DE69124822D1 - Lichtemittierende Halbleitervorrichtung mit Fresnel-Linse - Google Patents

Lichtemittierende Halbleitervorrichtung mit Fresnel-Linse

Info

Publication number
DE69124822D1
DE69124822D1 DE69124822T DE69124822T DE69124822D1 DE 69124822 D1 DE69124822 D1 DE 69124822D1 DE 69124822 T DE69124822 T DE 69124822T DE 69124822 T DE69124822 T DE 69124822T DE 69124822 D1 DE69124822 D1 DE 69124822D1
Authority
DE
Germany
Prior art keywords
light emitting
emitting device
semiconductor light
fresnel lens
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69124822T
Other languages
English (en)
Other versions
DE69124822T2 (de
Inventor
Ogata C O Omron Corporat Shiro
Koichi Imanaka
Hiroshi Goto
Yoshinori Ito
Kourou Kitajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Application granted granted Critical
Publication of DE69124822D1 publication Critical patent/DE69124822D1/de
Publication of DE69124822T2 publication Critical patent/DE69124822T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
DE69124822T 1990-04-27 1991-04-29 Lichtemittierende Halbleitervorrichtung mit Fresnel-Linse Expired - Fee Related DE69124822T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4639490 1990-04-27
JP11289290 1990-04-27
JP13155090 1990-05-22
JP8510090 1990-08-10

Publications (2)

Publication Number Publication Date
DE69124822D1 true DE69124822D1 (de) 1997-04-10
DE69124822T2 DE69124822T2 (de) 1997-10-09

Family

ID=27461866

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69124822T Expired - Fee Related DE69124822T2 (de) 1990-04-27 1991-04-29 Lichtemittierende Halbleitervorrichtung mit Fresnel-Linse

Country Status (4)

Country Link
US (1) US5296724A (de)
EP (1) EP0454174B1 (de)
AT (1) ATE149743T1 (de)
DE (1) DE69124822T2 (de)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335531A (ja) * 1992-05-27 1993-12-17 Sharp Corp 固体撮像装置
US5504350A (en) * 1992-08-12 1996-04-02 Spectra-Physics Scanning Systems, Inc. Lens configuration
US5270869A (en) * 1992-12-23 1993-12-14 Eastman Kodak Company Passively athermalized optical assembly incorporating laminate fiber compensation ring
JPH0837339A (ja) * 1994-07-21 1996-02-06 Nec Corp 反射光防止型半導体レーザダイオード装置
JP3318811B2 (ja) * 1994-12-29 2002-08-26 ソニー株式会社 半導体発光素子のパッケージ及びその製造方法
US5650868A (en) * 1995-06-07 1997-07-22 Compaq Computer Corporation Data transfer system
JPH095510A (ja) * 1995-06-21 1997-01-10 Olympus Optical Co Ltd 光学素子
US6256283B1 (en) * 1996-10-01 2001-07-03 Matsushita Electric Industrial Co., Ltd. Optical pickup having a common light beam path for passing either of a plurality of kinds of light beams
US6020632A (en) * 1997-02-26 2000-02-01 Motorola, Inc. Electronic component including an adjustable cap
US5952778A (en) * 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
US6037655A (en) * 1998-01-12 2000-03-14 Eastman Kodak Company Linear image sensor package assembly
US6134039A (en) * 1998-01-27 2000-10-17 Psc Scanning, Inc. Wavelength dependent thermally compensated optical system
DE19804059B4 (de) * 1998-02-03 2006-02-09 Robert Bosch Gmbh Vorrichtung zur optischen Distanzmessung
DE19829197C2 (de) * 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
DE19916573C2 (de) * 1999-04-13 2003-02-13 Infineon Technologies Ag Lasereinrichtung zur Emission und Kollimation eines Laserstrahls
FI116918B (fi) * 2000-12-13 2006-03-31 Modines Ltd Oy Säteenmuokkaaja
CN2457740Y (zh) * 2001-01-09 2001-10-31 台湾沛晶股份有限公司 集成电路晶片的构装
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
JP2003133627A (ja) * 2001-10-19 2003-05-09 Sharp Corp 半導体レーザ装置
US6903379B2 (en) * 2001-11-16 2005-06-07 Gelcore Llc GaN based LED lighting extraction efficiency using digital diffractive phase grating
JP2003163405A (ja) * 2001-11-26 2003-06-06 Sony Corp ２波長半導体レーザ素子およびそれに用いられる非点補正板ならびにその配置方法
KR100457380B1 (ko) * 2002-05-06 2004-11-16 삼성전기주식회사 광마우스용 칩 온 보드 리드 패키지 및 그에 사용되는렌즈커버
CN1653297B (zh) 2002-05-08 2010-09-29 佛森技术公司 高效固态光源及其使用和制造方法
CN1277271C (zh) * 2002-10-15 2006-09-27 夏普株式会社 激光拾取装置
EP1678442B8 (de) * 2003-10-31 2013-06-26 Phoseon Technology, Inc. LED-Lichtmodul und Herstellungsverfahren
WO2005043954A2 (en) * 2003-10-31 2005-05-12 Phoseon Technology, Inc. Series wiring of highly reliable light sources
FR2862140B1 (fr) * 2003-11-07 2006-02-24 Thales Sa Boite a lumiere a diodes electromuminescentes pour visualisations
JP2005217337A (ja) * 2004-02-02 2005-08-11 Matsushita Electric Ind Co Ltd 光学デバイス
TWI312583B (en) * 2004-03-18 2009-07-21 Phoseon Technology Inc Micro-reflectors on a substrate for high-density led array
TWI257718B (en) * 2004-03-18 2006-07-01 Phoseon Technology Inc Direct cooling of LEDs
US7816638B2 (en) * 2004-03-30 2010-10-19 Phoseon Technology, Inc. LED array having array-based LED detectors
US6987619B2 (en) * 2004-03-31 2006-01-17 General Electric Company Lens array package and fabrication method
ATE503963T1 (de) * 2004-04-12 2011-04-15 Phoseon Technology Inc Hochdichtes led-array
TWI302756B (en) * 2004-04-19 2008-11-01 Phoseon Technology Inc Imaging semiconductor structures using solid state illumination
EP1622205A3 (de) * 2004-07-29 2006-02-08 Schott AG Gehäuse für elektronische Bauteile, die kodierte optische Signale senden und/oder empfangen.
JP4800324B2 (ja) * 2004-12-30 2011-10-26 フォーセン テクノロジー インク 露光装置
US20060285332A1 (en) * 2005-06-15 2006-12-21 Goon Wooi K Compact LED package with reduced field angle
US7642527B2 (en) * 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
TWI302041B (en) * 2006-01-19 2008-10-11 Everlight Electronics Co Ltd Light emitting diode packaging structure
DE102006049178A1 (de) * 2006-10-18 2008-04-30 Sensopart Industriesensorik Gmbh Optoelektronische Sensorvorrichtung
DE102007048617A1 (de) * 2007-10-10 2009-04-16 Robert Bosch Gmbh Lasermodul
JP5079474B2 (ja) * 2007-11-29 2012-11-21 シャープ株式会社 キャップ部材およびそれを用いた半導体装置
JP2011065979A (ja) * 2009-08-18 2011-03-31 Sharp Corp 光源装置
US9385285B2 (en) 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
US8613530B2 (en) 2010-01-11 2013-12-24 General Electric Company Compact light-mixing LED light engine and white LED lamp with narrow beam and high CRI using same
US10782187B2 (en) * 2010-07-08 2020-09-22 Cvg Management Corporation Infrared temperature measurement and stabilization thereof
US9228902B2 (en) * 2010-07-08 2016-01-05 Cvg Management Corporation Infrared temperature measurement and stabilization thereof
DE102010034020A1 (de) * 2010-08-11 2012-02-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Oberflächenstruktur sowie Fresnel-Linse und Werkzeug zur Herstellung einer Oberflächenstruktur
GB201014053D0 (en) * 2010-08-23 2010-10-06 St Microelectronics Res & Dev Optical navigation device
EP2750181B1 (de) * 2011-08-22 2016-06-01 Kyocera Corporation Optische halbleitervorrichtung
WO2013080396A1 (ja) * 2011-11-30 2013-06-06 パナソニック株式会社 窒化物半導体発光装置
JP6076151B2 (ja) * 2012-12-06 2017-02-08 三菱電機株式会社 光モジュール及び光伝送方法
JP2014138046A (ja) * 2013-01-16 2014-07-28 Stanley Electric Co Ltd 半導体発光素子パッケージ固定構造
JP6373153B2 (ja) * 2014-10-09 2018-08-15 三菱電機株式会社 液晶表示装置
EP3252888A4 (de) * 2015-01-29 2018-09-05 Mitsubishi Electric Corporation Lichtquellenvorrichtung
JP6586656B2 (ja) * 2016-08-05 2019-10-09 サンテック株式会社 検出装置
JP6789514B2 (ja) * 2016-08-05 2020-11-25 サンテック株式会社 検出装置
US10473304B1 (en) 2016-10-04 2019-11-12 Lumileds Llc Reducing thermal sensitivity of a lighting arrangement
US9784617B1 (en) * 2017-02-01 2017-10-10 United States Of America, As Represented By The Secretary Of The Navy Tunable ultra-compact fresnel zone plate spectrometer
US10969560B2 (en) 2017-05-04 2021-04-06 Lightpath Technologies, Inc. Integrated optical assembly and manufacturing the same
US10681288B2 (en) * 2017-06-23 2020-06-09 Lite-On Technology Corporation Light emitting control system
JP6687008B2 (ja) 2017-11-30 2020-04-22 日亜化学工業株式会社 発光装置
JP7117138B2 (ja) * 2018-04-23 2022-08-12 スタンレー電気株式会社 レーザモジュール
KR20210157060A (ko) * 2020-06-19 2021-12-28 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 광의 진행 방향으로 열팽창을 촉진하는 광주사장치의 플랜지
CN114299826B (zh) * 2022-01-19 2023-12-26 深圳市奥视微科技有限公司 显示模组、显示设备及显示模组的光程调节方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178376C (nl) * 1978-06-19 1986-03-03 Philips Nv Koppelelement met een lichtbron en een lens.
NL7904283A (nl) * 1979-05-31 1980-12-02 Philips Nv Koppelelement met een lichtbron en en lensvormig element.
JPS58145169A (ja) * 1982-02-23 1983-08-29 Nec Corp 光半導体装置
JPS63155012A (ja) * 1986-12-19 1988-06-28 Toshiba Corp 非球面レンズの取付方法

Also Published As

Publication number Publication date
DE69124822T2 (de) 1997-10-09
EP0454174A1 (de) 1991-10-30
US5296724A (en) 1994-03-22
ATE149743T1 (de) 1997-03-15
EP0454174B1 (de) 1997-03-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee