DE69125550T2 - Messsystem zur Analyse von Lageabweichungen einer Platte in einem Plattenherstellungsverfahren und zum Liefern von geeigneten Informationen zur Anpassung der Plattenherstellungsverfahren - Google Patents

Messsystem zur Analyse von Lageabweichungen einer Platte in einem Plattenherstellungsverfahren und zum Liefern von geeigneten Informationen zur Anpassung der Plattenherstellungsverfahren

Info

Publication number
DE69125550T2
DE69125550T2 DE69125550T DE69125550T DE69125550T2 DE 69125550 T2 DE69125550 T2 DE 69125550T2 DE 69125550 T DE69125550 T DE 69125550T DE 69125550 T DE69125550 T DE 69125550T DE 69125550 T2 DE69125550 T2 DE 69125550T2
Authority
DE
Germany
Prior art keywords
plate
plate manufacturing
adapting
measuring system
suitable information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69125550T
Other languages
English (en)
Other versions
DE69125550D1 (de
Inventor
Hans Hugo Ammann
Kwokming James Cheng
Richard F Kovacs
Henry Baldwin Micks
Jamey Potechin
Everett Simons
Richard Charles Steines
John G Tetz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69125550D1 publication Critical patent/DE69125550D1/de
Publication of DE69125550T2 publication Critical patent/DE69125550T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
DE69125550T 1990-08-31 1991-08-22 Messsystem zur Analyse von Lageabweichungen einer Platte in einem Plattenherstellungsverfahren und zum Liefern von geeigneten Informationen zur Anpassung der Plattenherstellungsverfahren Expired - Fee Related DE69125550T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/576,304 US5206820A (en) 1990-08-31 1990-08-31 Metrology system for analyzing panel misregistration in a panel manufacturing process and providing appropriate information for adjusting panel manufacturing processes

Publications (2)

Publication Number Publication Date
DE69125550D1 DE69125550D1 (de) 1997-05-15
DE69125550T2 true DE69125550T2 (de) 1997-07-31

Family

ID=24303860

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69125550T Expired - Fee Related DE69125550T2 (de) 1990-08-31 1991-08-22 Messsystem zur Analyse von Lageabweichungen einer Platte in einem Plattenherstellungsverfahren und zum Liefern von geeigneten Informationen zur Anpassung der Plattenherstellungsverfahren

Country Status (4)

Country Link
US (1) US5206820A (de)
EP (1) EP0473363B1 (de)
JP (1) JP2824351B2 (de)
DE (1) DE69125550T2 (de)

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US5949901A (en) * 1996-03-21 1999-09-07 Nichani; Sanjay Semiconductor device image inspection utilizing image subtraction and threshold imaging
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US5960125A (en) * 1996-11-21 1999-09-28 Cognex Corporation Nonfeedback-based machine vision method for determining a calibration relationship between a camera and a moveable object
US5953130A (en) * 1997-01-06 1999-09-14 Cognex Corporation Machine vision methods and apparatus for machine vision illumination of an object
US6075881A (en) * 1997-03-18 2000-06-13 Cognex Corporation Machine vision methods for identifying collinear sets of points from an image
US5974169A (en) * 1997-03-20 1999-10-26 Cognex Corporation Machine vision methods for determining characteristics of an object using boundary points and bounding regions
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US6608647B1 (en) 1997-06-24 2003-08-19 Cognex Corporation Methods and apparatus for charge coupled device image acquisition with independent integration and readout
US5978080A (en) * 1997-09-25 1999-11-02 Cognex Corporation Machine vision methods using feedback to determine an orientation, pixel width and pixel height of a field of view
US6025854A (en) * 1997-12-31 2000-02-15 Cognex Corporation Method and apparatus for high speed image acquisition
US6236769B1 (en) 1998-01-28 2001-05-22 Cognex Corporation Machine vision systems and methods for morphological transformation of an image with zero or other uniform offsets
US6282328B1 (en) 1998-01-28 2001-08-28 Cognex Corporation Machine vision systems and methods for morphological transformation of an image with non-uniform offsets
US6215915B1 (en) 1998-02-20 2001-04-10 Cognex Corporation Image processing methods and apparatus for separable, general affine transformation of an image
US6381375B1 (en) 1998-02-20 2002-04-30 Cognex Corporation Methods and apparatus for generating a projection of an image
US6516092B1 (en) 1998-05-29 2003-02-04 Cognex Corporation Robust sub-model shape-finder
US6381366B1 (en) 1998-12-18 2002-04-30 Cognex Corporation Machine vision methods and system for boundary point-based comparison of patterns and images
US6687402B1 (en) 1998-12-18 2004-02-03 Cognex Corporation Machine vision methods and systems for boundary feature comparison of patterns and images
US6684402B1 (en) 1999-12-01 2004-01-27 Cognex Technology And Investment Corporation Control methods and apparatus for coupling multiple image acquisition devices to a digital data processor
US6748104B1 (en) 2000-03-24 2004-06-08 Cognex Corporation Methods and apparatus for machine vision inspection using single and multiple templates or patterns
JP4485667B2 (ja) * 2000-08-21 2010-06-23 パナソニック株式会社 部品実装装置のオフセット測定用基板及び部品実装装置のオフセット測定方法
US6581202B1 (en) * 2000-11-10 2003-06-17 Viasystems Group, Inc. System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture
US6804388B2 (en) * 2001-03-14 2004-10-12 Maniabarco, Inc. Method and apparatus of registering a printed circuit board
US7089160B2 (en) * 2002-01-08 2006-08-08 International Business Machines Corporation Model for modifying drill data to predict hole locations in a panel structure
DE60333597D1 (de) * 2002-12-10 2010-09-09 Chep Technology Pty Ltd Automatisierte palletteninspektion und -reparatur
US8111904B2 (en) * 2005-10-07 2012-02-07 Cognex Technology And Investment Corp. Methods and apparatus for practical 3D vision system
US8162584B2 (en) * 2006-08-23 2012-04-24 Cognex Corporation Method and apparatus for semiconductor wafer alignment
JP5303230B2 (ja) * 2008-09-29 2013-10-02 株式会社日立ハイテクノロジーズ 画像処理システム、及び走査型電子顕微鏡装置
JP6498564B2 (ja) * 2015-08-20 2019-04-10 日置電機株式会社 処理装置、基板検査装置、処理方法および基板検査方法
KR102253565B1 (ko) * 2017-10-22 2021-05-18 케이엘에이 코포레이션 이미징 오버레이 계측에서 오버레이 오정렬 오차 평가치의 이용
CN212936279U (zh) * 2020-07-08 2021-04-09 瑞声科技(新加坡)有限公司 用于lcp基板的内层板结构及lcp基板

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Also Published As

Publication number Publication date
US5206820A (en) 1993-04-27
JP2824351B2 (ja) 1998-11-11
EP0473363A3 (en) 1992-09-02
EP0473363A2 (de) 1992-03-04
DE69125550D1 (de) 1997-05-15
JPH04315557A (ja) 1992-11-06
EP0473363B1 (de) 1997-04-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee