DE69132442D1 - Verfahren und material zum bilden von texturierten dicken filmartigen mustern - Google Patents

Verfahren und material zum bilden von texturierten dicken filmartigen mustern

Info

Publication number
DE69132442D1
DE69132442D1 DE69132442T DE69132442T DE69132442D1 DE 69132442 D1 DE69132442 D1 DE 69132442D1 DE 69132442 T DE69132442 T DE 69132442T DE 69132442 T DE69132442 T DE 69132442T DE 69132442 D1 DE69132442 D1 DE 69132442D1
Authority
DE
Germany
Prior art keywords
patterns
thick film
forming textured
textured thick
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69132442T
Other languages
English (en)
Other versions
DE69132442T2 (de
Inventor
Yorihiko Sakai
Norikatsu Ono
Norikazu Mineo
Takeshi Matsumoto
Hideaki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1543190A external-priority patent/JP2862092B2/ja
Priority claimed from JP9092890A external-priority patent/JP2837226B2/ja
Priority claimed from JP41368290A external-priority patent/JP2843446B2/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of DE69132442D1 publication Critical patent/DE69132442D1/de
Application granted granted Critical
Publication of DE69132442T2 publication Critical patent/DE69132442T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
DE69132442T 1990-01-25 1991-01-25 Verfahren und material zum bilden von texturierten dicken filmartigen mustern Expired - Fee Related DE69132442T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1543190A JP2862092B2 (ja) 1990-01-25 1990-01-25 厚膜パターン形成方法
JP9092890A JP2837226B2 (ja) 1990-04-05 1990-04-05 厚膜パターン形成方法
JP41368290A JP2843446B2 (ja) 1990-12-25 1990-12-25 厚膜パターン形成方法及び厚膜パターン形成材料
PCT/JP1991/000080 WO1991011307A1 (en) 1990-01-25 1991-01-25 Method of and material for forming thick filmy pattern

Publications (2)

Publication Number Publication Date
DE69132442D1 true DE69132442D1 (de) 2000-11-16
DE69132442T2 DE69132442T2 (de) 2001-05-03

Family

ID=27281011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69132442T Expired - Fee Related DE69132442T2 (de) 1990-01-25 1991-01-25 Verfahren und material zum bilden von texturierten dicken filmartigen mustern

Country Status (4)

Country Link
US (3) US5580511A (de)
EP (1) EP0464224B1 (de)
DE (1) DE69132442T2 (de)
WO (1) WO1991011307A1 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69132442T2 (de) * 1990-01-25 2001-05-03 Dainippon Printing Co Ltd Verfahren und material zum bilden von texturierten dicken filmartigen mustern
KR0179404B1 (ko) * 1993-02-02 1999-05-15 모리시타 요이찌 세라믹기판과 그 제조방법
US5397518A (en) * 1993-04-16 1995-03-14 Texas Instruments Incorporated Process for forming ceramic pixel array and pixel array formed thereby
JP2924664B2 (ja) * 1994-09-28 1999-07-26 住友電気工業株式会社 微細セラミックス構造体の形成方法
US6265139B1 (en) * 1998-12-30 2001-07-24 Samsung Electro-Mechanics Co., Ltd. Method for fabricating piezoelectric/electrostrictive ceramic micro actuator using photolithography
US6843952B1 (en) 1999-03-25 2005-01-18 3M Innovative Properties Company Method of producing substrate for plasma display panel and mold used in the method
US6361735B1 (en) * 1999-09-01 2002-03-26 General Electric Company Composite ceramic article and method of making
US6878333B1 (en) 1999-09-13 2005-04-12 3M Innovative Properties Company Barrier rib formation on substrate for plasma display panels and mold therefor
US6933098B2 (en) 2000-01-11 2005-08-23 Sipix Imaging Inc. Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
US6930818B1 (en) 2000-03-03 2005-08-16 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US6672921B1 (en) * 2000-03-03 2004-01-06 Sipix Imaging, Inc. Manufacturing process for electrophoretic display
TW473759B (en) * 2000-02-18 2002-01-21 Acer Display Tech Inc Fabrication method for ribs of plasma display panel
US6788449B2 (en) * 2000-03-03 2004-09-07 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US6831770B2 (en) * 2000-03-03 2004-12-14 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US20070237962A1 (en) 2000-03-03 2007-10-11 Rong-Chang Liang Semi-finished display panels
US7408696B2 (en) 2000-03-03 2008-08-05 Sipix Imaging, Inc. Three-dimensional electrophoretic displays
US6833943B2 (en) 2000-03-03 2004-12-21 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US7052571B2 (en) * 2000-03-03 2006-05-30 Sipix Imaging, Inc. Electrophoretic display and process for its manufacture
US6885495B2 (en) * 2000-03-03 2005-04-26 Sipix Imaging Inc. Electrophoretic display with in-plane switching
US6947202B2 (en) * 2000-03-03 2005-09-20 Sipix Imaging, Inc. Electrophoretic display with sub relief structure for high contrast ratio and improved shear and/or compression resistance
US7233429B2 (en) * 2000-03-03 2007-06-19 Sipix Imaging, Inc. Electrophoretic display
US7557981B2 (en) * 2000-03-03 2009-07-07 Sipix Imaging, Inc. Electrophoretic display and process for its manufacture
US6865012B2 (en) 2000-03-03 2005-03-08 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US6829078B2 (en) 2000-03-03 2004-12-07 Sipix Imaging Inc. Electrophoretic display and novel process for its manufacture
US7158282B2 (en) 2000-03-03 2007-01-02 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US7715088B2 (en) 2000-03-03 2010-05-11 Sipix Imaging, Inc. Electrophoretic display
US6795138B2 (en) * 2001-01-11 2004-09-21 Sipix Imaging, Inc. Transmissive or reflective liquid crystal display and novel process for its manufacture
US8282762B2 (en) * 2001-01-11 2012-10-09 Sipix Imaging, Inc. Transmissive or reflective liquid crystal display and process for its manufacture
US6582890B2 (en) * 2001-03-05 2003-06-24 Sandia Corporation Multiple wavelength photolithography for preparing multilayer microstructures
TW527529B (en) * 2001-07-27 2003-04-11 Sipix Imaging Inc An improved electrophoretic display with color filters
TW539928B (en) 2001-08-20 2003-07-01 Sipix Imaging Inc An improved transflective electrophoretic display
TWI308231B (en) * 2001-08-28 2009-04-01 Sipix Imaging Inc Electrophoretic display
JP3754337B2 (ja) * 2001-09-28 2006-03-08 株式会社クラレ 樹脂成形品の製造方法、樹脂成形品及び金型の製造方法
NL1021264C2 (nl) * 2002-08-13 2004-02-17 Lionix B V Werkwijze voor het vervaardigen van een micropakking en micropakking vervaardigd volgens zo een werkwijze.
US8023071B2 (en) * 2002-11-25 2011-09-20 Sipix Imaging, Inc. Transmissive or reflective liquid crystal display
TWI297089B (en) * 2002-11-25 2008-05-21 Sipix Imaging Inc A composition for the preparation of microcups used in a liquid crystal display, a liquid crystal display comprising two or more layers of microcup array and process for its manufacture
KR100563366B1 (ko) * 2003-02-20 2006-03-22 삼성코닝 주식회사 무기 접착제 조성물
RU2243613C1 (ru) * 2003-07-16 2004-12-27 Гурович Борис Аронович Способ формирования объемной структуры
JP4647258B2 (ja) * 2004-07-29 2011-03-09 株式会社日立製作所 成形材料転写方法、基板構体
US7401403B2 (en) * 2004-12-20 2008-07-22 Palo Alto Research Center Incorporated Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
US20060235107A1 (en) * 2005-04-15 2006-10-19 3M Innovative Properties Company Method of reusing flexible mold and microstructure precursor composition
US7478791B2 (en) * 2005-04-15 2009-01-20 3M Innovative Properties Company Flexible mold comprising cured polymerizable resin composition
KR100690930B1 (ko) 2006-05-03 2007-03-09 한국기계연구원 깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법
KR100690929B1 (ko) 2006-05-03 2007-03-09 한국기계연구원 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법
KR101284943B1 (ko) * 2006-06-30 2013-07-10 엘지디스플레이 주식회사 몰드의 제조방법
JP4344954B2 (ja) * 2006-10-03 2009-10-14 セイコーエプソン株式会社 素子基板の製造方法
US7850813B2 (en) * 2007-07-17 2010-12-14 Kimoto Co., Ltd. Method for producing a functional member having no base material
TW201238013A (en) * 2011-03-11 2012-09-16 Cyntec Co Ltd Ceramic substrate and method for fabricating the same
JP5584241B2 (ja) * 2012-02-27 2014-09-03 株式会社東芝 半導体製造装置及び半導体デバイスの製造方法
US10270032B2 (en) * 2017-09-13 2019-04-23 Int Tech Co., Ltd. Light source and a manufacturing method therewith

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3870776A (en) * 1973-01-02 1975-03-11 Metalized Ceramics Corp Method for making ceramic-metal structures
US4119480A (en) * 1976-05-13 1978-10-10 Tokyo Shibaura Electric Co., Ltd. Method of manufacturing thick-film circuit devices
JPS5345290A (en) * 1976-10-05 1978-04-22 Koatsu Gas Kogyo Detecting element for smokes and gases
US4576850A (en) * 1978-07-20 1986-03-18 Minnesota Mining And Manufacturing Company Shaped plastic articles having replicated microstructure surfaces
DE3015356A1 (de) * 1980-04-22 1981-10-29 Robert Bosch Gmbh, 7000 Stuttgart Freitragende schichten sowie verfahren zur herstellung freitragender schichten, insbesondere fuer sensoren fuer brennkraftmaschinen
US4994215A (en) * 1980-08-04 1991-02-19 Fine Particle Technology Corp. Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits
US4336320A (en) * 1981-03-12 1982-06-22 Honeywell Inc. Process for dielectric stenciled microcircuits
JPS58209852A (ja) * 1982-05-31 1983-12-06 Futaba Corp 表示管の導体
US4555285A (en) * 1983-12-14 1985-11-26 International Business Machines Corporation Forming patterns in metallic or ceramic substrates
US4619804A (en) * 1985-04-15 1986-10-28 Eastman Kodak Company Fabricating optical record media
JP2823016B2 (ja) * 1986-12-25 1998-11-11 ソニー株式会社 透過型スクリーンの製造方法
JPH01108003A (ja) * 1987-10-21 1989-04-25 Tdk Corp セラミック生シートの製造方法及び装置
US5328816A (en) * 1988-09-13 1994-07-12 Canon Kabushiki Kaisha Process for producing optical recording medium
US5183597A (en) * 1989-02-10 1993-02-02 Minnesota Mining And Manufacturing Company Method of molding microstructure bearing composite plastic articles
US5814262A (en) * 1989-08-11 1998-09-29 Corning Incorporated Method for producing thin flexible sintered structures
DE69132442T2 (de) * 1990-01-25 2001-05-03 Dainippon Printing Co Ltd Verfahren und material zum bilden von texturierten dicken filmartigen mustern

Also Published As

Publication number Publication date
EP0464224B1 (de) 2000-10-11
US5580511A (en) 1996-12-03
US5814267A (en) 1998-09-29
WO1991011307A1 (en) 1991-08-08
DE69132442T2 (de) 2001-05-03
US6113836A (en) 2000-09-05
EP0464224A1 (de) 1992-01-08
EP0464224A4 (en) 1993-03-17

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee