DE69125573T2 - ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN - Google Patents

ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN

Info

Publication number
DE69125573T2
DE69125573T2 DE69125573T DE69125573T DE69125573T2 DE 69125573 T2 DE69125573 T2 DE 69125573T2 DE 69125573 T DE69125573 T DE 69125573T DE 69125573 T DE69125573 T DE 69125573T DE 69125573 T2 DE69125573 T2 DE 69125573T2
Authority
DE
Germany
Prior art keywords
bath
production
low concentrations
copper film
chlorine ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69125573T
Other languages
English (en)
Other versions
DE69125573D1 (de
Inventor
Sidney Clouser
Dino Difranco
Craig Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Gould Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Electronics Inc filed Critical Gould Electronics Inc
Publication of DE69125573D1 publication Critical patent/DE69125573D1/de
Application granted granted Critical
Publication of DE69125573T2 publication Critical patent/DE69125573T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
DE69125573T 1990-05-30 1991-05-24 ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN Expired - Lifetime DE69125573T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53145290A 1990-05-30 1990-05-30
PCT/US1991/003695 WO1991019024A1 (en) 1990-05-30 1991-05-24 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations

Publications (2)

Publication Number Publication Date
DE69125573D1 DE69125573D1 (de) 1997-05-15
DE69125573T2 true DE69125573T2 (de) 1997-07-17

Family

ID=24117700

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69125573T Expired - Lifetime DE69125573T2 (de) 1990-05-30 1991-05-24 ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN

Country Status (9)

Country Link
US (2) US5421985A (de)
EP (1) EP0485588B1 (de)
JP (2) JP3392414B2 (de)
KR (1) KR100275899B1 (de)
AT (1) ATE151474T1 (de)
AU (1) AU7952791A (de)
BR (1) BR9105776A (de)
DE (1) DE69125573T2 (de)
WO (1) WO1991019024A1 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
BR9406043A (pt) * 1993-04-19 1995-12-19 Magma Copper Co Processo para a produção de pó cobre metálico óxidos de cobre e folha de cobre
US5679232A (en) * 1993-04-19 1997-10-21 Electrocopper Products Limited Process for making wire
JP3709221B2 (ja) * 1994-10-06 2005-10-26 古河サーキットフォイル株式会社 銅箔の表面粗化処理方法
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
JP3053440B2 (ja) * 1996-08-23 2000-06-19 グールド エレクトロニクス インコーポレイテッド 高性能の可撓性積層体
KR19980024945A (ko) * 1996-09-26 1998-07-06 야마모토 히데키 범프 접점을 갖는 회로 기판의 제조 방법 및 그 방법에 사용되는 제트 분사형 도금 장치
JPH10330983A (ja) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US5908544A (en) * 1997-09-04 1999-06-01 Gould Electronics, Inc. Zinc-chromium stabilizer containing a hydrogen inhibiting additive
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
JP2001011685A (ja) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
JP3250994B2 (ja) * 1999-12-28 2002-01-28 三井金属鉱業株式会社 電解銅箔
AU2001268277A1 (en) * 2000-06-08 2001-12-17 World Properties Inc. Method of manufacturing circuit laminates
JP2002053993A (ja) * 2000-08-04 2002-02-19 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
WO2002049405A2 (en) 2000-08-15 2002-06-20 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
US20040247865A1 (en) * 2001-07-27 2004-12-09 Federico Pavan Electrolytic process for depositing a layer of copper on a steel wire
EP1327995A3 (de) * 2002-01-11 2005-10-12 Shipley Co. L.L.C. Wiederstandstruktur
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
JP4770272B2 (ja) * 2005-05-27 2011-09-14 凸版印刷株式会社 銅めっき浴の管理方法及び銅めっき被膜の製造方法
JP4770271B2 (ja) * 2005-05-27 2011-09-14 凸版印刷株式会社 銅めっき浴の管理方法及び銅めっき被膜の製造方法
JP2007100113A (ja) * 2005-09-30 2007-04-19 Meiko:Kk 銅めっき方法とそれに用いる塩素イオン電解除去装置
US8303792B1 (en) 2007-08-29 2012-11-06 Magnecomp Corporation High strength electrodeposited suspension conductors
CL2009000969A1 (es) * 2009-04-23 2009-07-17 Ingenieria Y Desarrollo Tecnologico S A Un sistema para superponer una corriente alterna a la corriente continua que alimenta las celdas electroliticas de un proceso de electrolisis de metales que comprende dos grupos de celdas con un punto comun de conexion electrica, dos fuentes de corriente continua, una para cada celda y un conversor de corriente bidireccional.
JP2011091114A (ja) * 2009-10-20 2011-05-06 Nitto Denko Corp 配線回路基板およびその製法
CN103221584B (zh) 2010-11-22 2016-01-06 三井金属矿业株式会社 表面处理铜箔
KR102048116B1 (ko) * 2011-07-13 2019-11-22 제이엑스금속주식회사 강도가 높고 또한 휨이 적은 전해 동박 및 그 제조 방법
WO2013065699A1 (ja) * 2011-10-31 2013-05-10 古河電気工業株式会社 高強度、高耐熱電解銅箔及びその製造方法
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP6067256B2 (ja) * 2012-06-27 2017-01-25 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
KR101571063B1 (ko) 2013-11-28 2015-11-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
KR101571060B1 (ko) 2013-11-28 2015-11-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
KR101633725B1 (ko) * 2014-05-13 2016-06-27 (주)피엔티 합금박 제조 장치
US9707738B1 (en) 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
JP6721547B2 (ja) * 2017-07-27 2020-07-15 ケイシーエフ テクノロジース カンパニー リミテッド 高い引張強度を有する電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法
TWI679314B (zh) * 2018-06-07 2019-12-11 國立中興大學 以單一電鍍槽製備銅箔生箔同時形成粗化毛面的方法及該銅箔生箔
HUP2200353A2 (en) * 2020-01-30 2022-11-28 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2475974A (en) * 1945-08-28 1949-07-12 Rca Corp Electrodeposition of copper
US2482354A (en) * 1946-07-06 1949-09-20 Rca Corp Copper plating solution
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
DE962489C (de) * 1954-02-10 1957-04-25 Dehydag Gmbh Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
US2876178A (en) * 1956-03-06 1959-03-03 Ewald H Mccoy Electrodepositing copper
US2859159A (en) * 1956-10-09 1958-11-04 Elechem Corp Bright copper plating bath containing mixtures of metal compounds
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3864227A (en) * 1973-06-20 1975-02-04 Amax Inc Method for the electrolytic refining of copper
JPS5233074A (en) * 1975-09-10 1977-03-12 Nippon Mining Co Surface treatment of printed circuit copper foil
JPS5853079B2 (ja) * 1976-03-15 1983-11-26 三井アナコンダ銅箔株式会社 銅箔の防錆方法
JPS5438053A (en) * 1977-08-29 1979-03-22 Mitsubishi Electric Corp Safety device for elevator cage
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
JPH0639155B2 (ja) * 1986-02-21 1994-05-25 名幸電子工業株式会社 銅張積層板の製造方法
US4781001A (en) * 1986-03-17 1988-11-01 Cyclops Corporation Continuous preset access housing
US4647345A (en) * 1986-06-05 1987-03-03 Olin Corporation Metallurgical structure control of electrodeposits using ultrasonic agitation
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
JPH0649958B2 (ja) * 1987-06-15 1994-06-29 日本電解株式会社 電解銅箔の製造方法
JPH0631461B2 (ja) * 1987-06-15 1994-04-27 日本電解株式会社 電解銅箔の製造方法
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
US5181770A (en) * 1989-04-19 1993-01-26 Olin Corporation Surface topography optimization through control of chloride concentration in electroformed copper foil
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5171417A (en) * 1989-09-13 1992-12-15 Gould Inc. Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same
JPH05233074A (ja) * 1992-02-25 1993-09-10 Dai Ichi Seiyaku Co Ltd ｐＨ制御方法及びその装置

Also Published As

Publication number Publication date
JP3392414B2 (ja) 2003-03-31
DE69125573D1 (de) 1997-05-15
EP0485588B1 (de) 1997-04-09
EP0485588A4 (en) 1993-03-31
EP0485588A1 (de) 1992-05-20
BR9105776A (pt) 1992-08-04
ATE151474T1 (de) 1997-04-15
WO1991019024A1 (en) 1991-12-12
KR920703881A (ko) 1992-12-18
JP2001247994A (ja) 2001-09-14
KR100275899B1 (ko) 2000-12-15
AU7952791A (en) 1991-12-31
US5454926A (en) 1995-10-03
US5421985A (en) 1995-06-06
JPH05502062A (ja) 1993-04-15

Similar Documents

Publication Publication Date Title
DE69125573D1 (de) ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN
DE69407726D1 (de) Elektroplattierte Kupferfolie und Verfahren zu deren Herstellung
DE69316407T2 (de) Metallschaum und Verfahren zu dessen Herstellung
ATE53864T1 (de) Verfahren zur elektrolytischen herstellung von hypochlorit in salzenthaltendem laufendem wasser und vorrichtung zur durchfuehrung dieses verfahrens.
DE69411332T2 (de) Verfahren zur Herstellung elektrisch abgeschiedener Kupferfolie unter Verwendung von Elektrolytlösungen, die kontrollierte Zusätze von Chloridionen und anorganischen Verunreinigungen enthalten
MY129010A (en) Manufacturing method of electrodeposited copper foil and electrodeposited copper foil
EP1065298A3 (de) Verfahren zur Herstellung elektrisch abgeschiedener Kupferfolie und Kupferfolie, durch elektrolytische Abscheidung hergestellt
ES541142A0 (es) Un procedimiento de obtencion de un metal por electrolisis de halogenuros
DE69801807D1 (de) Verfahren und vorrichtung zur elektrolytischen herstellung von chlor und deren verwendung
JPH02175894A (ja) スズ、スズ合金電気めっき方法及び同電気めっき装置
DE3687089T3 (de) Verfahren zur Herstellung einer Kupferfolie durch elektrolytische Abscheidung.
Sugino Preparation, properties and application of the lead peroxide electrode manufactured by a new method
US3493478A (en) Electrolytic preparation of perchlorates
KR930004500A (ko) 전기 도금 방법
US3374154A (en) Electroforming and electrodeposition of stress-free nickel from the sulfamate bath
MX9101156A (es) Eliminacion de defectos de pelicula debidos a la evolucion de hidrogeno durante el electrodeposito catodico
US3715286A (en) Electrorefined nickel of controlled size
JPS6020475B2 (ja) 高速電気メツキ浴とメツキ方法
JPS63307291A (ja) 高純度銅の製造方法
DE59302052D1 (de) Elektrolytisches Verfahren zur Gewinnung von Platin hoher Reinheit aus verunreinigtem Platin
JPH03122299A (ja) 海中電着構法における非電導性基体の陰電極化電着方法
SU632757A1 (ru) Расплав дл электрохимического лужени
JPS57210967A (en) Pretreatment of aluminum for plating
KR920005739A (ko) 피전착체(object)에 니켈-코발트 합금의 금속 피막을 전착시키는 방법 및 이에 사용된 전해질 용액
DE69001949T2 (de) Vorrichtung zur fortlaufenden Herstellung eines mehrwertigen Metalls durch Elektrolyse eines in einem Schmelzbad aufgelösten Halogenids.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GA-TEK,INC, EASTLAKE, OHIO, US

8327 Change in the person/name/address of the patent owner

Owner name: NIKKO MATERIALS USA INC., CHANDLER, ARIZ., US