ltd. | Display device |
US5874745A (en) * | 1997-08-05 | 1999-02-23 | International Business Machines Corporation | Thin film transistor with carbonaceous gate dielectric |
US5976396A (en) * | 1998-02-10 | 1999-11-02 | Feldman Technology Corporation | Method for etching |
JPH11307782A (ja) | 1998-04-24 | 1999-11-05 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
US6417013B1 (en) | 1999-01-29 | 2002-07-09 | Plasma-Therm, Inc. | Morphed processing of semiconductor devices |
US6475836B1 (en) | 1999-03-29 | 2002-11-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US6995821B1 (en) * | 1999-04-23 | 2006-02-07 | International Business Machines Corporation | Methods of reducing unbalanced DC voltage between two electrodes of reflective liquid crystal display by thin film passivation |
DE102004002908B4 (de) * | 2004-01-20 | 2008-01-24 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterbauelements oder einer mikromechanischen Struktur |
US7867627B2 (en) * | 2004-12-13 | 2011-01-11 | Silcotek Corporation | Process for the modification of substrate surfaces through the deposition of amorphous silicon layers followed by surface functionalization with organic molecules and functionalized structures |
US7344928B2 (en) * | 2005-07-28 | 2008-03-18 | Palo Alto Research Center Incorporated | Patterned-print thin-film transistors with top gate geometry |
KR100880326B1 (ko) * | 2006-09-29 | 2009-01-28 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
US8440467B2 (en) * | 2007-09-28 | 2013-05-14 | William Marsh Rice University | Electronic switching, memory, and sensor devices from a discontinuous graphene and/or graphite carbon layer on dielectric materials |
US8623231B2 (en) * | 2008-06-11 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for etching an ultra thin film |
CN106319477A (zh) | 2009-10-27 | 2017-01-11 | 西尔科特克公司 | 化学气相沉积涂层、制品和方法 |
US10604660B2 (en) | 2010-10-05 | 2020-03-31 | Silcotek Corp. | Wear resistant coating, article, and method |
US9975143B2 (en) | 2013-05-14 | 2018-05-22 | Silcotek Corp. | Chemical vapor deposition functionalization |
US11292924B2 (en) | 2014-04-08 | 2022-04-05 | Silcotek Corp. | Thermal chemical vapor deposition coated article and process |
US9915001B2 (en) | 2014-09-03 | 2018-03-13 | Silcotek Corp. | Chemical vapor deposition process and coated article |
US10316408B2 (en) | 2014-12-12 | 2019-06-11 | Silcotek Corp. | Delivery device, manufacturing system and process of manufacturing |
US10876206B2 (en) | 2015-09-01 | 2020-12-29 | Silcotek Corp. | Thermal chemical vapor deposition coating |
US10323321B1 (en) | 2016-01-08 | 2019-06-18 | Silcotek Corp. | Thermal chemical vapor deposition process and coated article |
US10487403B2 (en) | 2016-12-13 | 2019-11-26 | Silcotek Corp | Fluoro-containing thermal chemical vapor deposition process and article |
WO2020252306A1 (en) | 2019-06-14 | 2020-12-17 | Silcotek Corp. | Nano-wire growth |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4517733A (en) * | 1981-01-06 | 1985-05-21 | Fuji Xerox Co., Ltd. | Process for fabricating thin film image pick-up element |
US4564997A (en) * | 1981-04-21 | 1986-01-21 | Nippon-Telegraph And Telephone Public Corporation | Semiconductor device and manufacturing process thereof |
JPS58119669A (ja) * | 1982-01-08 | 1983-07-16 | Seiko Epson Corp | 薄膜半導体装置の製造方法 |
JPS62154780A (ja) * | 1985-12-27 | 1987-07-09 | Toshiba Corp | イメ−ジセンサ |
US4972250A (en) * | 1987-03-02 | 1990-11-20 | Microwave Technology, Inc. | Protective coating useful as passivation layer for semiconductor devices |
JPH0824188B2 (ja) * | 1987-10-16 | 1996-03-06 | 富士通株式会社 | 薄膜トランジスタマトリクスパネルの製造方法 |
DE3809092A1 (de) * | 1988-03-18 | 1989-09-28 | Graetz Nokia Gmbh | Duennschichttransistor mit lichtschutz aus amorphem kohlenstoff und verfahren zur herstellung des lichtschutzes |
FR2640809B1 (fr) * | 1988-12-19 | 1993-10-22 | Chouan Yannick | Procede de gravure d'une couche d'oxyde metallique et depot simultane d'un film de polymere, application de ce procede a la fabrication d'un transistor |
GB2228745B (en) * | 1989-01-10 | 1993-09-08 | Kobe Steel Ltd | Process for the selective deposition of thin diamond film by gas phase synthesis |
ES2072321T3 (es) * | 1989-02-01 | 1995-07-16 | Siemens Ag | Capa de pasivado electroactiva. |
-
1991
- 1991-04-23 FR FR9104994A patent/FR2675947A1/fr active Granted
-
1992
- 1992-04-10 US US07/866,342 patent/US5250451A/en not_active Expired - Lifetime
- 1992-04-22 DE DE69203144T patent/DE69203144T2/de not_active Expired - Fee Related
- 1992-04-22 EP EP92401143A patent/EP0511096B1/de not_active Expired - Lifetime
- 1992-04-23 JP JP4129291A patent/JPH07183524A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69203144T2 (de) | 1996-02-15 |
JPH07183524A (ja) | 1995-07-21 |
EP0511096A1 (de) | 1992-10-28 |
US5250451A (en) | 1993-10-05 |
EP0511096B1 (de) | 1995-06-28 |
FR2675947B1 (de) | 1997-02-07 |
FR2675947A1 (fr) | 1992-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69203144T2 (de) | Verfahren zur Lokalpassivierung eines Substrates mit einer amorphen wasserstoffhaltigen Kohlenstoffschicht und Verfahren zur Herstellung von Dünnschicht-Transistoren auf diesem passivierten Substrat. | |
DE3875515D1 (de) | Substrat und verfahren zur herstellung eines substrates. | |
DE69316674D1 (de) | Verfahren und Vorrichtung zur Herstellung eines Flächenhaftverschlusselementes, das mit einer auf Substrat aufgebrachten Schicht, versehen ist | |
DE3788678D1 (de) | Vorrichtung und Verfahren zur Herstellung einer Schicht auf einem Substrat. | |
DE69633423D1 (de) | Verfahren zur Herstellung eines mit einer dünnen ferroelektrischen Schicht überdeckten Substrats | |
DE3578264D1 (de) | Verfahren zur herstellung eines hochwaermeleitenden substrates und kupferleiterblech verwendbar in diesem verfahren. | |
DE3579067D1 (de) | Verfahren zur beschichtung eines substrates mit thermoplastischen ttinten, und beschichtungszusammensetzung. | |
DE69512186D1 (de) | Ferroelektrische Dünnschicht, Substrat bedeckt mit einer ferroelektrischen Dünnschicht und Verfahren zur Herstellung einer ferroelektrischen Dünnschicht | |
DE69408725T2 (de) | Substrat mit lichtabschirmender Schicht, Verfahren zur Herstellung derselben sowie Flüssigkristallanzeige | |
DE69617070D1 (de) | Verfahren zur Herstellung einer hydrophilen Beschichtung auf einem Substrat, sowie Substrate, insbesondere medizinische Geräte, mit verschleissbeständigen Beschichtungen | |
DE68926361D1 (de) | Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck | |
DE654150T1 (de) | Flexodruckelement mit einer durch ir-bestrahlung ablativen schicht und verfahren zur herstellung einer flexodruckplatten. | |
DE68928643D1 (de) | Mit einer lichtdurchlässigen Phasenaustausch-Tinte bedrucktes Substrat und Verfahren zu seiner Herstellung | |
DE69226603T3 (de) | Mit einer Antireflexionszusammensetzung überzogenes Substrat und Verfahren zur Behandlung eines solchen Substrats. | |
DE69528409D1 (de) | Verfahren zur Herstellung von Löchern in einer dielektrischen Schicht mit niedriger Dielektrizitätskonstante auf einer Halbleitervorrichtung | |
DE69127582D1 (de) | Verfahren zur Herstellung eines Halbleitersubstrates und Verfahren zur Herstellung einer Halbleiteranordnung unter Verwendung dieses Substrates | |
DE59308760D1 (de) | Verfahren und Vorrichtung zur Herstellung metallischer Flächenelemente auf Substraten | |
DE69225881D1 (de) | Verfahren zur Herstellung eines Substrates vom SOI-Typ mit einer uniformen dünnen Silizium-Schicht | |
DE69628129D1 (de) | Dünne ferroelektrische Schicht, mit einer dünnen ferroelektrischen Schicht überdecktes Substrat, Anordnung mit einer Kondensatorstruktur und Verfahren zur Herstellung einer dünnen ferroelektrischen Schicht | |
ATA23486A (de) | Verbundwerkstoff aus polyvinglidenfluorid und aethylen-kohlenoxid-copolymer, verfahren zum ueberziehen eines substrates damit und verfahren zur herstellung eines verbundwerkstoffes daraus | |
DE69720401D1 (de) | Organisches Substrat mit lichtabsorbierender Antireflektionsschicht und Verfahren zu seiner Herstellung | |
ATA53996A (de) | Substrat mit einer polykristallinen diamantschicht und verfahren zu seiner herstellung | |
DE69128295D1 (de) | Verfahren zur Herstellung eines Dünnschicht-Halbleiterbauteils auf einem transparenten, isolierenden Substrat | |
DE59100300D1 (de) | Verfahren zum uebertragen eines dekors auf ein substrat sowie verwendung einer folie. | |
DE59406868D1 (de) | Verfahren zur Abscheidung einer Schicht auf einer Substratscheibe durch Sputtern durch Verwendung eines Kollimators |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |