DE69126596T2 - BiCMOS-Verfahren mit Bipolartransistoren mit geringem Basis-Rekombinationsstrom - Google Patents

BiCMOS-Verfahren mit Bipolartransistoren mit geringem Basis-Rekombinationsstrom

Info

Publication number
DE69126596T2
DE69126596T2 DE69126596T DE69126596T DE69126596T2 DE 69126596 T2 DE69126596 T2 DE 69126596T2 DE 69126596 T DE69126596 T DE 69126596T DE 69126596 T DE69126596 T DE 69126596T DE 69126596 T2 DE69126596 T2 DE 69126596T2
Authority
DE
Germany
Prior art keywords
bipolar transistors
low base
recombination current
base recombination
bicmos method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69126596T
Other languages
English (en)
Other versions
DE69126596D1 (de
Inventor
Paul C F Tong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Semiconductor Inc
Original Assignee
Samsung Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Semiconductor Inc filed Critical Samsung Semiconductor Inc
Application granted granted Critical
Publication of DE69126596D1 publication Critical patent/DE69126596D1/de
Publication of DE69126596T2 publication Critical patent/DE69126596T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743—Making of internal connections, substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248—Combination of bipolar and field-effect technology
    • H01L21/8249—Bipolar and MOS technology
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/009—Bi-MOS
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/01—Bipolar transistors-ion implantation
DE69126596T 1990-11-14 1991-08-13 BiCMOS-Verfahren mit Bipolartransistoren mit geringem Basis-Rekombinationsstrom Expired - Lifetime DE69126596T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61319190A 1990-11-14 1990-11-14

Publications (2)

Publication Number Publication Date
DE69126596D1 DE69126596D1 (de) 1997-07-24
DE69126596T2 true DE69126596T2 (de) 1997-10-02

Family

ID=24456251

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69126596T Expired - Lifetime DE69126596T2 (de) 1990-11-14 1991-08-13 BiCMOS-Verfahren mit Bipolartransistoren mit geringem Basis-Rekombinationsstrom
DE69133446T Expired - Lifetime DE69133446T2 (de) 1990-11-14 1991-08-13 BiCMOS-Verfahren mit Bipolartransistor mit geringem Basis-Rekombinationsstrom

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69133446T Expired - Lifetime DE69133446T2 (de) 1990-11-14 1991-08-13 BiCMOS-Verfahren mit Bipolartransistor mit geringem Basis-Rekombinationsstrom

Country Status (5)

Country Link
US (2) US5304501A (de)
EP (2) EP0486134B1 (de)
JP (1) JPH073813B2 (de)
KR (1) KR950010287B1 (de)
DE (2) DE69126596T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10008032A1 (de) * 2000-02-15 2001-09-13 Infineon Technologies Ag Verfahren zum Herstellen eines CMOS-kompatiblen Photosensors

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444004A (en) * 1994-04-13 1995-08-22 Winbond Electronics Corporation CMOS process compatible self-alignment lateral bipolar junction transistor
US5434096A (en) * 1994-10-05 1995-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Method to prevent silicide bubble in the VLSI process
JPH08172139A (ja) * 1994-12-19 1996-07-02 Sony Corp 半導体装置製造方法
TW389944B (en) * 1997-03-17 2000-05-11 United Microelectronics Corp Method for forming gate oxide layers with different thickness
US6251794B1 (en) * 1999-02-18 2001-06-26 Taiwan Semiconductor Manufacturing Company Method and apparatus with heat treatment for stripping photoresist to eliminate post-strip photoresist extrusion defects
US6245609B1 (en) * 1999-09-27 2001-06-12 Taiwan Semiconductor Manufacturing Company High voltage transistor using P+ buried layer
US6448124B1 (en) * 1999-11-12 2002-09-10 International Business Machines Corporation Method for epitaxial bipolar BiCMOS
US6483156B1 (en) * 2000-03-16 2002-11-19 International Business Machines Corporation Double planar gated SOI MOSFET structure
US7214593B2 (en) * 2001-02-01 2007-05-08 International Business Machines Corporation Passivation for improved bipolar yield
JP2004079953A (ja) * 2002-08-22 2004-03-11 Nec Electronics Corp 半導体装置の製造方法
US6780695B1 (en) * 2003-04-18 2004-08-24 International Business Machines Corporation BiCMOS integration scheme with raised extrinsic base
WO2012139633A1 (en) 2011-04-12 2012-10-18 X-Fab Semiconductor Foundries Ag Bipolar transistor with gate electrode over the emitter base junction
US10213745B2 (en) 2011-12-22 2019-02-26 Refine Technology, Llc Hollow fiber cartridges and components and methods of their construction
US9001530B2 (en) * 2012-06-29 2015-04-07 Finisar Corporation Integrated circuit with voltage conversion
CN109309006B (zh) * 2017-07-27 2021-10-15 中芯国际集成电路制造(上海)有限公司 半导体器件及其形成方法
CN108115277B (zh) * 2018-01-31 2020-07-07 湖南振邦氢能科技有限公司 一种金属双极板活性区激光焊接方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080267A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体集積回路装置の製造方法
JPH0628296B2 (ja) * 1985-10-17 1994-04-13 日本電気株式会社 半導体装置の製造方法
US4752589A (en) * 1985-12-17 1988-06-21 Siemens Aktiengesellschaft Process for the production of bipolar transistors and complementary MOS transistors on a common silicon substrate
JPS63133662A (ja) * 1986-11-26 1988-06-06 Nec Corp 半導体装置の製造方法
US4902640A (en) * 1987-04-17 1990-02-20 Tektronix, Inc. High speed double polycide bipolar/CMOS integrated circuit process
US5179031A (en) * 1988-01-19 1993-01-12 National Semiconductor Corporation Method of manufacturing a polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide
JPH0348457A (ja) * 1989-04-14 1991-03-01 Toshiba Corp 半導体装置およびその製造方法
JP3024143B2 (ja) * 1989-06-19 2000-03-21 ソニー株式会社 半導体装置の製法
JPH03198371A (ja) * 1989-12-27 1991-08-29 Oki Electric Ind Co Ltd 半導体装置の製造方法
US5104817A (en) * 1990-03-20 1992-04-14 Texas Instruments Incorporated Method of forming bipolar transistor with integral base emitter load resistor
US4987089A (en) * 1990-07-23 1991-01-22 Micron Technology, Inc. BiCMOS process and process for forming bipolar transistors on wafers also containing FETs

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10008032A1 (de) * 2000-02-15 2001-09-13 Infineon Technologies Ag Verfahren zum Herstellen eines CMOS-kompatiblen Photosensors
DE10008032B4 (de) * 2000-02-15 2004-03-04 Infineon Technologies Ag Verfahren zum Herstellen eines CMOS-kompatiblen Photosensors
DE10066181B4 (de) * 2000-02-15 2011-12-01 Infineon Technologies Ag Verfahren zum Herstellen eines Photosensors

Also Published As

Publication number Publication date
JPH073813B2 (ja) 1995-01-18
JPH04286154A (ja) 1992-10-12
KR950010287B1 (ko) 1995-09-12
EP0486134A1 (de) 1992-05-20
EP0768709A3 (de) 1998-08-26
DE69133446D1 (de) 2005-03-24
KR920010894A (ko) 1992-06-27
US5336625A (en) 1994-08-09
EP0768709B1 (de) 2005-02-16
EP0768709A2 (de) 1997-04-16
EP0486134B1 (de) 1997-06-18
US5304501A (en) 1994-04-19
DE69126596D1 (de) 1997-07-24
DE69133446T2 (de) 2006-02-09

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